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公开(公告)号:US20200219568A1
公开(公告)日:2020-07-09
申请号:US16484881
申请日:2018-12-28
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Hua Tan , Jingxun Eric Wu , Yingying Zhu , Hui Yang , Bo Zhou
Abstract: A memory device comprises a memory array including memory cells, a temperature sensing circuit, and a memory control unit operatively coupled to the memory array. The memory control unit includes a processor. The processor is configured to receive temperature information from the temperature sensing circuit, initiate programming of the memory cells with data using a first threshold voltage distribution when the temperature information indicates an operating temperature is in a first temperature range, and initiate programming of the memory cells with data using a second threshold voltage distribution when the temperature information indicates the operating temperature is in a second temperature range.
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公开(公告)号:US20210391013A1
公开(公告)日:2021-12-16
申请号:US17458211
申请日:2021-08-26
Applicant: Micron Technology, Inc.
Inventor: Hua Tan , Jingxun Eric Wu , Yingying Zhu , Hui Yang , Bo Zhou
Abstract: A memory device comprises a memory array including memory cells, a temperature sensing circuit, and a memory control unit operatively coupled to the memory array. The memory control unit includes a processor. The processor is configured to receive temperature information from the temperature sensing circuit, initiate programming of the memory cells with data using a first threshold voltage distribution when the temperature information indicates an operating temperature is in a first temperature range, and initiate programming of the memory cells with data using a second threshold voltage distribution when the temperature information indicates the operating temperature is in a second temperature range.
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公开(公告)号:US11670375B2
公开(公告)日:2023-06-06
申请号:US17458211
申请日:2021-08-26
Applicant: Micron Technology, Inc.
Inventor: Hua Tan , Jingxun Eric Wu , Yingying Zhu , Hui Yang , Bo Zhou
CPC classification number: G11C16/10 , G06F3/0604 , G06F3/0659 , G06F3/0679 , G11C16/0483 , G11C16/06 , G11C16/26 , G11C29/10 , G11C29/50
Abstract: A memory device provides a memory array including memory cells, a temperature sensing circuit, and a memory control unit operatively coupled to the memory array. The memory control unit includes a processor. The processor is configured to receive temperature information from the temperature sensing circuit, initiate programming of the memory cells with data using a first threshold voltage distribution when the temperature information indicates an operating temperature is in a first temperature range, and initiate programming of the memory cells with data using a second threshold voltage distribution when the temperature information indicates the operating temperature is in a second temperature range.
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公开(公告)号:US11107533B2
公开(公告)日:2021-08-31
申请号:US16484881
申请日:2018-12-28
Applicant: Micron Technology, Inc.
Inventor: Hua Tan , Jingxun Eric Wu , Yingying Zhu , Hui Yang , Bo Zhou
Abstract: A memory array including memory cells, a temperature sensing circuit, and a memory control unit operatively coupled to the memory array. The memory control unit includes a processor. The processor is configured to receive temperature information from the temperature sensing circuit, initiate programming of the memory cells with data using a first threshold voltage distribution when the temperature information indicates an operating temperature is in a first temperature range, and initiate programming of the memory cells with data using a second threshold voltage distribution when the temperature information indicates the operating temperature is in a second temperature range.
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