Abstract:
On a main surface of a p-type silicon substrate having a bipolar transistor forming region and a MOS transistor forming region, an epitaxial layer is grown and n-type buried layers are formed. After forming a trench penetrating the buried layer, a buried polysilicon layer is formed in the trench. Then, a threshold control layer, a punch-through stopper layer, a channel stopper layer, an n-type well layer and a p-type well layer of each MOSFET are formed. At this point, since the well layer is formed through high energy ion implantation, the n-type buried layer is suppressed from being enlarged, and hence, time required for forming the trench can be shortened. Thus, a practical method of manufacturing a semiconductor device is provided.
Abstract:
A first thin insulating film capable of being pierced or punched through by carriers such as an SiO2 film 20 A thick is deposited on the surface of a P-type silicon substrate and a second insulating film with a trap level such as an Si3N4 film 500 to 600 A thick is laid on the first insulating film. Upon application of an electric field through a metal electrode mounted on the second insulating film to the combination of the insulating films, electrons captured at the trap level of the second insulating film transfer through the first insulating film to the surface of the substrate thereby forming an inversion layer. When the inversion layer is connected with the two junction regions formed in the surface of the substrate, the reverse current level of the junction region increases semipermanently due to the breakdown voltage of the junction until the inversion layer is cancelled by the application of a reverse electric field. This principle is used to produce a memory device characterized by an exact operation comprising a semiconductor, the first thin insulating film, the second insulating film with a trap level, the second insulating film, the metal electrode and two PN junctions which have different junction breakdown voltages.
Abstract:
An apparatus for producing fluorescent lamps comprises an intermittently rotatable turret having a plurality of glass tube supporting arms extending radially from the turret. The apparatus is so arranged that a plurality of glass tubes supported from the supporting arms are simultaneously subjected to working operations such as heating, bending, evacuation, filling, sealing etc. at a plurality of stations in each of which a plurality of glass tubes are subjected to the same working operation to improve the productivity of the apparatus.
Abstract:
A phosphor consisting of a solid solution of a complex oxide of alkaline earth metals, aluminum and silicon, which contains oxides of the alkaline earth metals (Ca, Sr and Ba), aluminum and silicon as a host material, which is activated by divalent europium (Eu2 ), shows a bright luminescence spectrum in a wavelength region from near ultraviolet to bluish white, which depends upon the composition of the host material, through an excitation by ultraviolet rays or electron beams. The phosphor is utilized as a blue component for a fluorescent discharge lamp for copying, a flying spot tube, a storage tube or a Braun tube.
Abstract:
A gas discharge tube is provided which comprises a glass tube, a coating of phosphor applied to the inner walls of the glass tube, a pair of electrodes disposed in parallel to each other along the substantial length of the glass tube, and some amounts of mercury and a neon-argon gas mixture or a neon-helium-argon gas mixture.
Abstract:
A multi-polar insulated gate transistor having two or more isolated electrodes formed on an insulated film, and an island region having a conductivity type different from that of the semiconductor proper and located in the portion of the substrate beneath said film and below the gap between said electrodes, whereby a large current can flow through the element located closer to the drain when the respective elements which may consist of the pair, i.e., each gate and source-island, islandisland or island-drain are under identical voltage conditions.
Abstract:
Luminous flux and luminous efficiency of a 20 watt fluorescent lamp comprising a ballast specified by the I.E.C. Publication 82 (covering Ballast for fluorescent lamps) is greatly improved by employing an improved tube characterized by: HAVING A NOMINAL TUBE LENGTH OF 590 MM AND AN INNER DIAMETER OF 20 MM TO 25 MM, PROVIDED INSIDE EACH END OF THE TUBE WITH AN ELECTRODE E having a length l of 15 mm to 55 mm inward (from the end face of each cap C as measured as shown in FIG. 2,) and containing mixed rare gas inside the tube, the rare gas having a composition ratio represented by any point within a diagonal region defined by connecting the following points (a) to (e) and (a) with straight lines in the following order, on a trilinear chart for xenon, krypton and argon mixture: (A) Xe: 2%, Kr: 0%, A:98% (b) Xe:15%, Kr: 0%, A:85% (c) Xe:15%, Kr:65%, A:20% (d) Xe:0%, Kr:80%, A:20% (e) Xe:0%, Kr:10%, A:90%, the pressure of the mixed gas being between 1.0 mmHg and 3.5 mmHg at a temperature of 20* C.
Abstract:
A low pressure mercury vapor fluorescent discharge lamp, having a color rendering value as high as 97 is obtainable by applying on the inner wall of the lamp a layer of a phosphor mixture comprising a basic magnesium arsenate phosphor containing 0.02 0.2 gram-atom of manganese per 6 mols of magnesium oxide, magnesium tungstate, tin-activated strontium magnesium orthophosphate and antimony-and-manganese-activated calcium halophosphate.
Abstract:
A pressure sensitive semiconductor device which has a schottky barrier junction at an electrode lead-out portion of one region of a p-n-p or n-p-n structure transistor and to which a pressure sensitive junction is formed by providing a pressure applying means to the schottky barrier junction which has a high sensitivity since it amplifies a pressure response signal by the amplifying action of the transistor.
Abstract:
A circuit in which the voltage derived from a reference diode or silicon zener diode is fed back through an emitter-follower circuit to the base of a transistor and the constant current flowing through the emitter-collector circuit of the transistor is in turn applied to the reference diode so that such a stabilized output voltage as cannot be attained by the zener diode alone may be obtained.