Abstract:
A solid state microwave generating device comprising a 3terminal element having a p-n junction representing a negative resistance and a junction of which the junction capacitance is varied according to a voltage applied thereto. A reverse voltage is imparted to said p-n junction so that the latter is maintained in a negative resistance condition resulting from an avalanche current. The other junction is set to a suitable reactance value so as to produce a microwave of a tuned wavelength, and under such a condition a modulating signal is supplied in superimposition to said other junction to thereby change the reactance value thereof, thus effecting microwave modulation. With this device, the oscillation wave occurring in a resonator circuit is controlled in accordance with lumped constants so that the tuning operation of the resonant circuit, modulation (FM), automatic frequency control (AFC) and so forth can be easily and efficiently performed.
Abstract:
1,129,789. Cadmium telluride crystals. MATSUSHITA ELECTRONICS CORP. 13 March, 1967 [26 March, 1966], No. 11710/67. Heading C1A. [Also in Division B1] Crystals of cadmium telluride are produced by mixing cadmium chloride with more than 24 mol per cent of cadmium telluride, or an equivalent equimolar mixture of metallic cadmium and tellurium, and fusing the whole at a temperature between 490‹ and 1090‹ C., and then cooling the resultant solution, or evaporating cadmium chloride from the mixture. A single crystal of CdTe may be provided in the solution whereby an epitaxial layer of CdTe is grown thereon.
Abstract:
A process for forming a titanium dioxide film which has recently been recognized to be useful for an insulating material for film capacitors and other electric circuit, by feeding a mixed gas of vapor of organo oxy titanium compound, oxygen and carrier gas to the surface of heated baseplate to grow an amorphouslike titanium dioxide film on said surface of baseplate, and if necessary, crystallizing said titanium dioxide film with a heat treatment in order to stabilize the film.
Abstract:
SILICON DIOXIDE FILM IS FORMED ON THE SURFACE OF A SEMICONDUCTOR SUBSTRATE BY THE THERMAL DECOMPOSITION OF A MIXED GAS COMPRISING A VAPOR OF AN ORGANO-OXYSILANE, A VAPOR OF AN ALIPHATIC CARBOXYLIC ACID SUCH AS ACETIC ACID, AND AN INERT GAS. THE USE OF SAID MIXED GAS RESULTS IN SUCH ADVANTAGES THAT THE REACTION CAN PROCEED AT SUCH A LOW TEMPERATURE WITHIN THE RANGE OF 300 TO 600*C AND THE VARIATION IN CHARACTERISTIC OF SILICON DIOXIDE AT THE DEPOSITION STEP CAN BE REDUCED.