Power electronic device of multi-drain type integrated on a semiconductor substrate and relative manufacturing process

    公开(公告)号:US20060194391A1

    公开(公告)日:2006-08-31

    申请号:US11362435

    申请日:2006-02-23

    IPC分类号: H01L21/336

    摘要: A power electronic device is integrated on a semiconductor substrate of a first type of conductivity. The device includes a plurality of elemental units, and each elemental unit includes a body region of a second type of conductivity which is realized on a semiconductor layer of the first type of conductivity formed on the semiconductor substrate, and a column region of the first type of conductivity which is realized in said semiconductor layer below the body region. The semiconductor layer includes multiple semiconductor layers which overlap each other. The resistivity of each layer is different from that of the other layers. The column region includes a plurality of doped sub-regions, each realized in one of the semiconductor layers. The amount of charge of each doped sub-region balances the amount of charge of the corresponding semiconductor layer in which each doped sub-region is realized.

    Integrated device with Schottky diode and MOS transistor and related manufacturing process
    2.
    发明授权
    Integrated device with Schottky diode and MOS transistor and related manufacturing process 有权
    集成器件采用肖特基二极管和MOS晶体管及相关制造工艺

    公开(公告)号:US07071062B2

    公开(公告)日:2006-07-04

    申请号:US11023957

    申请日:2004-12-28

    IPC分类号: H01L21/336

    摘要: An integrated device comprising a MOS transistor and a Schottky diode which are formed on a semiconductor substrate of a first conductivity type is shown. The device comprises a plurality of body region stripes of a second conductivity type which are adjacent and parallel to each other, a first metal layer placed over said substrate and a second metal layer placed under said substrate. The device comprises a plurality of elementary structures parallel to each other each one of which comprises first zones provided with a silicon oxide layer placed over a portion of the substrate which is comprised between two adjacent body region stripes, a polysilicon layer superimposed to the silicon oxide layer, a dielectric layer placed over and around the polysilicon layer. Some body region stripes comprise source regions of the first conductivity type which are placed adjacent to the first zones of the elementary structures to form elementary cells of said MOS transistor. The elementary structures and the body regions stripes extend longitudinally in a transversal way to the formation of the channel in the elementary cells of the MOS transistor and the first metal layer contacts the source regions. At least one elementary structure comprises at least a second zone adapted to allow the direct contact between the first metal layer and the underlying substrate portion arranged between two adjacent body regions stripes to perform the Schottky diode.

    摘要翻译: 示出了包括形成在第一导电类型的半导体衬底上的MOS晶体管和肖特基二极管的集成器件。 该装置包括彼此相邻并平行的第二导电类型的多个体区条纹,放置在所述基底上的第一金属层和置于所述基底下的第二金属层。 该器件包括彼此平行的多个基本结构,每个基本结构包括第一区域,该第一区域设置有位于两个相邻体区条纹之间的衬底的一部分上的氧化硅层,叠加到氧化硅上的多晶硅层 层,放置在多晶硅层上方和周围的介电层。 一些体区条纹包括与基本结构的第一区相邻放置的第一导电类型的源区,以形成所述MOS晶体管的元件。 基本结构和体区条纹以横向方式纵向延伸,以在MOS晶体管的基本单元中形成沟道,并且第一金属层接触源极区。 至少一个基本结构包括至少第二区域,适于允许第一金属层与布置在两个相邻体区条纹之间的下面的基底部分之间的直接接触以执行肖特基二极管。

    MOS technology power device
    3.
    发明授权
    MOS technology power device 有权
    MOS技术电源设备

    公开(公告)号:US06404010B2

    公开(公告)日:2002-06-11

    申请号:US09860809

    申请日:2001-05-17

    IPC分类号: H01L2976

    摘要: A MOS technology power device is described which comprises a plurality of elementary active units and a part of said power device which is placed between zones where the elementary active units are formed. The part of the power device comprises at least two heavily doped body regions of a first conductivity type which are formed in a semiconductor layer of a second conductivity type, a first lightly doped semiconductor region of the first conductivity type which is placed laterally between the two body regions. The first semiconductor region is placed under a succession of a thick silicon oxide layer, a polysilicon layer and a metal layer. A plurality of second lightly doped semiconductor regions of the first conductivity type are placed under said at least two heavily doped body regions and under said first lightly doped semiconductor region of the first conductivity type, each region of said plurality of second lightly doped semiconductor regions of the first conductivity type being separated from the other by portions of said semiconductor layer of the second conductivity type.

    摘要翻译: 描述了MOS技术功率器件,其包括多个基本有源单元和放置在形成基本有源单元的区域之间的所述功率器件的一部分。 功率器件的一部分包括形成在第二导电类型的半导体层中的第一导电类型的至少两个重掺杂体区域,第一导电类型的第一轻掺杂半导体区域横向放置在两者之间 身体区域。 第一半导体区域被放置在一连串厚的氧化硅层,多晶硅层和金属层之下。 第一导电类型的多个第二轻掺杂半导体区域被放置在所述至少两个重掺杂体区域的下方,并且在所述第一导电类型的所述第一轻掺杂半导体区域的下方,所述多个第二轻掺杂半导体区域的每个区域 所述第一导电类型通过所述第二导电类型的所述半导体层的一部分与另一个分离。

    Integrated device with Schottky diode and MOS transistor and related manufacturing process
    4.
    发明申请
    Integrated device with Schottky diode and MOS transistor and related manufacturing process 有权
    集成器件采用肖特基二极管和MOS晶体管及相关制造工艺

    公开(公告)号:US20050118766A1

    公开(公告)日:2005-06-02

    申请号:US11023957

    申请日:2004-12-28

    摘要: An integrated device comprising a MOS transistor and a Schottky diode which are formed on a semiconductor substrate of a first conductivity type is shown. The device comprises a plurality of body region stripes of a second conductivity type which are adjacent and parallel to each other, a first metal layer placed over said substrate and a second metal layer placed under said substrate. The device comprises a plurality of elementary structures parallel to each other each one of which comprises first zones provided with a silicon oxide layer placed over a portion of the substrate which is comprised between two adjacent body region stripes, a polysilicon layer superimposed to the silicon oxide layer, a dielectric layer placed over and around the polysilicon layer. Some body region stripes comprise source regions of the first conductivity type which are placed adjacent to the first zones of the elementary structures to form elementary cells of said MOS transistor. The elementary structures and the body regions stripes extend longitudinally in a transversal way to the formation of the channel in the elementary cells of the MOS transistor and the first metal layer contacts the source regions. At least one elementary structure comprises at least a second zone adapted to allow the direct contact between the first metal layer and the underlying substrate portion arranged between two adjacent body regions stripes to perform the Schottky diode.

    摘要翻译: 示出了包括形成在第一导电类型的半导体衬底上的MOS晶体管和肖特基二极管的集成器件。 该装置包括彼此相邻并平行的第二导电类型的多个体区条纹,放置在所述基底上的第一金属层和置于所述基底下的第二金属层。 该器件包括彼此平行的多个基本结构,每个基本结构包括第一区域,该第一区域设置有位于两个相邻体区条纹之间的衬底的一部分上的氧化硅层,叠加到氧化硅上的多晶硅层 层,放置在多晶硅层上方和周围的介电层。 一些体区条纹包括与基本结构的第一区相邻放置的第一导电类型的源区,以形成所述MOS晶体管的元件。 基本结构和体区条纹以横向方式纵向延伸,以在MOS晶体管的基本单元中形成沟道,并且第一金属层接触源极区。 至少一个基本结构包括至少第二区域,其适于允许第一金属层与布置在两个相邻体区条纹之间的下面的衬底部分之间的直接接触以执行肖特基二极管。

    Infrared detector device of semiconductor material and manufacturing process thereof
    6.
    发明授权
    Infrared detector device of semiconductor material and manufacturing process thereof 有权
    半导体材料红外探测器及其制造工艺

    公开(公告)号:US06433399B1

    公开(公告)日:2002-08-13

    申请号:US09415022

    申请日:1999-10-07

    IPC分类号: H01L310232

    摘要: An infrared detector device having a PN junction formed by a first semiconductor material region doped with rare earth ions and by a second semiconductor material region of opposite doping type. The detector device comprises a waveguide formed by a projecting structure extending on a substrate, including a reflecting layer and laterally delimited by a protection and containment oxide region. At least one portion of the waveguide is formed by the PN junction and has an end fed with light to be detected. The detector device has electrodes disposed laterally to and on the waveguide to enable efficient gathering of charge carriers generated by photoconversion.

    摘要翻译: 具有由掺杂有稀土离子的第一半导体材料区域和具有相反掺杂型的第二半导体材料区域形成的PN结的红外检测器装置。 检测器装置包括由在衬底上延伸的突出结构形成的波导,包括反射层,并由保护和容纳氧化物区域横向界定。 波导的至少一部分由PN结形成,并且具有馈送待检测光的端部。 检测器装置具有横向设置在波导上的电极,以使得能够有效地收集通过光转换产生的电荷载流子。

    Process for manufacturing a charge-balance power diode and an edge-termination structure for a charge-balance semiconductor power device
    7.
    发明申请
    Process for manufacturing a charge-balance power diode and an edge-termination structure for a charge-balance semiconductor power device 有权
    用于制造电荷平衡功率二极管的工艺和用于电荷平衡半导体功率器件的边缘终端结构

    公开(公告)号:US20080001223A1

    公开(公告)日:2008-01-03

    申请号:US11824169

    申请日:2007-06-28

    IPC分类号: H01L21/336 H01L29/768

    摘要: An embodiment of a process for manufacturing a semiconductor power device envisages the steps of: providing a body made of semiconductor material having a first top surface; forming an active region with a first type of conductivity in the proximity of the first top surface and inside an active portion of the body; and forming an edge-termination structure. The edge-termination structure is formed by: a ring region having the first type of conductivity and a first doping level, set within a peripheral edge portion of the body and electrically connected to the active region; and a guard region, having the first type of conductivity and a second doping level, higher than the first doping level, set in the proximity of the first top surface and connecting the active region to the ring region. The process further envisages the steps of: forming a surface layer having the first type of conductivity on the first top surface, also at the peripheral edge portion, in contact with the guard region; and etching the surface layer in order to remove it above the edge portion in such a manner that the etch terminates inside the guard region.

    摘要翻译: 制造半导体功率器件的方法的一个实施例设想了以下步骤:提供由具有第一顶表面的半导体材料制成的本体; 在所述第一顶表面附近和所述主体的活动部分内部形成具有第一类型导电性的有源区; 并形成边缘终端结构。 边缘终端结构通过以下方式形成:具有第一类型的导电性和第一掺杂水平的环形区域,其设置在主体的外围边缘部分内并电连接到有源区域; 以及保护区,其具有高于第一掺杂级的第一类型的导电性和第二掺杂级,设置在第一顶表面附近并将有源区连接到环区。 该方法进一步设想了以下步骤:在第一顶表面上形成具有第一类型导电性的表面层,也在周边边缘部分形成与保护区域接触的表面层; 并且蚀刻表面层以便以这样的方式将其去除边缘部分,使得蚀刻终止于保护区域内。

    Integrated device with Schottky diode and MOS transistor and related manufacturing process

    公开(公告)号:US06841836B2

    公开(公告)日:2005-01-11

    申请号:US10738952

    申请日:2003-12-16

    摘要: An integrated device comprising a MOS transistor and a Schottky diode which are formed on a semiconductor substrate of a first conductivity type is shown. The device comprises a plurality of body region stripes of a second conductivity type which are adjacent and parallel to each other, a first metal layer placed over said substrate and a second metal layer placed under said substrate. The device comprises a plurality of elementary structures parallel to each other each one of which comprises first zones provided with a silicon oxide layer placed over a portion of the substrate which is comprised between two adjacent body region stripes, a polysilicon layer superimposed to the silicon oxide layer, a dielectric layer placed over and around the polysilicon layer. Some body region stripes comprise source regions of the first conductivity type which are placed adjacent to the first zones of the elementary structures to form elementary cells of said MOS transistor. The elementary structures and the body regions stripes extend longitudinally in a transversal way to the formation of the channel in the elementary cells of the MOS transistor and the first metal layer contacts the source regions. At least one elementary structure comprises at least a second zone adapted to allow the direct contact between the first metal layer and the underlying substrate portion arranged between two adjacent body regions stripes to perform the Schottky diode.

    Integrated electronic device with edge-termination structure and manufacturing method thereof
    9.
    发明授权
    Integrated electronic device with edge-termination structure and manufacturing method thereof 有权
    具有边缘终端结构的集成电子装置及其制造方法

    公开(公告)号:US09018635B2

    公开(公告)日:2015-04-28

    申请号:US13221778

    申请日:2011-08-30

    摘要: An embodiment of an integrated electronic device formed in a semiconductor body delimited by a lateral surface, which includes: a substrate made of a first semiconductor material; a first epitaxial region made of a second semiconductor material, which overlies the substrate and defines a first surface; a second epitaxial region made of a third semiconductor material, which overlies the first surface and is in contact with the first epitaxial region, the third semiconductor material having a bandgap narrower than the bandgap of the second semiconductor material; an active area, extending within the second epitaxial region and housing at least one elementary electronic component; and an edge structure, arranged between the active area and the lateral surface, and including a dielectric region arranged laterally with respect to the second epitaxial region, which overlies the first surface and is in contact with the first epitaxial region.

    摘要翻译: 一种形成在由侧面限定的半导体主体中的集成电子器件的实施例,包括:由第一半导体材料制成的衬底; 由第二半导体材料制成的第一外延区,其覆盖在所述基板上并限定第一表面; 由第三半导体材料制成的第二外延区,其覆盖在第一表面上并与第一外延区接触,第三半导体材料具有比第二半导体材料的带隙窄的带隙; 有源区域,在所述第二外延区域内延伸并容纳至少一个基本电子部件; 以及边缘结构,其布置在所述有源区域和所述侧表面之间,并且包括相对于所述第二外延区域横向布置的介质区域,所述介电区域覆盖所述第一表面并与所述第一外延区域接触。