PROBE CARD SUBSTRATE WITH BONDED VIA
    10.
    发明申请
    PROBE CARD SUBSTRATE WITH BONDED VIA 审中-公开
    探针卡底座与绑定威盛

    公开(公告)号:US20100308854A1

    公开(公告)日:2010-12-09

    申请号:US12754452

    申请日:2010-04-05

    IPC分类号: G01R31/00 H01R9/00

    摘要: The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate.

    摘要翻译: 本发明涉及一种探针头,其具有探针接触器基底,该探针接触器基底具有穿过该探针接触器基底的至少一个狭缝,至少一个探针接触器,其适用于测试被测器件,探针接触器与顶部 并且电连接到也设置在探针接触器基板顶部的端子,以及空间变压器,其具有耦合到空间变压器的顶侧的至少一个接合焊盘,以及电连接所述探针接触器基板 接合焊盘通过探头接触器基板中的插槽连接到端子。