NON-VOLATILE MEMORY AND PROGRAM METHOD THEREOF

    公开(公告)号:US20200243121A1

    公开(公告)日:2020-07-30

    申请号:US16262770

    申请日:2019-01-30

    Abstract: A non-volatile memory and a program method thereof are provided. The program method includes: selecting a programmed word line, where the programmed word line has a plurality of segments respectively corresponding to a plurality of bit lines; providing a program voltage to a voltage receiving end of the programmed word line, and sequentially transmitting the program voltage to the segments; respectively providing a plurality of bit line voltages to the bit lines at a plurality of enable time points and turning on a string selection switch at a setting time point; and setting voltage values of the bit line voltages according to the segments corresponding to the bit lines, respectively, or setting the enable time points according to the segments corresponding to the bit lines, or setting the setting time point according to a voltage transmission delay of the programmed word line.

    Semiconductor structure
    3.
    发明授权

    公开(公告)号:US10886405B2

    公开(公告)日:2021-01-05

    申请号:US15371293

    申请日:2016-12-07

    Abstract: A semiconductor structure includes a first source/drain region, a second source/drain region, a channel doping region, a gate structure, a first well and a second well. The second source/drain region is disposed opposite to the first source/drain region. The channel doping region is disposed between the first source/drain region and the second source/drain region. The gate structure is disposed on the channel doping region. The first well has a first portion disposed under the first source/drain region. The second well is disposed opposite to the first well and separated from the second source/drain region. The first source/drain region, the second source/drain region and the channel doping region have a first conductive type. The first well and the second well have a second conductive type different from the first conductive type.

    MEMORY DEVICE
    5.
    发明申请

    公开(公告)号:US20250056816A1

    公开(公告)日:2025-02-13

    申请号:US18780515

    申请日:2024-07-23

    Abstract: A memory device includes a plurality of first peripheral circuits, a stack memory cell array and a first address circuit. The first peripheral circuits are disposed on a first chip, wherein the first chip has a plurality of first pads. The stack memory cell array is disposed on a second chip, wherein the second chip has a plurality of second pads. The second pads are coupled to the stack memory cell array, and respectively coupled to corresponding first pads. The first address circuit is disposed on the second chip, coupled to the stack memory cell array, and disposed under the stack memory cell array.

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20240243180A1

    公开(公告)日:2024-07-18

    申请号:US18153368

    申请日:2023-01-12

    Abstract: A semiconductor device includes a substrate, a gate structure, a first doped region and a second doped region. The substrate has a plurality of recesses therein. A gate structure covers the plurality of recesses and a surface of the substrate between the plurality of recesses. The gate structure includes a gate dielectric layer and a gate conductive layer. The gate dielectric layer covers bottom surfaces and sidewalls of the plurality of recesses and the surface of the substrate between the plurality of recesses. The gate conductive layer is formed on the gate dielectric layer, fills in the plurality of recesses and covers the surface of the substrate between the plurality of recesses. The first doped region and the second doped region are located at two sides of the gate structure.

    SEMICONDUCTOR STRUCTURE
    8.
    发明申请

    公开(公告)号:US20190035930A1

    公开(公告)日:2019-01-31

    申请号:US15664010

    申请日:2017-07-31

    Abstract: A semiconductor structure includes a substrate, a first source/drain region, a second source/drain region, a channel doping region and a gate structure. The first source/drain region is disposed in the substrate. The first source/drain region includes a first region and a second region under the first region. The second source/drain region is disposed in the substrate. The second source/drain region is disposed opposite to the first source/drain region. The channel doping region is disposed in the substrate between the first source/drain region and the second source/drain region. The gate structure is disposed on the channel doping region. In a projection plane parallel to the top surface of the substrate, the second region of the first source/drain region is separated from the gate structure. The first source/drain region, the second source/drain region and the channel doping region have the same conductive type.

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