公开(公告)号：US20200166835A1

公开(公告)日：2020-05-28

申请号：US16619696

申请日：2018-06-05

申请人： MITSUI CHEMICALS, INC.

发明人： Takashi ODA ,  Hisanori OHKITA ,  Yasuhisa KAYABA

IPC分类号： G03F7/00 ,  B29C59/02 ,  H01L21/027 ,  C08G61/08

摘要： A method of producing a substrate with a fine uneven pattern is a method of producing a substrate having a fine uneven pattern on a surface thereof, the method including a step (a) of preparing a laminate provided with a substrate and a first resin layer provided on the substrate and having a first fine uneven pattern formed on a surface thereof; and a step (b) of forming a second fine uneven pattern corresponding to the first fine uneven pattern on the surface of the substrate by etching the surface of the first fine uneven pattern using the first resin layer as a mask, in which the first resin layer is formed of a resin composition (P) including a fluorine-containing cyclic olefin polymer (A) or a cured product of the resin composition (P).

公开(公告)号：US20180076047A1

公开(公告)日：2018-03-15

申请号：US15562072

申请日：2016-03-24

申请人： MITSUI CHEMICALS, INC.

发明人： Hirofumi TANAKA ,  Yasuhisa KAYABA ,  Hiroko WACHI ,  Koji INOUE ,  Shoko ONO

IPC分类号： H01L21/3105 ,  C08G73/02 ,  C09D179/02 ,  H01L21/02 ,  H01L21/311

CPC分类号： H01L21/31051 ,  C08G73/0206 ,  C09D179/02 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/02343 ,  H01L21/02362 ,  H01L21/31058 ,  H01L21/31133 ,  H01L21/31138 ,  H01L21/76

摘要： A method for manufacturing a filling planarization film, the method including: a first coating step of applying a first coating liquid, containing a polyamine and a first solvent, to a region including a recessed part of a member having the recessed part, to fill the first coating liquid into the recessed part; and a second coating step of applying a second coating liquid, containing an organic substance having two or more carboxyl groups and a second solvent having a boiling point of 200° C. or less and an SP value of 30 (MPa)1/2 or less, to the region including the recessed part of the member into which the first coating liquid has been filled.

公开(公告)号：US20170162382A1

公开(公告)日：2017-06-08

申请号：US15325511

申请日：2015-08-05

申请人： MITSUI CHEMICALS, INC.

发明人： Yasuhisa KAYABA ,  Hirofumi TANAKA ,  Shoko ONO ,  Koji INOUE ,  Hiroko WACHI ,  Tsuneji SUZUKI

IPC分类号： H01L21/02 ,  C08L79/00 ,  C09D157/06

摘要： The invention provides a sealing composition including: polymer (A) containing a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000; and a benzotriazole compound; in which the content of the polymer (A) is from 0.05 parts by mass to 0.20 parts by mass with respect to 100 parts by mass of the sealing composition; in which the content of the benzotriazole compound in the sealing composition is from 3 ppm by mass to 200 ppm by mass; and in which the sealing composition has a pH of from 3.0 to 6.5.

公开(公告)号：US20160049343A1

公开(公告)日：2016-02-18

申请号：US14779757

申请日：2014-03-11

申请人： MITSUI CHEMICALS INC.

发明人： Yasuhisa KAYABA ,  Shoko ONO ,  Hirofumi TANAKA ,  Tsuneji SUZUKI ,  Shigeru MIO ,  Kazuo KOHMURA

IPC分类号： H01L23/29 ,  C09J179/04 ,  H01L23/528 ,  H01L23/532 ,  H01L21/02 ,  H01L21/56

CPC分类号： H01L23/293 ,  C08G73/0206 ,  C08K5/0091 ,  C08L79/02 ,  C09J179/04 ,  H01L21/0206 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/56 ,  H01L23/528 ,  H01L23/53209 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a method for manufacturing a composite body, the method containing: a composition preparation process of preparing a composition that contains a polymer having a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000, and that has a pH of from 2.0 to 11.0; a composite member preparation process of preparing a composite member that includes a member A and a member B, a surface of the member B having a defined isoelectric point, and that satisfies a relationship: the isoelectric point of a surface of the member B

摘要翻译： 本发明提供一种复合体的制造方法，该方法包括：制备含有阳离子官能团的聚合物，重均分子量为2,000〜1,000,000的组合物的组合物制备方法，其具有 从2.0到11.0; 制备复合构件的复合构件制备方法，其包括构件A和构件B，构件B的具有确定的等电点的表面，并且满足以下关系：构件B的表面的等电点 组分的pH <构件A的表面的等电点; 以及将组合物施加到构件A的表面和包含在复合构件中的构件B的表面的施加过程。

公开(公告)号：US20230275057A1

公开(公告)日：2023-08-31

申请号：US18043690

申请日：2021-09-08

申请人： MITSUI CHEMICALS, INC.

发明人： Yuzo NAKAMURA ,  Yasuhisa KAYABA ,  Jun KAMADA

IPC分类号： H01L23/00 ,  C08L83/06 ,  C08J3/24

CPC分类号： H01L24/29 ,  C08L83/06 ,  C08J3/247 ,  H01L24/27 ,  H01L24/32 ,  C08L2203/16 ,  C08J2383/06 ,  H01L2224/27515 ,  H01L2224/29191 ,  H01L2924/3511 ,  H01L2924/35121 ,  H01L2224/32145 ,  H01L2924/3641

摘要： A composition includes: a compound (A), having an Si—O bond and a cationic functional group that includes at least one selected from the group consisting of a primary nitrogen atom and a secondary nitrogen atom; a compound (B), having at least three —C(═O)OX groups, wherein X is a hydrogen atom or an alkyl group with a carbon number of from 1 to 6, and from one to six of the —C(═O)OX groups is a —C(═O)OH group; and a compound (C), having a cyclic structure and at least one primary nitrogen atom that is directly bonded to the cyclic structure, the composition having a percentage of the primary and the secondary nitrogen atoms in the compound (A), with respect to a total amount of the primary and the secondary nitrogen atoms in the compound (A) and the primary nitrogen atom in the compound (C), of from 3 mol % to 95 mol %.

公开(公告)号：US20210391292A1

公开(公告)日：2021-12-16

申请号：US17284833

申请日：2019-10-17

申请人： MITSUI CHEMICALS, INC.

发明人： Yasuhisa KAYABA ,  Jun KAMADA ,  Yuzo NAKAMURA

IPC分类号： H01L23/00

摘要： A method of manufacturing a substrate layered body includes: a step of applying a bonding material to the surface of at least one of a first substrate or a second substrate; a step of curing the bonding material applied on the surface to form a bonding layer having a reduced modulus at 23° C. of 10 GPa or less; and a step of bonding the first substrate and the second substrate via the bonding layer formed.

公开(公告)号：US20200377772A1

公开(公告)日：2020-12-03

申请号：US16606789

申请日：2018-04-19

申请人： Mitsui Chemicals, Inc.

发明人： Jun KAMADA ,  Kaichiro HARUTA ,  Takashi UNEZAKI ,  Kiyomi IMAGAWA ,  Kenichi FUJII ,  Yasuhisa KAYABA ,  Kazuo KOHMURA

IPC分类号： C09J179/08 ,  C09J5/00 ,  H01L21/304 ,  H01L21/56

摘要： The purpose of the present invention is to provide a semiconductor substrate manufacturing method, which prevents detachment of a semiconductor wafer being ground, and which prevents cracking or chipping in a semiconductor substrate obtained. In order to solve the problem, the semiconductor substrate manufacturing method comprises: a polyimide layer forming step of forming a polyimide layer on a support material; a wafer attaching step of affixing the support material and a semiconductor wafer to each other with the polyimide layer disposed therebetween; a wafer grinding step of grinding the semiconductor wafer; a support material peeling step of peeling the support material from the polyimide layer; and a polyimide layer peeling step of peeling the polyimide layer from the semiconductor wafer. The polyimide layer includes polyimide which includes a benzophenone skeleton and an aliphatic structure, wherein an amine equivalent weight is 4000 to 20000.

公开(公告)号：US20210191269A1

公开(公告)日：2021-06-24

申请号：US16757830

申请日：2018-11-13

申请人： MITSUI CHEMICALS, INC.

发明人： Hiroko WACHI ,  Yasuhisa KAYABA ,  Hirofumi TANAKA ,  Kenichi FUJII

IPC分类号： G03F7/11 ,  H01L21/311 ,  G03F7/075

摘要： Provided are a semiconductor element intermediate including: a substrate and a multilayer resist layer, in which the multilayer resist layer includes a metal-containing film, and in which the metal-containing film has a content of germanium element of 20 atm % or more, or a total content of tin element, indium element, and gallium element of 1 atm % or more, as measured by X-ray photoelectric spectroscopy, and an application of the semiconductor intermediate.

公开(公告)号：US20200168476A1

公开(公告)日：2020-05-28

申请号：US16611653

申请日：2018-05-10

申请人： MITSUI CHEMICALS, INC.

发明人： Jun KAMADA ,  Kaichiro HARUTA ,  Yasuhisa KAYABA ,  Kazuo KOHMURA ,  Yoichi KODAMA

IPC分类号： H01L21/56 ,  H01L23/29

摘要： This method for producing a semiconductor device comprises: a first step wherein a plurality of semiconductor chips are affixed onto a supporting substrate such that circuit surfaces of the semiconductor chips face the supporting substrate; a second step wherein a plurality of sealed layers are formed at intervals by applying the sealing resin onto the semiconductor chips by three-dimensional modeling method, each sealed layer containing one or more semiconductor chips embedded in a sealing resin; a third step wherein the sealed layers are cured or solidified; and a fourth step wherein sealed bodies are obtained by separating the cured or solidified sealed layers from the supporting substrate.

公开(公告)号：US20200048515A1

公开(公告)日：2020-02-13

申请号：US16607898

申请日：2018-04-24

申请人： Mitsui Chemicals, Inc.

发明人： Jun KAMADA ,  Kazuo KOHMURA ,  Yasuhisa KAYABA

IPC分类号： C09J183/04 ,  C09J179/02 ,  B32B7/12 ,  H01L23/00 ,  H03H9/05 ,  B81C3/00 ,  H01L41/313

摘要： A body, comprising stacked substrates, wherein: a first substrate, an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and which has a defined weight average molecular weight, and a crosslinking agent (B), which has three or more —C(═O)OX groups in a molecule, in which from one to six of the three or more —C(═O)OX groups are —C(═O)OH groups and which has a weight average molecular weight of from 200 to 600, X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms, and a second substrate, are layered in this order, and the compound (A) comprises at least one selected from the group consisting of a defined aliphatic amine and a defined compound having a siloxane bond and an amino group.