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Patent Agency Ranking
公开(公告)号：US09095980B2
公开(公告)日：2015-08-04
申请号：US13776188
申请日：2013-02-25
Applicant: LuxVue Technology Corporation
Inventor： Dariusz Golda , John A. Higginson , Andreas Bibl , Paul Argus Parks , Stephen Paul Bathurst
CPC classification number: B25J11/00 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , H01L24/75 , H01L2224/7598
Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。
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公开(公告)号：US09308649B2
公开(公告)日：2016-04-12
申请号：US13776158
申请日：2013-02-25
Applicant: LuxVue Technology Corporation
Inventor： Dariusz Golda , John A. Higginson , Andreas Bibl , Paul Argus Parks , Stephen Paul Bathurst
CPC classification number: B25J9/1015 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , B25J17/0208 , H01L21/67144 , H01L21/67721 , H01L21/68 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L2224/75251 , H01L2224/75252 , H01L2224/75282 , H01L2224/7565 , H01L2224/75723 , H01L2224/75725 , H01L2224/75823 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/7598 , H01L2224/75984 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。
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公开(公告)号：US20140241844A1
公开(公告)日：2014-08-28
申请号：US13776188
申请日：2013-02-25
Applicant: LUXVUE TECHNOLOGY CORPORATION
Inventor： Dariusz Golda , John A. Higginson , Andreas Bibl , Paul Argus Parks , Stephen Paul Bathurst
CPC classification number: B25J11/00 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , H01L24/75 , H01L2224/7598
Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。
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公开(公告)号：US20160176045A1
公开(公告)日：2016-06-23
申请号：US15054977
申请日：2016-02-26
Applicant: LuxVue Technology Corporation
Inventor： Dariusz Golda , John A. Higginson , Andreas Bibl , Paul Argus Parks , Stephen Paul Bathurst
IPC: B25J9/10 , B25J15/00 , H01L23/00 , H01L21/677 , H01L21/68 , B25J7/00 , H01L21/683
CPC classification number: B25J9/1015 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , B25J17/0208 , H01L21/67144 , H01L21/67721 , H01L21/68 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L2224/75251 , H01L2224/75252 , H01L2224/75282 , H01L2224/7565 , H01L2224/75723 , H01L2224/75725 , H01L2224/75823 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/7598 , H01L2224/75984 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。
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公开(公告)号：US20140241843A1
公开(公告)日：2014-08-28
申请号：US13776158
申请日：2013-02-25
Applicant: LUXVUE TECHNOLOGY CORPORATION
Inventor： Dariusz Golda , John A. Higginson , Andreas Bibl , Paul Argus Parks , Stephen Paul Bathurst
CPC classification number: B25J9/1015 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , B25J17/0208 , H01L21/67144 , H01L21/67721 , H01L21/68 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L2224/75251 , H01L2224/75252 , H01L2224/75282 , H01L2224/7565 , H01L2224/75723 , H01L2224/75725 , H01L2224/75823 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/7598 , H01L2224/75984 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。
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