Abstract:
Disclosed is a method and apparatus for the vacuum evaporation of chromium-silver metallization on a silicon substrate by which the chromium adherence is improved and by which very large quantities of silver may be deposited in a short time. The evaporative system described will form a chromium-silver multilayer which adheres tightly to a substrate such as silicon. This system is feasible for the fast large-scale production formation of chromium-silver layers on silicon. The fast evaporative rate of the silver is accomplished by the use of a silver wettable insert in a silver nonwettable crucible.
Abstract:
A transport mechanism and furnace for transistor header assemblies is described wherein the headers are transported in a serial manner along a fixed surface. The surface can be formed as a portion of the heat sink of a furnace used to effect soldered connections in semiconductor assemblies. As a result, the headers are heated by conduction. A pair of spaced parallel rods are slidably mounted proximate to the fixed surface and the headers are positioned therebetween. The spacing of these rods is less than the major dimension or length of the header. The application of force to the first header in the series urges the header into frictional engagement with the rods and by simultaneously moving the rods forward all of the headers become frictionally engaged and move through the furnace with the rods. Consequently, the header assemblies are transported without requiring a moving belt and the soldering conditions in the furnace are improved.