公开(公告)号：US08536540B2

公开(公告)日：2013-09-17

申请号：US13381953

申请日：2010-05-14

申请人： Makoto Suzuki ,  Kenji Tanimoto ,  Takuma Yamamoto

发明人： Makoto Suzuki ,  Kenji Tanimoto ,  Takuma Yamamoto

IPC分类号： H01J37/26

CPC分类号： H01J37/28 ,  H01J37/026 ,  H01J37/20 ,  H01J2237/004 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Since charging characteristics differ between the outer circumferential portion and the center portion of a sample to be inspected, equivalent inspection sensitivities cannot be obtained in the outer circumferential portion and the center portion of the sample to be inspected. A sample cover is provided in the outer circumferential portion of a sample holder on which the sample to be inspected is placed. Charging characteristics of the sample cover are changed according to charging characteristics of the sample to be inspected. Consequently, uniform charged states can be formed in the outer circumferential portion and the center portion of the sample. Inspection/observation of the outer circumferential portion of the sample can be realized at higher sensitivity than in the past.

摘要翻译： 由于待检查样品的外周部分和中心部分的充电特性不同，所以待检样品的外周部分和中心部分不能获得相同的检查灵敏度。 在待检测样品放置的样品架的外周部设置有样品盖。 样品盖的充电特性根据待检样品的充电特性而改变。 因此，可以在样品的外周部分和中心部分形成均匀的带电状态。 可以以比以往更高的灵敏度实现样品的外周部的检查/观察。

公开(公告)号：US20120126118A1

公开(公告)日：2012-05-24

申请号：US13381953

申请日：2010-05-14

申请人： Makoto Suzuki ,  Kenji Tanimoto ,  Takuma Yamamoto

发明人： Makoto Suzuki ,  Kenji Tanimoto ,  Takuma Yamamoto

IPC分类号： H01J37/26 ,  H01J37/20

CPC分类号： H01J37/28 ,  H01J37/026 ,  H01J37/20 ,  H01J2237/004 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Since charging characteristics differ between the outer circumferential portion and the center portion of a sample to be inspected, equivalent inspection sensitivities cannot be obtained in the outer circumferential portion and the center portion of the sample to be inspected. A sample cover is provided in the outer circumferential portion of a sample holder on which the sample to be inspected is placed. Charging characteristics of the sample cover are changed according to charging characteristics of the sample to be inspected. Consequently, uniform charged states can be formed in the outer circumferential portion and the center portion of the sample. Inspection/observation of the outer circumferential portion of the sample can be realized at higher sensitivity than in the past.

摘要翻译： 由于待检查样品的外周部分和中心部分的充电特性不同，所以待检样品的外周部分和中心部分不能获得相同的检查灵敏度。 在待检测样品放置的样品架的外周部设置有样品盖。 样品盖的充电特性根据待检样品的充电特性而改变。 因此，可以在样品的外周部分和中心部分形成均匀的带电状态。 可以以比以往更高的灵敏度实现样品的外周部的检查/观察。

公开(公告)号：US08977058B2

公开(公告)日：2015-03-10

申请号：US13569551

申请日：2012-08-08

申请人： Satoshi Kawata ,  Takuma Yamamoto ,  Yasunori Taguchi ,  Nobuyuki Matsumoto

发明人： Satoshi Kawata ,  Takuma Yamamoto ,  Yasunori Taguchi ,  Nobuyuki Matsumoto

IPC分类号： G06K9/66 ,  G06T5/00 ,  H04N1/409 ,  G06T5/20

CPC分类号： G06T5/002 ,  G06K9/66 ,  G06T5/20 ,  H04N1/409

摘要： According to one embodiment, an image processing apparatus includes following units. The correlation calculation unit calculates correlations between a first region and predetermined first basis vectors. The distance calculation unit calculates distances between the first region and second regions on a subspace generated by the second basis vectors selected from the first basis vectors. The feature quantity calculation unit calculates a feature quantity based on the correlations. The weight calculation unit calculates weights based on the distances and the feature quantity. The pixel value calculation unit calculates a weighted average of pixel values according to the weights to generate an output pixel value.

摘要翻译： 根据一个实施例，图像处理装置包括以下单元。 相关计算单元计算第一区域和预定的第一基本向量之间的相关性。 距离计算单元计算由从第一基本向量中选择的第二基本向量生成的子空间上的第一区域和第二区域之间的距离。 特征量计算单元基于相关性来计算特征量。 权重计算单元基于距离和特征量计算权重。 像素值计算单元根据权重来计算像素值的加权平均值，以生成输出像素值。

公开(公告)号：US08731246B2

公开(公告)日：2014-05-20

申请号：US13221938

申请日：2011-08-31

申请人： Takuma Yamamoto ,  Nao Mishima

发明人： Takuma Yamamoto ,  Nao Mishima

IPC分类号： G06K9/00

CPC分类号： G06T7/238 ,  G06T2207/10016 ,  G06T2207/20021

摘要： A motion vector detection device includes: a matching error calculation part that calculates matching errors between a focus block and each of reference blocks; a least matching error calculation part calculating a least matching error from among the matching errors; a threshold calculation part calculating a threshold value; a correction vector calculation part calculating a correction vector from motion vectors detected in the reference blocks; and a motion vector determination part determining, as a motion vector for the focus block, a relative position vector in a block in which the relative position vector with respect to the focus block is the closest to the correction vector, the block being selected from among the reference blocks in which a difference between the plurality of matching errors and the least matching error is within the threshold value.

摘要翻译： 运动矢量检测装置包括：匹配误差计算部，其计算聚焦块与各参考块之间的匹配误差; 从所述匹配误差中计算最小匹配误差的最小匹配误差计算部; 计算阈值的阈值计算部; 校正矢量计算部分，从参考块中检测的运动矢量计算校正矢量; 以及运动矢量确定部，其确定作为所述焦点块的运动矢量的相对于所述焦点块的相对位置矢量最接近所述校正向量的块中的相对位置矢量，所述块选自 其中多个匹配误差和最小匹配误差之间的差在阈值内的参考块。

公开(公告)号：US20120305768A1

公开(公告)日：2012-12-06

申请号：US13577719

申请日：2011-02-21

申请人： Takuma Yamamoto ,  Takashi Hiroi ,  Yusuke Ominami

发明人： Takuma Yamamoto ,  Takashi Hiroi ,  Yusuke Ominami

IPC分类号： G01N23/225

CPC分类号： H01J37/28 ,  H01J2237/2811 ,  H01J2237/2817 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a circuit-pattern inspection device which enables efficient inspection of a semiconductor wafer by selectively inspecting areas on the semiconductor wafer, such as boundaries between patterns thereon, where defects are likely to occur during the step of producing the semiconductor wafer while changing the beam scanning direction for each area. Two-dimensional beam-deflection control is employed for inspection operations in a continuous-stage-movement-type circuit-pattern inspection device in which only one-dimensional scanning has been employed conventionally. That is, by employing a combination of an electron-beam-deflection control in a first direction parallel to the stage-movement direction and an electron-beam-deflection control in a second direction intersecting the stage-movement direction, it is possible to obtain an image of any desired area for inspection that is set within a swath. The amplitude of deflection signals for the electron-beam-deflection and the rise and fall timings of the signals are suitably controlled according to inspection conditions.

摘要翻译： 提供一种电路图案检查装置，其能够通过选择性地检查半导体晶片上的区域，例如在其上的图案之间的边界上的区域，从而有效地检查半导体晶片，其中在制造半导体晶片的步骤期间可能会发生缺陷，同时改变光束 每个区域的扫描方向。 在通常仅采用一维扫描的连续级移动型电路图案检查装置中，进行二维光束偏转控制。 也就是说，通过在平行于载物台移动方向的第一方向上的电子束偏转控制和与载物台移动方向相交的第二方向上的电子束偏转控制的组合，可以获得 任何所需的检查区域的图像，其设置在条纹内。 根据检查条件适当地控制电子束偏转的偏转信号的幅度和信号的上升和下降定时。

公开(公告)号：US20110211111A1

公开(公告)日：2011-09-01

申请号：US12884746

申请日：2010-09-17

申请人： Nao Mishima ,  Takuma Yamamoto

发明人： Nao Mishima ,  Takuma Yamamoto

IPC分类号： H04N7/01

CPC分类号： H04N7/014 ,  G06T3/40

摘要： According to one embodiment, an apparatus includes a motion estimation unit, a generating unit, a detection unit, and a filtering unit. The motion estimation unit is configured to estimate a first motion vector from a first reference frame to a second reference frame. The generating unit is configured to assign a first pixel value and a second motion vector to an interpolation frame. The detection unit is configured to detect an occlusion region in the interpolation frame. The filtering unit is configured to assign the second motion vector to the occlusion region as a third motion vector, calculate degrees of difference between second pixel values derived from the second motion vectors and third pixel values derived from the third motion vectors, and assign a fourth pixel value derived from a fourth motion vector to the occlusion region, wherein the fourth motion vector is calculated based on the degrees of difference.

摘要翻译： 根据一个实施例，一种装置包括运动估计单元，生成单元，检测单元和滤波单元。 运动估计单元被配置为从第一参考帧估计第一运动矢量到第二参考帧。 生成单元被配置为向内插帧分配第一像素值和第二运动矢量。 检测单元被配置为检测插值帧中的遮挡区域。 滤波单元被配置为将第二运动矢量分配给遮挡区域作为第三运动矢量，计算从第二运动矢量导出的第二像素值与从第三运动矢量导出的第三像素值之间的差异度，并分配第四运动矢量 从第四运动矢量导出到遮挡区域的像素值，其中基于差异度计算第四运动矢量。

公开(公告)号：US09406376B2

公开(公告)日：2016-08-02

申请号：US13405522

申请日：2012-02-27

申请人： Takuma Yamamoto ,  Nao Mishima ,  Yasutoyo Takeyama ,  Toshimitsu Kaneko ,  Toshiyuki Ono

发明人： Takuma Yamamoto ,  Nao Mishima ,  Yasutoyo Takeyama ,  Toshimitsu Kaneko ,  Toshiyuki Ono

IPC分类号： H04N7/12 ,  G11C11/56 ,  G06T7/20 ,  H04N19/56 ,  H04N19/53

CPC分类号： G11C11/5642 ,  G06T7/223 ,  G06T2207/10016 ,  G06T2207/20016 ,  G06T2207/20021 ,  G11C2211/5634 ,  H04N19/53 ,  H04N19/56

摘要： According to one embodiment, a motion vector detection apparatus includes following units. The layering unit generates layers with different resolutions for each of first and second images. The first extraction unit extracts a space candidate vector. The second extraction unit extracts a time candidate vector. The third extraction unit extracts a layer candidate vector. The determination unit determines a motion vector to be assigned to the target block, based on correlations between the target block and blocks, the blocks being located in a layer which corresponds to the second image and being specified by assigning, to the target block, the space, time, and layer candidate vectors.

摘要翻译： 根据一个实施例，运动矢量检测装置包括以下单元。 分层单元为第一和第二图像中的每一个生成具有不同分辨率的层。 第一提取单元提取空间候选向量。 第二提取单元提取时间候选向量。 第三提取单元提取层候选向量。 确定单元基于目标块和块之间的相关性来确定要分配给目标块的运动向量，所述块位于与第二图像对应的层中，并且通过向目标块分配来指定 空间，时间和层候选向量。

公开(公告)号：US20130248709A1

公开(公告)日：2013-09-26

申请号：US13992057

申请日：2011-11-24

申请人： Takuma Yamamoto ,  Takashi Hiroi ,  Hiroshi Miyai

发明人： Takuma Yamamoto ,  Takashi Hiroi ,  Hiroshi Miyai

IPC分类号： H01J37/26

CPC分类号： H01J37/26 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

摘要： A semiconductor wafer 11 is irradiated for scanning with a charged particle beam 6 so as to detect secondary charged particles 9 obtained from the wafer 11 as a result of the irradiation of the beam 6. A detected image of an inspection area obtained based on scanning information and on a detection signal derived from the secondary charged particles 9 is compared with a detected image of a reference area to find a difference therebetween. The difference is compared with a threshold value to detect a defect candidate. Defect information including positional information about the defect candidate is generated in such a manner as to include a relative position of a predetermined feature point within each of repeat patterns formed on the semiconductor wafer 11 with regard to the origin of a coordinate area established in each of these repeat patterns, and a relative position of the defect candidate with regard to the feature point. This contributes to providing a defect inspecting apparatus capable of determining defective areas for extraction by FIB more easily than before.

摘要翻译： 照射半导体晶片11，利用带电粒子束6进行扫描，以便检测由于光束6的照射而从晶片11获得的二次带电粒子9.检测图像根据扫描信息获得 并且将从二次带电粒子9导出的检测信号与检测到的参考区域的图像进行比较，以发现它们之间的差异。 将该差异与阈值进行比较以检测缺陷候选。 生成包括关于缺陷候选的位置信息的缺陷信息，以这样的方式产生：在每个形成在半导体晶片11上的每个重复图案中的预定特征点的相对位置相对于在每个 这些重复图案以及缺陷候选对于特征点的相对位置。 这有助于提供能够比以前更容易地确定由FIB提取的缺陷区域的缺陷检查装置。

公开(公告)号：US20130082177A1

公开(公告)日：2013-04-04

申请号：US13702923

申请日：2011-05-13

申请人： Takashi Hiroi ,  Mari Nozoe ,  Takuma Yamamoto ,  Masaaki Nojiri ,  Mitsuru Okamura

发明人： Takashi Hiroi ,  Mari Nozoe ,  Takuma Yamamoto ,  Masaaki Nojiri ,  Mitsuru Okamura

IPC分类号： H01J37/28 ,  H01J37/20

CPC分类号： H01J37/28 ,  G01N23/2251 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01J37/20 ,  H01J2237/221 ,  H01J2237/2817

摘要： High-speed inspection is performed with appropriate sensitivity according to the pattern density and pattern characteristic of a device.The pixel dimension used in image acquisition is changed in accordance with the pattern density of a device. An image is acquired at high speed by changing the beam scan speed and the stage drive speed in accordance with the pixel dimension and eliminating an error by controlling the amount of beam delay. The acquired image is so resampled that the image dimensions of the acquired image and a reference image are equally sized, and the acquired image and the reference image are then aligned with each other. The aligned images are resampled in accordance with a preset pixel dimension to extract a difference between the images with the sensitivity according to the pixel dimension.

摘要翻译： 根据设备的图案密度和图案特性，以适当的灵敏度进行高速检查。 图像采集中使用的像素尺寸根据设备的图案密度而改变。 通过根据像素尺寸改变光束扫描速度和平台驱动速度，通过控制光束延迟量来消除误差，高速获取图像。 所获取的图像被如此重新采样，使得所获取的图像和参考图像的图像尺寸的大小相等，并且获取的图像和参考图像然后彼此对准。 对准的图像根据预设的像素尺寸重新采样，以根据像素尺寸提取具有灵敏度的图像之间的差异。

公开(公告)号：US20130271595A1

公开(公告)日：2013-10-17

申请号：US13978095

申请日：2011-11-11

申请人： Takashi Hiroi ,  Masaaki Nojiri ,  Takuma Yamamoto ,  Taku Ninomiya

发明人： Takashi Hiroi ,  Masaaki Nojiri ,  Takuma Yamamoto ,  Taku Ninomiya

IPC分类号： G06T7/00

CPC分类号： G06T7/0004 ,  G01B15/00 ,  G01N23/2251 ,  G01N2223/611 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided are a high speed circuit pattern inspecting method and inspecting device which have a short preparation time for inspection and are capable of determining a defect by detecting only an image of one die. A coordinate which is expected to obtain the same pattern as a corresponding coordinate and an alignment coordinate are selected by referring to design information. The detected image and the design information are aligned using the alignment coordinate to correct the deviated amount and a pattern of the corresponding coordinate is compared with a pattern of the coordinate which is expected to obtain the same pattern to compare the patterns by detecting only an image of one die.

摘要翻译： 提供了一种具有短的准备时间进行检查的高速电路图形检查方法和检查装置，并且能够仅检测一个管芯的图像来确定缺陷。 通过参考设计信息来选择期望获得与相应坐标和对准坐标相同的图案的坐标。 使用对准坐标校正检测图像和设计信息以校正偏移量，并将相应坐标的图案与预期获得相同图案的坐标图案进行比较，以通过仅检测图像来比较图案 一个死亡