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    LED lights with matched AC voltage using rectified circuitry
    3.
    发明申请
    LED lights with matched AC voltage using rectified circuitry 有权
    使用整流电路的匹配交流电压的LED灯

    公开(公告)号：US20070127242A1

    公开(公告)日：2007-06-07

    申请号：US11586736

    申请日：2006-10-26

    Applicant: David Allen ,  Mark Allen

    Inventor： David Allen ,  Mark Allen

    IPC: F21S13/14

    CPC classification number: H05B33/0803 ,  F21S4/20 ,  F21Y2115/10 ,  H05B33/0809

    Abstract: An LED light string employs a plurality of LEDs wired in block series-parallel, where the one or more series blocks, each driven at the same input voltage or rectified AC input voltage as the source voltage (110 VAC or 220 VAC), are coupled in parallel. This voltage matching requirement for direct AC drive places fundamental restrictions on the number of diodes on each diode series block, depending on the types of diodes used. The same method that apply to matching the sum of the LED lamps (VAC values) to the AC input, or applied voltage in an AC circuit apply to matching the sum of the LED lamps (VP values) to the full-wave or half-wave rectified AC (VP) voltage applied. Filtering capacitors may also be employed.

    Abstract translation: LED灯串使用串联并联的多个LED，其中以与源电压（110VAC或220VAC）相同的输入电压或整流的AC输入电压驱动的一个或多个串联块被耦合 在平行下。 根据所使用的二极管的类型，直流交流驱动器的这种电压匹配要求对每个二极管串联模块上的二极管数量做出了基本的限制。 适用于将LED灯（VAC值）的总和与AC输入或AC电路中的施加电压进行匹配的相同方法适用于将LED灯（VP值）的总和与全波或半波 波形整流AC（VP）电压。 也可以使用滤波电容器。

    LED assemblies and light strings containing same
    4.
    发明授权
    LED assemblies and light strings containing same 有权
    LED组件和包含相同的灯串

    公开(公告)号：US07344275B2

    公开(公告)日：2008-03-18

    申请号：US11227258

    申请日：2005-09-16

    Applicant: David Allen ,  Mark Allen

    Inventor： David Allen ,  Mark Allen

    IPC: F21V21/00

    CPC classification number: H01L33/56 ,  F21S4/10 ,  F21V5/04 ,  F21V15/01 ,  F21V19/0005 ,  F21V23/001 ,  F21V31/005 ,  F21V31/04 ,  F21W2121/00 ,  F21W2121/04 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05B33/0803 ,  H05B33/0809 ,  H05B33/0821 ,  Y02B20/383 ,  Y10S362/80 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: An LED light string employs a plurality of electrical components defined by LEDs and sockets wired in block series-parallel, where the one or more series blocks, each driven at the same input voltage as the source voltage (110 VAC or 220 VAC), are coupled in parallel. The LED light string interfaces to the source voltage using a common household plug; it may also include a corresponding common, household socket, coupled in electrical parallel, to enable multiple light strings to be connected to each other from end to end. In order to directly drive a network of diodes without current-limiting circuitry, the voltage of each series block of diodes must be matched to the input source voltage. This voltage matching requirement for direct AC drive places fundamental restrictions on the number of diodes on each diode series block, depending on the types of diodes used. For the voltage to be “matched,” it is possible to employ LED assemblies of different resistance values; e.g., the LED assemblies may emit different colors or be formed with a dedicated resistor (e.g., drop down resistor) integrally formed as part of at least one of the LED assemblies.

    Abstract translation: LED灯串采用由串联并联的LED和插座限定的多个电气部件，其中以与源电压（110VAC或220VAC）相同的输入电压驱动的一个或多个串联块为 并行并行。 LED灯串使用普通家用插头连接到源电压; 它还可以包括相互并联的相应的公用家用插座，以使得多个灯串可以从一端到另一端相互连接。 为了直接驱动没有限流电路的二极管网络，每个串联二极管的电压必须与输入源电压相匹配。 根据所使用的二极管的类型，直流交流驱动器的这种电压匹配要求对每个二极管串联模块上的二极管数量做出了基本的限制。 为了使电压“匹配”，可以使用具有不同电阻值的LED组件; 例如，LED组件可以发射不同的颜色，或者形成有作为至少一个LED组件的一部分整体形成的专用电阻器（例如，下拉电阻器）。

    Implantable wireless sensor
    6.
    发明授权
    Implantable wireless sensor 有权
    可植入无线传感器

    公开(公告)号：US09265428B2

    公开(公告)日：2016-02-23

    申请号：US12175803

    申请日：2008-07-18

    Applicant: David O'Brien ,  Jason White ,  Michael A. Fonseca ,  Jason Kroh ,  Mark Allen ,  David Stern

    Inventor： David O'Brien ,  Jason White ,  Michael A. Fonseca ,  Jason Kroh ,  Mark Allen ,  David Stern

    IPC: A61B5/02 ,  A61B5/00 ,  A61B5/07

    CPC classification number: A61B5/02014 ,  A61B5/0031 ,  A61B5/076 ,  Y10T29/49016 ,  Y10T29/49069 ,  Y10T29/49071 ,  Y10T29/49073

    Abstract: A wireless sensor for indicating a physical state within an environment includes a housing defining a hermetically sealed cavity. A structure located within the cavity of the housing has elements providing capacitance, the elements being arranged such that the distance and thereby the capacitance of the structure changes when a physical state of the environment changes. The structure has a resonant frequency based at least in part on the capacitance of the structure when in the presence of a fluctuating electromagnetic field. When the sensor is positioned within an environment and is subjected to a fluctuating electromagnetic field, the resonant frequency indicates the physical state of the environment.

    Abstract translation: 用于指示环境中的物理状态的无线传感器包括限定密封空腔的壳体。 位于壳体的腔内的结构具有提供电容的元件，该元件被布置成使得当环境的物理状态改变时，结构的距离以及由此的结构的电容改变。 当存在波动的电磁场时，该结构至少部分地基于结构的电容。 当传感器位于环境中并且经受波动的电磁场时，谐振频率表示环境的物理状态。

    Method for manufacturing conductors and semiconductors
    9.
    发明授权
    Method for manufacturing conductors and semiconductors 有权
    制造导体和半导体的方法

    公开(公告)号：US09011762B2

    公开(公告)日：2015-04-21

    申请号：US12374179

    申请日：2007-07-05

    Applicant: Heikki Seppä ,  Mark Allen

    Inventor： Heikki Seppä ,  Mark Allen

    IPC: B22F7/00 ,  B22F1/02 ,  H05K3/12 ,  H05K3/32 ,  B22F7/04

    CPC classification number: H05K3/321 ,  B22F1/02 ,  B22F7/04 ,  B22F2203/11 ,  B22F2999/00 ,  H01L2224/8184 ,  H05K3/1283 ,  H05K2201/0257 ,  H05K2203/105 ,  H05K2203/1115 ,  H05K2203/1131

    Abstract: The invention relates to a sintering method for manufacturing structures by sintering. In addition, the invention relates to a sintered product, an electronic module, and new uses. In the method, a particle material containing conductive or semiconductive encapsulated nanoparticles is sintered, in order to increase its electrical conductivity, by applying a voltage over the particle material. In the method, a substrate is typically used, one surface of which is at least partly equipped with a layer containing nanoparticles. The method is based on thermal feedback between the voltage feed and the nanoparticles. The invention permits the manufacture of conductive and semiconductive structures and pieces by sintering at room temperature and at normal pressure.

    Abstract translation: 本发明涉及通过烧结制造结构的烧结方法。 此外，本发明涉及烧结产品，电子模块和新用途。 在该方法中，通过在颗粒材料上施加电压，烧结含有导电或半导体封装的纳米颗粒的颗粒材料，以增加其导电性。 在该方法中，通常使用基底，其一个表面至少部分地装有含有纳米粒子的层。 该方法基于电压馈送和纳米颗粒之间的热反馈。 本发明允许通过在室温和常压下烧结来制造导电和半导体结构和片。

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