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    High speed response temperature sensor
    5.
    发明授权
    High speed response temperature sensor 失效
    高速响应温度传感器

    公开(公告)号：US4688949A

    公开(公告)日：1987-08-25

    申请号：US880819

    申请日：1986-07-01

    申请人： Tsukasa Hatakenaka

    发明人： Tsukasa Hatakenaka

    IPC分类号： G01K1/18 ,  G01K7/22 ,  G01K1/14

    CPC分类号： G01K7/223 ,  G01K1/18

    摘要： In this high speed response type temperature sensor, a base body member is formed as a hollow tube with one closed end and one open end, and a temperature sensitive sensor layer is formed over at least part of its external surface. An electrode layer is arranged at at least a part of the periphery of the open end of the base body member, in contact with a part of the temperature sensitive sensor layer, and a protective cover layer is formed over at least a part of the sensor layer. Thus, since this sensor layer is formed on the external surface of the hollow tubular base body member, the opposing and contacting area between the sensor layer and the object whose temperature is to be measured becomes relatively large, and the distance therebetween is also reduced, so that the efficiency of heat conduction from the object to the sensor layer is greatly improved. Because the base body member is hollow, also, the overall heat capacity is greatly reduced. Accordingly, good and quick response of this temperature sensor are obtained, and accuracy is improved. Further, this sensor is relatively easy and cheap to manufacture.

    摘要翻译： 在该高速响应型温度传感器中，基体部件形成为具有一个封闭端和一个开口端的中空管，并且在其外表面的至少一部分上形成温度敏感传感器层。 电极层设置在基体部件的开口端的周边的至少一部分上，与感温传感器层的一部分接触，在传感器的至少一部分上形成保护覆盖层 层。 因此，由于该传感器层形成在中空管状基体部件的外表面上，所以传感器层与待测温度的物体之间的相对接触面积相对较大，并且其间的距离也变小， 使得从物体到传感器层的热传导效率大大提高。 因为基体部件是中空的，所以总体热容大大降低。 因此，获得了该温度传感器的良好且快速的响应，提高了精度。 此外，该传感器相对容易且制造便宜。