ELECTRODE MATERIAL AND METHOD FOR PRODUCING ELECTRODE MATERIAL
    3.
    发明申请
    ELECTRODE MATERIAL AND METHOD FOR PRODUCING ELECTRODE MATERIAL 审中-公开
    电极材料和电极材料的制造方法

    公开(公告)号:US20160332231A1

    公开(公告)日:2016-11-17

    申请号:US15112358

    申请日:2015-01-05

    Abstract: An electrode material obtained by press molding a mixed powder where a Cu powder, a Cr powder and a refractory metal powder (for example, a Mo powder) are mixed and then sintering the thus-obtained molded body in a non-oxidizing atmosphere at a temperature that is not higher than the melting point of Cu. As the Cr powder to be mixed in the mixed powder, a Cr powder wherein the volume-based relative particle amount of particles having particle diameters of 40 μm or less is less than 10% is used. The Cr powder is mixed in the mixed powder in an amount of 10-50% by weight, while the refractory metal powder is mixed in the mixed powder in an amount of 1-10% by weight.

    Abstract translation: 通过将Cu粉末,Cr粉末和难熔金属粉末(例如Mo粉末)的混合粉末压制成型而获得的电极材料,然后在非氧化性气氛中烧结由此获得的成型体 温度不高于Cu的熔点。 作为在混合粉末中混合的Cr粉末,使用其中粒径为40μm以下的粒子的体积相对粒子量小于10%的Cr粉末。 将Cr粉末以10-50重量%的量混合在混合粉末中,同时将该难熔金属粉末以1-10重量%的量混合在混合粉末中。

    METHOD FOR MANUFACTURING ELECTRODE MATERIAL
    8.
    发明申请

    公开(公告)号:US20190299285A1

    公开(公告)日:2019-10-03

    申请号:US16307538

    申请日:2017-03-15

    Abstract: There is disclosed a method for manufacturing an electrode by pressing and sintering a mixed powder of a solid solution powder of Cr and a heat-resistant element, which contains Cr and the heat-resistant element in a ratio such that Cr is greater than the heat-resistant element by weight, a Cu powder, and a low melting metal powder (Bi, Sn, Se, Pb, etc.). The low melting metal powder of 0.30 weight % to 0.50 weight % is added to a mixed powder of a solid solution powder of Cr and the heat-resistant element and the Cu powder, and then a mixed powder prepared by adding the low melting metal powder is sintered at a temperature of from 1010° C. to 1035° C. As the low melting metal powder, there is used a powder having a median size of from 5 μm to 20 μm.

    ELECTRODE MATERIAL
    10.
    发明申请
    ELECTRODE MATERIAL 有权
    电极材料

    公开(公告)号:US20170066055A1

    公开(公告)日:2017-03-09

    申请号:US15122743

    申请日:2015-02-17

    Abstract: An electrode material wherein Cr-containing particles are finely miniaturized and uniformly dispersed while a Cu portion, which is highly conductive component, is also finely miniaturized and uniformly dispersed. The electrode material is prepared, for example, by: a mixing step (S1) for mixing a Cr powder and a heat resistant element powder; a provisional sintering step (S2) for provisionally sintering the mixed powder to obtain a solid solution of Cr and the heat resistant element; a pulverizing step (S3) for pulverizing the solid solution of Cr and the heat resistant element to obtain a solid solution powder of Cr and the heat resistant element; a molding step (S4) for molding the solid solution powder; a main sintering step (S5) for performing main sintering of the obtained molded body to obtain a sintered body (skeleton) of Cr and the heat resistant element; and a Cu infiltration step (S6) for infiltrating the sintered body of Cr and the heat resistant element with Cu.A method for producing an electrode material, involving: (i) a step of preparing a powder of a solid solution of Cr and a heat resistant material selected from the group consisting of Mo, W, Ta, Nb, V and Zr, wherein either a peak corresponding to Cr element or a peak corresponding to the heat resistant element, which are observed by X ray diffraction measurement made on the powder of the solid solution, disappears; (ii) a step of molding the powder of the solid solution to obtain a molded body and then sintering the molded body to produce a sintered body; and (iii) a Cu infiltration step of infiltrating the sintered body with Cu.

    Abstract translation: 一种电极材料的制造方法,其特征在于:(i)制备Cr的固溶体的粉末和选自Mo,W,Ta,Nb,V和Zr的耐热材料的步骤,其中任一种 消失了通过在固溶体的粉末上进行的X射线衍射测量而对应于Cr元素的峰或对应于耐热元件的峰; (ii)将固溶体的粉末成形以获得成型体,然后烧结成型体以制造烧结体的步骤; 和(iii)用Cu浸渍烧结体的Cu浸渗步骤。

Patent Agency Ranking