公开(公告)号：US20050257684A1

公开(公告)日：2005-11-24

申请号：US11133848

申请日：2005-05-20

申请人： Manabu Sugiura ,  Takahiro Sugioka ,  Hiroyuki Kawaura ,  Takao Kobayashi ,  Goro Watanabe ,  Kenichi Suzuki ,  Hideo Tachikawa ,  Hideo Hasegawa

发明人： Manabu Sugiura ,  Takahiro Sugioka ,  Hiroyuki Kawaura ,  Takao Kobayashi ,  Goro Watanabe ,  Kenichi Suzuki ,  Hideo Tachikawa ,  Hideo Hasegawa

IPC分类号： C08J5/16 ,  C08J5/18 ,  C09D5/00 ,  C10M125/02 ,  C10M125/22 ,  C10M147/00 ,  F01B3/00 ,  F04B27/10

CPC分类号： C10M103/00 ,  C10M105/50 ,  C10M131/00 ,  C10M2201/003 ,  C10M2201/041 ,  C10M2201/0413 ,  C10M2201/061 ,  C10M2201/0613 ,  C10M2201/065 ,  C10M2201/0653 ,  C10M2201/066 ,  C10M2201/0663 ,  C10M2201/081 ,  C10M2213/02 ,  C10M2213/023 ,  C10M2213/062 ,  C10M2213/0623 ,  C10N2240/30 ,  C10N2250/18 ,  F04B27/1054 ,  F05C2201/049 ,  F05C2201/0493 ,  F05C2251/14 ,  F05C2253/12 ,  F05C2253/20

摘要： A sliding film includes a solid lubricant, a binder resin, and a low-melting-point material. The binder resin is for holding the solid lubricant on a surface of a substrate, and exhibits a glass transition temperature. The low-melting-point material exhibits a melting point lower than the glass transition temperature of the binder resin. The low-melting-point material demonstrates a latent heat which can absorb frictional heat generated between sliding members, and accordingly retards the degradation of the binder resin. As a result, the sliding film produces high seizure resistance.

摘要翻译： 滑动膜包括固体润滑剂，粘合剂树脂和低熔点材料。 粘合剂树脂用于将固体润滑剂保持在基材的表面上，并显示玻璃化转变温度。 低熔点材料的熔点低于粘合剂树脂的玻璃化转变温度。 低熔点材料表现出潜热，其可以吸收滑动构件之间产生的摩擦热，并因此延缓粘合剂树脂的降解。 结果，滑膜产生高的耐咬住性。

公开(公告)号：US07331274B2

公开(公告)日：2008-02-19

申请号：US11133848

申请日：2005-05-20

申请人： Manabu Sugiura ,  Takahiro Sugioka ,  Hiroyuki Kawaura ,  Takao Kobayashi ,  Goro Watanabe ,  Kenichi Suzuki ,  Hideo Tachikawa ,  Hideo Hasegawa

发明人： Manabu Sugiura ,  Takahiro Sugioka ,  Hiroyuki Kawaura ,  Takao Kobayashi ,  Goro Watanabe ,  Kenichi Suzuki ,  Hideo Tachikawa ,  Hideo Hasegawa

IPC分类号： F01B3/00 ,  F01B31/10

CPC分类号： C10M103/00 ,  C10M105/50 ,  C10M131/00 ,  C10M2201/003 ,  C10M2201/041 ,  C10M2201/0413 ,  C10M2201/061 ,  C10M2201/0613 ,  C10M2201/065 ,  C10M2201/0653 ,  C10M2201/066 ,  C10M2201/0663 ,  C10M2201/081 ,  C10M2213/02 ,  C10M2213/023 ,  C10M2213/062 ,  C10M2213/0623 ,  C10N2240/30 ,  C10N2250/18 ,  F04B27/1054 ,  F05C2201/049 ,  F05C2201/0493 ,  F05C2251/14 ,  F05C2253/12 ,  F05C2253/20

摘要： A sliding film includes a solid lubricant, a binder resin, and a low-melting-point material. The binder resin is for holding the solid lubricant on a surface of a substrate, and exhibits a glass transition temperature. The low-melting-point material exhibits a melting point lower than the glass transition temperature of the binder resin. The low-melting-point material demonstrates a latent heat which can absorb frictional heat generated between sliding members, and accordingly retards the degradation of the binder resin. As a result, the sliding film produces high seizure resistance.

摘要翻译： 滑动膜包括固体润滑剂，粘合剂树脂和低熔点材料。 粘合剂树脂用于将固体润滑剂保持在基材的表面上，并显示玻璃化转变温度。 低熔点材料的熔点低于粘合剂树脂的玻璃化转变温度。 低熔点材料表现出潜热，其可以吸收滑动构件之间产生的摩擦热，并因此延缓粘合剂树脂的降解。 结果，滑膜产生高的耐咬住性。

公开(公告)号：US07721642B2

公开(公告)日：2010-05-25

申请号：US12021673

申请日：2008-01-29

申请人： Takahiro Sugioka ,  Takayuki Kato ,  Shuichi Yasuda ,  Atsushi Saito ,  Masahiro Suzuki ,  Hitotoshi Murase ,  Takashi Iseki ,  Hideo Tachikawa ,  Kazuyuki Nakanishi ,  Takao Kobayashi ,  Ken-ichi Suzuki

发明人： Takahiro Sugioka ,  Takayuki Kato ,  Shuichi Yasuda ,  Atsushi Saito ,  Masahiro Suzuki ,  Hitotoshi Murase ,  Takashi Iseki ,  Hideo Tachikawa ,  Kazuyuki Nakanishi ,  Takao Kobayashi ,  Ken-ichi Suzuki

IPC分类号： F01B31/10

CPC分类号： F04B27/1054 ,  F05C2203/0817 ,  F05C2203/0882 ,  F05C2225/00 ,  F05C2251/14 ,  F05C2253/12 ,  F16C33/201

摘要： To provide a sliding member that exhibits excellent durability and is free of lead. A swash plate for a compressor as the sliding member of the invention contains a base material having on the surface thereof a sliding layer constituting at least a sliding surface, on which shoes slide. The sliding layer contains a first layer that contains an amorphous hard carbon (diamond-like carbon) film containing Si (DLC-Si film) and is formed on the base material, and a second layer that is formed on the first layer and contains polyamideimide (PAI) containing a solid lubricant such as MoS2.

摘要翻译： 提供具有优异耐久性且不含铅的滑动构件。 作为本发明的滑动构件的压缩机的斜盘包含基材，其表面上具有至少构成滑动面的滑动层，滑块滑动。 滑动层含有含有Si（DLC-Si膜）的无定形硬碳（类金刚石碳）薄膜并形成在基材上的第一层，第二层形成在第一层上并含有聚酰胺酰亚胺 （PAI），其包含固体润滑剂如MoS2。

公开(公告)号：US20080190284A1

公开(公告)日：2008-08-14

申请号：US12021673

申请日：2008-01-29

申请人： Takahiro Sugioka ,  Takayuki Kato ,  Shuichi Yasuda ,  Atsushi Saito ,  Masahiro Suzuki ,  Hitotoshi Murase ,  Takashi Iseki ,  Hideo Tachikawa ,  Kazuyuki Nakanishi ,  Takao Kobayashi ,  Ken-ichi Suzuki

发明人： Takahiro Sugioka ,  Takayuki Kato ,  Shuichi Yasuda ,  Atsushi Saito ,  Masahiro Suzuki ,  Hitotoshi Murase ,  Takashi Iseki ,  Hideo Tachikawa ,  Kazuyuki Nakanishi ,  Takao Kobayashi ,  Ken-ichi Suzuki

IPC分类号： F04B39/00 ,  F04B27/10 ,  F01B3/02

CPC分类号： F04B27/1054 ,  F05C2203/0817 ,  F05C2203/0882 ,  F05C2225/00 ,  F05C2251/14 ,  F05C2253/12 ,  F16C33/201

摘要： To provide a sliding member that exhibits excellent durability and is free of lead. A swash plate for a compressor as the sliding member of the invention contains a base material having on the surface thereof a sliding layer constituting at least a sliding surface, on which shoes slide. The sliding layer contains a first layer that contains an amorphous hard carbon (diamond-like carbon) film containing Si (DLC-Si film) and is formed on the base material, and a second layer that is formed on the first layer and contains polyamideimide (PAI) containing a solid lubricant such as MoS2.

摘要翻译： 提供具有优异耐久性且不含铅的滑动构件。 作为本发明的滑动构件的压缩机的斜盘包含基材，其表面上具有至少构成滑动面的滑动层，滑块滑动。 滑动层含有含有Si（DLC-Si膜）的无定形硬碳（类金刚石碳）薄膜并形成在基材上的第一层，第二层形成在第一层上并含有聚酰胺酰亚胺 （PAI），其包含固体润滑剂如MoS 2。

公开(公告)号：US07396735B2

公开(公告)日：2008-07-08

申请号：US10538222

申请日：2003-12-09

申请人： Kazuyuki Nakanishi ,  Tadashi Oshima ,  Hideo Hasegawa ,  Hiroyuki Mori ,  Hideo Tachikawa ,  Yukio Miyachi ,  Yasushi Yamada ,  Hiroyuki Ueda ,  Masayasu Ishiko

发明人： Kazuyuki Nakanishi ,  Tadashi Oshima ,  Hideo Hasegawa ,  Hiroyuki Mori ,  Hideo Tachikawa ,  Yukio Miyachi ,  Yasushi Yamada ,  Hiroyuki Ueda ,  Masayasu Ishiko

IPC分类号： H01L21/76

CPC分类号： H01L23/3732 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor element heat dissipating member is provided which has excellent heat dissipation characteristics and adhesion characteristics and enables production of a semiconductor device at a low cost. A semiconductor device using the same, and a method of producing the same are also provided. The semiconductor element heat dissipating member has a conductive substrate and an electrically insulating amorphous carbon film containing hydrogen, and the electrically insulating amorphous carbon film is formed at least on a region of the conductive substrate on which region a semiconductor element is to be mounted.

摘要翻译： 提供了具有优异的散热特性和粘合特性的半导体元件散热构件，并且能够以低成本制造半导体器件。 还提供了使用该半导体器件的半导体器件及其制造方法。 半导体元件散热构件具有导电基板和含有氢的电绝缘非晶碳膜，并且至少在导电基板的要安装半导体元件的区域的区域上形成电绝缘非晶碳膜。

公开(公告)号：US20060057768A1

公开(公告)日：2006-03-16

申请号：US10538222

申请日：2003-12-09

申请人： Kazuyuki Nakanishi ,  Tadashi Oshima ,  Hideo Hasegawa ,  Hiroyuki Mori ,  Hideo Tachikawa ,  Yukio Miyachi ,  Yasushi Yamada ,  Hiroyuki Ueda ,  Masayasu Ishiko

发明人： Kazuyuki Nakanishi ,  Tadashi Oshima ,  Hideo Hasegawa ,  Hiroyuki Mori ,  Hideo Tachikawa ,  Yukio Miyachi ,  Yasushi Yamada ,  Hiroyuki Ueda ,  Masayasu Ishiko

IPC分类号： H01L21/44

CPC分类号： H01L23/3732 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor element heat dissipating member is provided which has excellent heat dissipation characteristics and adhesion characteristics and enables production of a semiconductor device at a low cost. A semiconductor device using the same, and a method of producing the same are also provided. The semiconductor element heat dissipating member has a conductive substrate and an electrically insulating amorphous carbon film containing hydrogen, and the electrically insulating amorphous carbon film is formed at least on a region of the conductive substrate on which region a semiconductor element is to be mounted.

摘要翻译： 提供了具有优异的散热特性和粘合特性的半导体元件散热构件，并且能够以低成本制造半导体器件。 还提供了使用该半导体器件的半导体器件及其制造方法。 半导体元件散热构件具有导电基板和含有氢的电绝缘非晶碳膜，并且至少在导电基板的要安装半导体元件的区域的区域上形成电绝缘非晶碳膜。

公开(公告)号：US07455824B2

公开(公告)日：2008-11-25

申请号：US11002125

申请日：2004-12-03

申请人： Kazuyuki Nakanishi ,  Tadashi Oshima ,  Hideo Hasegawa ,  Hiroyuki Mori ,  Takashi Iseki ,  Hideo Tachikawa ,  Munehisa Matsui

发明人： Kazuyuki Nakanishi ,  Tadashi Oshima ,  Hideo Hasegawa ,  Hiroyuki Mori ,  Takashi Iseki ,  Hideo Tachikawa ,  Munehisa Matsui

IPC分类号： B32B9/00

CPC分类号： C23C16/26 ,  Y10T428/30

摘要： To provide a soft amorphous carbon exhibiting a low elastic modulus, an amorphous-carbon coated member provided with a coated film comprising the amorphous carbon, and a process for forming an amorphous carbon film. The amorphous carbon comprises carbon as a major component and hydrogen in an amount of from more than 30 atomic % to 60 atomic % or less, and exhibits an elastic modulus of from 40 or more to 150 GPa or less. Moreover, the amorphous-carbon coated member comprises a conductive substrate, and a coated film fixed on at least a part of a surface of the substrate and composed of the amorphous carbon. In addition, in a process for forming the amorphous-carbon coated film, an amorphous carbon film is formed on a surface of conductive substrates by a plasma CVD method. Not only a plurality of the substrates are disposed on a substrate holder, which is disposed in a film-forming furnace and is connected with a negative electrode, in such a state that they face to each other, but also a processing gas pressure and a plasma power source are operated so as to overlap negative glows of the neighboring two substrates.

摘要翻译： 为了提供具有低弹性模量的软无定形碳，设置有包含无定形碳的涂膜的非晶碳涂覆部件以及形成非晶碳膜的方法。 无定形碳包含碳为主要成分，氢为超过30原子％至60原子％以下的量，弹性模量为40以上且150GPa以下。 此外，无定形碳涂覆部件包括导电基板和固定在基板表面的至少一部分上并由非晶碳构成的涂膜。 另外，在形成非晶碳涂膜的方法中，通过等离子体CVD法在导电性基板的表面上形成无定形碳膜。 不仅多个基板被设置在基板保持器上，所述基板保持器设置在成膜炉中并且与负极连接，并且彼此相对的状态，而且处理气体压力和 等离子体动力源被操作成与相邻两个基板的负发光重叠。

公开(公告)号：US20050142361A1

公开(公告)日：2005-06-30

申请号：US11002125

申请日：2004-12-03

申请人： Kazuyuki Nakanishi ,  Tadashi Oshima ,  Hideo Hasegawa ,  Hiroyuki Mori ,  Takashi Iseki ,  Hideo Tachikawa ,  Munehisa Matsui

发明人： Kazuyuki Nakanishi ,  Tadashi Oshima ,  Hideo Hasegawa ,  Hiroyuki Mori ,  Takashi Iseki ,  Hideo Tachikawa ,  Munehisa Matsui

IPC分类号： C01B31/02 ,  B32B9/00 ,  C23C16/26 ,  H01L21/205 ,  H05H1/24

CPC分类号： C23C16/26 ,  Y10T428/30

摘要： To provide a soft amorphous carbon exhibiting a low elastic modulus, an amorphous-carbon coated member provided with a coated film comprising the amorphous carbon, and a process for forming an amorphous carbon film. The amorphous carbon comprises carbon as a major component and hydrogen in an amount of from more than 30 atomic % to 60 atomic % or less, and exhibits an elastic modulus of from 40 or more to 150 GPa or less. Moreover, the amorphous-carbon coated member comprises a conductive substrate, and a coated film fixed on at least a part of a surface of the substrate and composed of the amorphous carbon. In addition, in a process for forming the amorphous-carbon coated film, an amorphous carbon film is formed on a surface of conductive substrates by a plasma CVD method. Not only a plurality of the substrates are disposed on a substrate holder, which is disposed in a film-forming furnace and is connected with a negative electrode, in such a state that they face to each other, but also a processing gas pressure and a plasma power source are operated so as to overlap negative glows of the neighboring two substrates.

摘要翻译： 为了提供具有低弹性模量的软无定形碳，设置有包含无定形碳的涂膜的非晶碳涂覆部件以及形成非晶碳膜的方法。 无定形碳包含碳为主要成分，氢为超过30原子％至60原子％以下的量，弹性模量为40以上且150GPa以下。 此外，无定形碳涂覆部件包括导电基板和固定在基板表面的至少一部分上并由非晶碳构成的涂膜。 另外，在形成非晶碳涂膜的方法中，通过等离子体CVD法在导电性基板的表面上形成无定形碳膜。 不仅多个基板被设置在基板保持器上，所述基板保持器设置在成膜炉中并且与负极连接，并且彼此相对的状态，而且处理气体压力和 等离子体动力源被操作成与相邻两个基板的负发光重叠。

公开(公告)号：US07507305B2

公开(公告)日：2009-03-24

申请号：US10580463

申请日：2004-12-10

申请人： Minoru Kawasaki ,  Tadashi Oshima ,  Takao Kobayashi ,  Kazuyuki Nakanishi ,  Hideo Tachikawa

发明人： Minoru Kawasaki ,  Tadashi Oshima ,  Takao Kobayashi ,  Kazuyuki Nakanishi ,  Hideo Tachikawa

IPC分类号： C22C9/06

CPC分类号： C22C9/06 ,  C22C9/00

摘要： This aims to provide a wear-resistant copper-based alloy, which is advantages in not only enhancing wear resistance in a high temperature range but also enhancing crack resistance and machinability and which is especially suitable for forming a cladding layer. The wear-resistant copper-based alloy comprises, by weight, 4.7 to 22.0% nickel, 0.5 to 5.0% silicon, 2.7 to 22.0% iron, 1.0 to 15.0% chromium, 0.01 to 2.00% cobalt, 2.7 to 22.0% one or more of tantalum, titanium, zirconium and hafnium, and the balance of copper with inevitable impurities.

摘要翻译： 本发明的目的在于提供一种耐磨铜基合金，其优点在于不仅在高温范围内提高耐磨性，而且提高抗裂性和切削性，特别适合于形成包覆层。 耐磨铜基合金按重量计含有4.7〜22.0％的镍，0.5〜5.0％的硅，2.7〜22.0％的铁，1.0〜15.0％的铬，0.01〜2.00％的钴，2.7〜22.0％的一种或多种 的钽，钛，锆和铪，余量为铜与不可避免的杂质。

公开(公告)号：US20070125458A1

公开(公告)日：2007-06-07

申请号：US10580463

申请日：2004-12-10

申请人： Minoru Kawasaki ,  Tadashi Oshima ,  Takao Kobayashi ,  Kazuyuki Nakanishi ,  Hideo Tachikawa

发明人： Minoru Kawasaki ,  Tadashi Oshima ,  Takao Kobayashi ,  Kazuyuki Nakanishi ,  Hideo Tachikawa

IPC分类号： C22C9/06 ,  C22C9/00

CPC分类号： C22C9/06 ,  C22C9/00

摘要： This aims to provide a wear-resistant copper-based alloy, which is advantages in not only enhancing wear resistance in a high temperature range but also enhancing crack resistance and machinability and which is especially suitable for forming a cladding layer. The wear-resistant copper-based alloy comprises, by weight, 4.7 to 22.0% nickel, 0.5 to 5.0% silicon, 2.7 to 22.0% iron, 1.0 to 15.0% chromium, 0.01 to 2.00% cobalt, 2.7 to 22.0% one or more of tantalum, titanium, zirconium and hafnium, and the balance of copper with inevitable impurities.

摘要翻译： 本发明的目的在于提供一种耐磨铜基合金，其优点在于不仅在高温范围内提高耐磨性，而且提高抗裂性和切削性，特别适合于形成包覆层。 耐磨铜基合金按重量计含有4.7〜22.0％的镍，0.5〜5.0％的硅，2.7〜22.0％的铁，1.0〜15.0％的铬，0.01〜2.00％的钴，2.7〜22.0％的一种或多种 的钽，钛，锆和铪，余量为铜与不可避免的杂质。