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    Curable organopolysiloxane composition and semiconductor device
    3.
    发明授权
    Curable organopolysiloxane composition and semiconductor device 有权
    可固化有机聚硅氧烷组合物和半导体器件

    公开(公告)号：US08080614B2

    公开(公告)日：2011-12-20

    申请号：US12306049

    申请日：2007-06-18

    申请人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Makoto Yoshitake

    发明人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Makoto Yoshitake

    IPC分类号： C08L83/04

    CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  H01L2224/48091 ,  H01L2924/1301 ,  C08L83/00 ,  C08L2666/14 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R13SiO(R12SiO)mSiR13 (where R1 is a monovalent hydrocarbon group, and “m” is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (R2SiO3/2)a(R22SiO2/2)b(R23SiO1/2)c (where R2 is a monovalent hydrocarbon group, and “a”, “b”, and “c” are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.

    摘要翻译： 可固化的有机聚硅氧烷组合物至少包含以下组分：由以下通式表示的有机聚硅氧烷（A）：R13SiO（R12SiO）mSiR13（其中R1是一价烃基，“m”是0-100的整数）; 由下列平均单元式表示的有机聚硅氧烷（B）：（R2SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（其中R2是一价烃基，“a”，“b”和 “c”是具体数字）; 在一个分子中平均具有至少两个与硅键合的芳基和平均至少两个与硅键合的氢原子的有机聚硅氧烷（C）; 和氢化硅烷化反应催化剂（D）; 其特征在于良好的填充性和固化性，并且当固化时，形成具有高折射率，高透光率和对各种基材的强粘附性的固化体。

    Curable Organopolysiloxane Composition and Semiconductor Device
    4.
    发明申请
    Curable Organopolysiloxane Composition and Semiconductor Device 有权
    固化有机聚硅氧烷组合物和半导体器件

    公开(公告)号：US20090179180A1

    公开(公告)日：2009-07-16

    申请号：US12306049

    申请日：2007-06-18

    申请人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Makoto Yoshitake

    发明人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Makoto Yoshitake

    IPC分类号： C08F283/12 ,  H01J63/02

    CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  H01L2224/48091 ,  H01L2924/1301 ,  C08L83/00 ,  C08L2666/14 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R13SiO(R12SiO)mSiR13 (where R1 is a monovalent hydrocarbon group, and “m” is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (R2SiO3/2)a(R22SiO2/2)b(R23SiO1/2)c (where R2 is a monovalent hydrocarbon group, and “a”, “b”, and “c” are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.

    摘要翻译： 可固化的有机基聚硅氧烷组合物至少包含以下组分：由以下通式表示的有机聚硅氧烷（A）：R13SiO（R12SiO）mSiR13（其中R1是一价烃基，“m”是0-100的整数）; 由下列平均单元式表示的有机聚硅氧烷（B）：（R2SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（其中R2是一价烃基，“a”，“b”和 “c”是具体数字）; 在一个分子中平均具有至少两个与硅键合的芳基并且平均具有至少两个与硅键合的氢原子的有机聚硅氧烷（C）; 和氢化硅烷化反应催化剂（D）; 其特征在于良好的填充性和固化性，并且当固化时，形成具有高折射率，高透光率和对各种基材的强粘附性的固化体。

    Curable organopolysiloxane composition and semiconductor device
    5.
    发明申请
    Curable organopolysiloxane composition and semiconductor device 有权
    固化有机聚硅氧烷组合物和半导体器件

    公开(公告)号：US20070112147A1

    公开(公告)日：2007-05-17

    申请号：US10573505

    申请日：2004-09-14

    申请人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Tomoko Kato

    发明人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Tomoko Kato

    IPC分类号： C08L83/04 ,  H01L21/56 ,  B32B27/00

    CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1301 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO2/3, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.

    摘要翻译： 一种可固化的有机聚硅氧烷组合物，其包含（A）每分子具有至少两个烯基和至少一个芳基的直链有机聚硅氧烷，（B）每分子具有至少一个烯基和至少一个芳基的支链有机聚硅氧烷，并具有硅氧烷 由以下通式表示的单元：RsiO 2/3，（C）分子链的两个末端被每分子具有至少一个芳基的硅键合氢原子封闭的直链有机聚硅氧烷和（ D）硅氢化反应催化剂，以及其半导体元件涂覆有上述组合物的固化产物的半导体器件。 可固化的有机基聚硅氧烷组合物显示出低粘度，优异的填充性能和固化性，并且固化性优异，可以形成具有大折射率，高透光率和对基材的高粘附性的软化固化物，以及半导体器件显示出优异的可靠性。

    Curable organopolysiloxane composition and semiconductor device
    6.
    发明授权
    Curable organopolysiloxane composition and semiconductor device 有权
    固化有机聚硅氧烷组合物和半导体器件

    公开(公告)号：US07527871B2

    公开(公告)日：2009-05-05

    申请号：US10573505

    申请日：2004-09-14

    申请人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Tomoko Kato

    发明人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Tomoko Kato

    IPC分类号： B32B9/04 ,  C08L83/04

    CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1301 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO2/3, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.

    摘要翻译： 一种可固化的有机聚硅氧烷组合物，其包含（A）每分子具有至少两个烯基和至少一个芳基的直链有机聚硅氧烷，（B）每分子具有至少一个烯基和至少一个芳基的支链有机聚硅氧烷，并具有硅氧烷 由以下通式表示的单元：RsiO2 / 3，（C）分子链的两个末端被每个分子具有至少一个芳基的硅键合氢原子封闭的线性有机聚硅氧烷，（D）硅氢化反应催化剂，和 其半导体元件用上述组成的固化产物涂覆的半导体器件。 可固化的有机基聚硅氧烷组合物显示出低粘度，优异的填充性能和固化性，并且固化性优异，可以形成具有大折射率，高透光率和对基材的高粘附性的软化固化物，以及半导体器件显示出优异的可靠性。

    Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
    7.
    发明授权
    Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device 有权
    可固化的有机聚硅氧烷组合物，光学半导体元件密封剂和光学半导体器件

    公开(公告)号：US08373286B2

    公开(公告)日：2013-02-12

    申请号：US13062374

    申请日：2009-09-04

    申请人： Makoto Yoshitake ,  Hiroji Enami ,  Tomoko Kato ,  Masayoshi Terada

    发明人： Makoto Yoshitake ,  Hiroji Enami ,  Tomoko Kato ,  Masayoshi Terada

    IPC分类号： H01L23/29

    CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  C08L83/00 ,  H01L2924/00

    摘要： A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.

    摘要翻译： 一种可固化的有机聚硅氧烷组合物和光学半导体元件密封剂，每个包含（A）具有至少2个烯基的二有机聚硅氧烷，其中所有硅氧烷单元的至少70摩尔％是甲基苯基硅氧烷单元， 三甲基-1,3,5-三苯基环三硅氧烷和1,3,5,7-四甲基-1,3,5,7-四苯基环四硅氧烷不超过5重量％，（B）具有至少2个硅键合的有机聚硅氧烷 其中至少15摩尔％的与硅键合的有机基团是苯基的氢原子，和（C）氢化硅烷化反应催化剂。 一种光学半导体器件，其中壳体内的光学半导体元件由上述组合物用固化产物密封。

    Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, and Optical Semiconductor Device
    8.
    发明申请
    Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, and Optical Semiconductor Device 有权
    固化有机聚硅氧烷组合物，光半导体元件密封剂和光半导体器件

    公开(公告)号：US20110227235A1

    公开(公告)日：2011-09-22

    申请号：US13062374

    申请日：2009-09-04

    申请人： Makoto Yoshitake ,  Hiroji Enami ,  Tomoko Kato ,  Masayoshi Terada

    发明人： Makoto Yoshitake ,  Hiroji Enami ,  Tomoko Kato ,  Masayoshi Terada

    IPC分类号： H01L23/28 ,  C08G77/04

    CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  C08L83/00 ,  H01L2924/00

    摘要： A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.

    摘要翻译： 一种可固化的有机聚硅氧烷组合物和光学半导体元件密封剂，每个包含（A）具有至少2个烯基的二有机聚硅氧烷，其中所有硅氧烷单元的至少70摩尔％是甲基苯基硅氧烷单元， 三甲基-1,3,5-三苯基环三硅氧烷和1,3,5,7-四甲基-1,3,5,7-四苯基环四硅氧烷不超过5重量％，（B）具有至少2个硅键合的有机聚硅氧烷 其中至少15摩尔％的与硅键合的有机基团是苯基的氢原子，和（C）氢化硅烷化反应催化剂。 一种光学半导体器件，其中壳体内的光学半导体元件由上述组合物用固化产物密封。

    Method of manufacturing a layered silicone composite material
    9.
    发明申请
    Method of manufacturing a layered silicone composite material 有权
    层状有机硅复合材料的制造方法

    公开(公告)号：US20070134425A1

    公开(公告)日：2007-06-14

    申请号：US10580798

    申请日：2004-11-24

    申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

    发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

    IPC分类号： B05D3/02 ,  B32B9/04

    CPC分类号： C08J7/047 ,  C08J2383/04 ,  C08J2483/00 ,  C08K5/56 ,  C09D183/04 ,  Y10T428/31663 ,  C08L83/00

    摘要： A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.

    摘要翻译： 一种制备层状硅氧烷复合材料的方法，包括以下步骤：将含有第二粘合促进剂的第二可加成固化的有机聚硅氧烷组合物施加到通过固化含有第一粘合促进剂的第一可加成固化的有机聚硅氧烷组合物形成的第一硅氧烷层上 并且其中第一硅氧烷层具有小于JIS A 50的硬度; 并通过固化所述第二可加成固化的有机基聚硅氧烷组合物形成硬度为JIS A 50或更高的第二硅氧烷层。