公开(公告)号：US20160118367A1

公开(公告)日：2016-04-28

申请号：US14984354

申请日：2015-12-30

Applicant: Micron Technology, Inc.

Inventor： David Pratt

IPC: H01L25/065 ,  H01L25/16

CPC classification number: H01L25/0657 ,  H01L21/486 ,  H01L21/76868 ,  H01L21/76898 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/00014

Abstract: Redistribution layers for microfeature workpieces, and associated systems and methods are disclosed. One method for processing a microfeature workpiece system includes positioning a pre-formed redistribution layer as a unit proximate to and spaced apart from a microfeature workpiece having an operable microfeature device. The method can further include attaching the redistribution layer to the microfeature workpiece and electrically coupling the redistribution layer to the operable microfeature device.

Abstract translation: 公开了用于微特征工件的再分布层，以及相关系统和方法。 用于处理微特征工件系统的一种方法包括将预先形成的再分配层定位为与具有可操作的微特征装置的微特征工件相邻并间隔开的单元。 该方法还可以包括将再分布层附着到微特征工件并将再分布层电耦合到可操作的微特征装置。

公开(公告)号：US09595504B2

公开(公告)日：2017-03-14

申请号：US14679834

申请日：2015-04-06

Applicant: Micron Technology, Inc.

Inventor： David Pratt ,  David R. Hembree

IPC: H01L23/00 ,  H01L21/78 ,  B32B7/14 ,  B32B7/02 ,  B32B3/30 ,  H05K13/00 ,  B23B7/02 ,  B32B37/12 ,  B32B37/14

CPC classification number: H01L24/94 ,  B23B7/02 ,  B32B3/30 ,  B32B7/02 ,  B32B7/14 ,  B32B37/1292 ,  B32B37/144 ,  H01L21/78 ,  H01L24/83 ,  H01L2924/14 ,  H05K13/00 ,  Y10T156/19 ,  Y10T156/1994 ,  Y10T428/14 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24562 ,  Y10T428/24612 ,  Y10T428/24752 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24942 ,  H01L2924/00

Abstract: Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.

Abstract translation: 本文公开了用于将支撑构件可释放地附接到微型工件以支撑构件的方法和装置。 在一个实施例中，例如，用于处理包括多个微电子管芯的微特征工件的方法包括在支撑构件的第一侧上形成分立的材料块。 块以预定图案布置在支撑构件上。 该方法还包括将粘合剂材料沉积在单个材料块之间的间隙中，并且使工件的第一侧与粘合剂材料和/或块接触。 该方法还包括切割穿过工件的第二侧以对模具进行切割并且使间隙中的粘合剂材料的至少一部分露出。 该方法然后包括用溶剂从支撑构件和/或工件移除至少几乎所有的粘合剂材料。

公开(公告)号：US20150214185A1

公开(公告)日：2015-07-30

申请号：US14679834

申请日：2015-04-06

Applicant: Micron Technology, Inc.

Inventor： David Pratt ,  David R. Hembree

IPC: H01L23/00 ,  H01L21/78

CPC classification number: H01L24/94 ,  B23B7/02 ,  B32B3/30 ,  B32B7/02 ,  B32B7/14 ,  B32B37/1292 ,  B32B37/144 ,  H01L21/78 ,  H01L24/83 ,  H01L2924/14 ,  H05K13/00 ,  Y10T156/19 ,  Y10T156/1994 ,  Y10T428/14 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24562 ,  Y10T428/24612 ,  Y10T428/24752 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24942 ,  H01L2924/00

Abstract: Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.

Abstract translation: 本文公开了用于将支撑构件可释放地附接到微型工件以支撑构件的方法和装置。 在一个实施例中，例如，用于处理包括多个微电子管芯的微特征工件的方法包括在支撑构件的第一侧上形成分立的材料块。 块以预定图案布置在支撑构件上。 该方法还包括将粘合剂材料沉积在单个材料块之间的间隙中，并且使工件的第一侧与粘合剂材料和/或块接触。 该方法还包括切割穿过工件的第二侧以对模具进行切割并且使间隙中的粘合剂材料的至少一部分露出。 该方法然后包括用溶剂从支撑构件和/或工件移除至少几乎所有的粘合剂材料。

公开(公告)号：US09355934B2

公开(公告)日：2016-05-31

申请号：US14254434

申请日：2014-04-16

Applicant: MICRON TECHNOLOGY, INC.

Inventor： David Pratt

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00

CPC classification number: H01L23/481 ,  H01L24/02 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A method of making a semiconductor die includes forming a trench around a conductive stud extending from the first side to a second side of a substrate to expose a portion of the stud and then forming a conductive layer inside the trench and in electrical contact with the stud.

Abstract translation: 制造半导体管芯的方法包括在从衬底的第一侧延伸到第二侧的导电柱体周围形成沟槽，以暴露螺柱的一部分，然后在沟槽内形成导电层并与螺柱电接触 。

公开(公告)号：US20140225254A1

公开(公告)日：2014-08-14

申请号：US14254434

申请日：2014-04-16

Applicant: MICRON TECHNOLOGY, INC.

Inventor： David Pratt

IPC: H01L23/48 ,  H01L23/00

CPC classification number: H01L23/481 ,  H01L24/02 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A method of making a semiconductor die includes forming a trench around a conductive stud extending from the first side to a second side of a substrate to expose a portion of the stud and then forming a conductive layer inside the trench and in electrical contact with the stud.

Abstract translation: 制造半导体管芯的方法包括在从衬底的第一侧延伸到第二侧的导电柱体周围形成沟槽，以暴露螺柱的一部分，然后在沟槽内形成导电层并与螺柱电接触 。

公开(公告)号：US20130136898A1

公开(公告)日：2013-05-30

申请号：US13751671

申请日：2013-01-28

Applicant: Micron Technology, Inc.

Inventor： David Pratt ,  David R. Hembree

IPC: H05K13/00

CPC classification number: H01L24/94 ,  B23B7/02 ,  B32B3/30 ,  B32B7/02 ,  B32B7/14 ,  B32B37/1292 ,  B32B37/144 ,  H01L21/78 ,  H01L24/83 ,  H01L2924/14 ,  H05K13/00 ,  Y10T156/19 ,  Y10T156/1994 ,  Y10T428/14 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24562 ,  Y10T428/24612 ,  Y10T428/24752 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24942 ,  H01L2924/00

Abstract: Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.

公开(公告)号：US09418970B2

公开(公告)日：2016-08-16

申请号：US14984354

申请日：2015-12-30

Applicant: Micron Technology, Inc.

Inventor： David Pratt

IPC: H01L21/44 ,  H01L25/065 ,  H01L25/16

CPC classification number: H01L25/0657 ,  H01L21/486 ,  H01L21/76868 ,  H01L21/76898 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/00014

Abstract: Redistribution layers for microfeature workpieces, and associated systems and methods are disclosed. One method for processing a microfeature workpiece system includes positioning a pre-formed redistribution layer as a unit proximate to and spaced apart from a microfeature workpiece having an operable microfeature device. The method can further include attaching the redistribution layer to the microfeature workpiece and electrically coupling the redistribution layer to the operable microfeature device.

公开(公告)号：US08999498B2

公开(公告)日：2015-04-07

申请号：US13751671

申请日：2013-01-28

Applicant: Micron Technology, Inc.

Inventor： David Pratt ,  David R. Hembree

IPC: B32B3/10 ,  B32B3/22 ,  B32B3/30 ,  B32B7/02 ,  B32B7/12 ,  B32B7/14 ,  B32B37/14 ,  H05K13/00 ,  B23B7/02 ,  H01L21/78 ,  B32B37/12

CPC classification number: H01L24/94 ,  B23B7/02 ,  B32B3/30 ,  B32B7/02 ,  B32B7/14 ,  B32B37/1292 ,  B32B37/144 ,  H01L21/78 ,  H01L24/83 ,  H01L2924/14 ,  H05K13/00 ,  Y10T156/19 ,  Y10T156/1994 ,  Y10T428/14 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24562 ,  Y10T428/24612 ,  Y10T428/24752 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24942 ,  H01L2924/00

Abstract: Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.

Abstract translation: 本文公开了用于将支撑构件可释放地附接到微型工件以支撑构件的方法和装置。 在一个实施例中，例如，用于处理包括多个微电子管芯的微特征工件的方法包括在支撑构件的第一侧上形成分立的材料块。 块以预定图案布置在支撑构件上。 该方法还包括将粘合剂材料沉积在单个材料块之间的间隙中，并且使工件的第一侧与粘合剂材料和/或块接触。 该方法还包括切割穿过工件的第二侧以对模具进行切割并且使间隙中的粘合剂材料的至少一部分露出。 该方法然后包括用溶剂从支撑构件和/或工件移除至少几乎所有的粘合剂材料。