公开(公告)号：US20240274517A1

公开(公告)日：2024-08-15

申请号：US18418419

申请日：2024-01-22

Applicant: MEDIATEK INC.

Inventor： Fa-Chuan CHEN ,  Ta-Jen YU ,  Bo-Jiun YANG ,  Tsung-Yu PAN ,  Tai-Yu CHEN ,  Nai-Wei LIU ,  Shih-Chin LIN ,  Wen-Sung HSU

IPC: H01L23/498 ,  H01L21/28 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49816 ,  H01L21/28132 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/13 ,  H01L25/0652 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/13025 ,  H01L2224/13147 ,  H01L2924/01029 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/351

Abstract: A semiconductor package structure includes a first component, a bonding structure on the first component, a second component connected to the first component, and a copper connector on the second component. The bonding structure includes a copper base on the first component and copper protruding portions on the copper base. The second component is connected to the first component by bonding the copper protruding portions to the copper connector, and the copper protruding portions are in contact with the copper connector.