摘要:
In forming a narrow pattern, it is difficult to form a lift-off resist pattern with an overhang shape. Accordingly, it results in a phenomenon in which the angle at the end of the GMR layer is reduced to 45° or less. It is necessary to provide a lift-off resist pattern that forms the end of the GMR film to be at an angle of as abrupt as 45° or more and ensures lift-off. According to one embodiment of the invention, a method of manufacturing a thin film magnetic head of using a resist pattern comprises three-layered organic films of a PMGI layer, an organic film layer and an image layer from the lower layer as a lift-off resist pattern, etching the organic film layer and the PMGI layer by using the imaging layer as a mask, then etching a GMR layer by using, as a mask, a lift-off resist pattern in which the organic film layer and the imaging layer are formed into the overhang shape prepared by etching the PMGI layer in a developer solution, and then forming a magnetic domain control film and an electrode film on both ends of the GMR layer by using a lift-off method.
摘要:
In forming a narrow pattern, it is difficult to form a lift-off resist pattern with an overhang shape. Accordingly, it results in a phenomenon in which the angle at the end of the GMR layer is reduced to 45° or less. It is necessary to provide a lift-off resist pattern that forms the end of the GMR film to be at an angle of as abrupt as 45° or more and ensures lift-off. According to one embodiment of the invention, a method of manufacturing a thin film magnetic head of using a resist pattern comprises three-layered organic films of a PMGI layer, an organic film layer and an image layer from the lower layer as a lift-off resist pattern, etching the organic film layer and the PMGI layer by using the imaging layer as a mask, then etching a GMR layer by using, as a mask, a lift-off resist pattern in which the organic film layer and the imaging layer are formed into the overhang shape prepared by etching the PMGI layer in a developer solution, and then forming a magnetic domain control film and an electrode film on both ends of the GMR layer by using a lift-off method.
摘要:
Compounds of formula (I), (II), and (III), wherein R1, R2, R′2 and R′″2 for example are C1-C20alkyl, provided that at least one of R1, R2, R′2 and R′″2 carries a specified substituent; R3, R4, and R5 for example independently of one another are hydrogen or a defined substituent provided that at least one of R3, R4 or R5 is other than hydrogen or C1-C20alkyl; R6, R7, R8, R′7, RV, R′8, R″6, R″7, R′″6 and R′″7 for example independently of one another have one of the meanings as given for R3, R4, and R5; and R9 for example is C1-C20alkyl; exhibit an unexpectedly good performance in photopolymerization reactions.
摘要:
The present invention pertains to salt modified copolymers wherein one of the monomer units contains a quaternized N-atom structure with a polar substituent. The invention further relates to the use of said copolymers as dispersant especially for color filters. The copolymer is made by controlled polymerization or by conventional polymerization and comprises at least one monomer (MAr) selected from unsaturated monomers out of the group of acrylates, methacrylates, acrylamides, methacrylamides, styrenic monomers, at least one monomer (MBs) selected from unsaturated monomers out of the group of acrylates, methacrylates, acrylamides, methacrylamides, styrenic monomers wherein the monomer MB has a quaternized N-atom structure with a polar substituent selected from polyether, polyamine, nitrile, amide, imine, imide, ester, ketone, nitrile, aldehyde, diketone, ketoester, ketoamide, carbonate, carbamate, carbamide, sulfoxide, sulfone, carboxylic acid, sulfonic acid, phosphoric acid groups; or carboxylic acid anion, sulfonic acid anion or phosphoric acid anion groups which is formed as betaine structure r denotes the total number of monomers MA within the structural element (MAr) and r is >5, preferred 10-1000, most preferred 10-500; s denotes the total number of monomers MB within the structural element (MBs) and s is >1, preferred 2-100, most preferred 2-50.
摘要:
Compounds of the formula (I) and (II) M1, M2 and M3 independently of one another are no bond, a direct bond, CO, O, S, SO, SO2 or NR14; provided that at least one of M1, M2 or M3 is a direct bond, CO, O, S, SO, SO2 or NR14; M4 is a direct bond, CR″3R″4, CS, O, S, SO, or SO2; Y is S or NR18; R1 for example is hydrogen, C3-C8cycloalkyl, phenyl or napthyl, both of which are optionally substituted; R2 for example is C1-C20alkyl; R″2 has one of the meanings given for R2; R3 and R4 are for example hydrogen, halogen, C1-C20alkyl; R′3, R′4, R″3 and R″4 independently of one another have one of the meanings given for R3 and R4; and R5 is for example hydrogen, halogen, C1-C20alkyl; provided that in the compounds of the formula (I) at least two oxime ester groups are present and provided that at least one specified substituent R2 or R″2 is present; exhibit an unexpectedly good performance in photopolymerization reactions.
摘要翻译:式(I)和(II)M1,M2和M3彼此独立的化合物不是键,直接键,CO,O,S,SO,SO 2或NR 14; 条件是M1,M2或M3中的至少一个是直接键,CO,O,S,SO,SO 2或NR 14; M4是直接键,CR''3R''4,CS,O,S,SO或SO2; Y为S或NR18; R 1例如是氢,C 3 -C 8环烷基,苯基或萘基,它们都是任选被取代的; R 2例如是C 1 -C 20烷基; R'2具有R2中给出的含义之一; R3和R4是例如氢,卤素,C1-C20烷基; R 3,R'4,R“3和R”4彼此独立地具有R3和R4给出的含义之一; R5是例如氢,卤素,C1-C20烷基; 条件是在式(I)的化合物中存在至少两个肟酯基团,条件是存在至少一个特定的取代基R 2或R“2; 在光聚合反应中表现出出人意料的良好性能。
摘要:
A method of drawing and ironing a resin film laminated metal sheet for forming a can body having a bottom portion, a can wall portion and a flange-forming portion by drawing the resin film laminated metal sheet obtained by laminating at least one surface of a metal sheet with an organic resin film, followed by ironing by using a punch and a plurality of dies neighboring each other. The can wall is effectively prevented from being broken by a decrease in the thickness of the can wall, and drawn and ironed cans are efficiently formed having a thickness which is decreased as designed.
摘要:
A semiconductor device manufacturing method including: (a) loading into a chamber a substrate having at least an exposed silicon surface and an exposed surface of silicon oxide film or silicon nitride film on a substrate surface; (b) simultaneously supplying at least a first process gas containing silicon and a second process gas for etching into the chamber when the substrate inside the chamber is heated to a predetermined temperature; and (c) supplying into the chamber a third process gas having an etchability higher than the second process gas etchability. Steps (b) and (c) are performed at least once to selectively grow an epitaxial film on the exposed silicon surface of the substrate surface. A temperature of the substrate is maintained at the predetermined temperature from (b) to (c), and the temperature of the substrate is temporarily elevated above the predetermined temperature and then returned to the predetermined temperature in (c).
摘要:
Disclosed are electroluminescent devices that comprise organic layers that contain dibenzofuran compounds. The compounds are suitable components of, for example, blue-emitting, durable, organo-electroluminescent layers. The electroluminescent devices may be employed for full color display panels in, for example, mobile phones, televisions and personal computer screens.
摘要:
The invention relates to a concentrated aqueous polymer dispersion with an average particle size of less than 1000 nm comprising a) a polymer carrier prepared by heterophase radical polymerization of at least one ethylenically unsaturated monomer in the presence of b) a photoinitiator and/or photolatent catalyst and c) optionally a non-ionic, cationic or anionic surfactant, wherein the weight ratio of the photoinitiator and/or photolatent catalyst to the polymer carrier is greater than 20 parts of photoinitiator and/or photolatent catalyst per 100 parts of polymer carrier, preferably equal or greater than 35 parts of photoinitiator and/or photolatent catalyst per 100 parts of polymer carrier.
摘要:
A method of manufacturing a semiconductor device comprises: (a) loading a substrate into a process chamber, wherein the substrate has at least a silicon exposure surface and an exposure surface of silicon oxide film or silicon nitride film on a substrate surface; (b) simultaneously supplying at least a first process gas containing silicon and a second process gas for etching into the process chamber under conditions that the substrate inside the process chamber is heated to a predetermined temperature; and (c) supplying a third process gas having a stronger etchability than the second process gas into the process chamber, wherein the operation (b) and the operation (c) are performed at least one or more times so that an epitaxial film is selectively grown on the silicon exposure surface of the substrate surface