-
公开(公告)号：US20100308854A1
公开(公告)日：2010-12-09
申请号：US12754452
申请日：2010-04-05
CPC分类号： G01R3/00 , G01R1/07378 , Y10T29/49147
摘要： The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate.
摘要翻译： 本发明涉及一种探针头，其具有探针接触器基底，该探针接触器基底具有穿过该探针接触器基底的至少一个狭缝，至少一个探针接触器，其适用于测试被测器件，探针接触器与顶部 并且电连接到也设置在探针接触器基板顶部的端子，以及空间变压器，其具有耦合到空间变压器的顶侧的至少一个接合焊盘，以及电连接所述探针接触器基板 接合焊盘通过探头接触器基板中的插槽连接到端子。
-
公开(公告)号：US07692436B2
公开(公告)日：2010-04-06
申请号：US12077627
申请日：2008-03-20
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , G01R1/07378 , Y10T29/49147
摘要： The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate.
摘要翻译： 本发明涉及一种探针头，其具有探针接触器基底，该探针接触器基底具有穿过该探针接触器基底的至少一个狭缝，至少一个探针接触器，其适用于测试被测器件，探针接触器与顶部 并且电连接到也设置在探针接触器基板顶部的端子，以及空间变压器，其具有耦合到空间变压器的顶侧的至少一个接合焊盘，以及电连接所述探针接触器基板 接合焊盘通过探头接触器基板中的插槽连接到端子。
-
公开(公告)号：US20090237099A1
公开(公告)日：2009-09-24
申请号：US12077627
申请日：2008-03-20
CPC分类号： G01R3/00 , G01R1/07378 , Y10T29/49147
摘要： The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate.
摘要翻译： 本发明涉及一种探针头，其具有探针接触器基底，该探针接触器基底具有穿过该探针接触器基底的至少一个狭缝，至少一个探针接触器，其适用于测试被测器件，探针接触器与顶部 并且电连接到也设置在探针接触器基板顶部的端子，以及空间变压器，其具有耦合到空间变压器的顶侧的至少一个接合焊盘，以及电连接所述探针接触器基板 接合焊盘通过探头接触器基板中的插槽连接到端子。
-
公开(公告)号：US20060134820A1
公开(公告)日：2006-06-22
申请号：US11102982
申请日：2005-04-11
申请人： Weilong Tang , Tseng-Yang Hsu , Salleh Ismail , Nim Tea , Melvin Khoo , Raffi Garabedian , Lakshmikanth Namburi
发明人： Weilong Tang , Tseng-Yang Hsu , Salleh Ismail , Nim Tea , Melvin Khoo , Raffi Garabedian , Lakshmikanth Namburi
CPC分类号： B81C1/00436 , B81C1/00666 , B81C2201/0107 , B81C2201/0197
摘要： The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.
摘要翻译： 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域，但不包含整个基板。 相反，它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。
-
公开(公告)号：US20090021277A1
公开(公告)日：2009-01-22
申请号：US11778207
申请日：2007-07-16
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/07342 , Y10T29/49144 , Y10T29/49149 , Y10T29/49179 , Y10T29/49728 , Y10T29/4973 , Y10T29/49732 , Y10T29/53178 , Y10T29/53274
摘要： A novel device and method for repairing MEMS systems, including probe cards for use in semiconductor testing is disclosed. In one embodiment, a probe card for use with a diagnostic computer for testing semiconductor wafers comprises a substrate, a plurality of operational probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer and a plurality of replacement probes connected to the substrate, wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. Also disclosed is a novel probe card that can be repaired. Specifically, a probe card for use with a diagnostic computer for testing semiconductor wafers, the probe card comprises a substrate and a plurality operational of probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer, and wherein the plurality of operational probes include a sacrificial material that is activated by applying a voltage.A method for removing a damaged probe from a probe card is also disclosed. The method removes a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and the plurality of operational probes comprises a sacrificial material that is activated by applying a voltage. The method comprises identifying the damaged probe, applying the voltage to the damaged probe, exposing the damaged probe to an etching solution and removing the damaged probe from the probe card.A second method for repairing a damaged probe from a probe card is also disclosed. The method repairs a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and a plurality of replacement probes connected to the substrate and wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. The method comprising the steps of identifying the damaged probe, removing the damaged probe from the probe card, separating one of the plurality of replacement probes from the substrate, and installing the one probe separated from the plurality of replacement probes where the damaged probe was removed. Several refinements to these devices and methods are disclosed.
-
公开(公告)号：US07761966B2
公开(公告)日：2010-07-27
申请号：US11778207
申请日：2007-07-16
IPC分类号： B23P19/04
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/07342 , Y10T29/49144 , Y10T29/49149 , Y10T29/49179 , Y10T29/49728 , Y10T29/4973 , Y10T29/49732 , Y10T29/53178 , Y10T29/53274
摘要： A method for repairing a damaged probe from a probe card comprising the steps of removing the damaged probe from the probe card, separating one a plurality of replacement probes from a substrate and installing the one probe separated from the plurality of replacement probes where the damaged probe was removed.
摘要翻译： 一种用于从探针卡修复损坏的探针的方法，包括以下步骤：从探针卡移除损坏的探针，将多个替换探针与基底分开一个，并将从多个替换探针分离的一个探针放置在损伤的探针 去掉了。
-
公开(公告)号：US08232816B2
公开(公告)日：2012-07-31
申请号：US11641255
申请日：2006-12-19
申请人： Salleh Ismail , Raffi Garabedian , Steven Wang
发明人： Salleh Ismail , Raffi Garabedian , Steven Wang
IPC分类号： G01R31/20
CPC分类号： G01R1/07307 , G01R31/2889
摘要： A probe head for testing semiconductor wafers has a probe contactor substrate have a first side and a second side. A plurality of probe contactor tips are coupled to the first side and the plurality of tips lie in a first plane. A plurality of mounting structures are coupled to the second side with each of the mounting structures each having a top surface lying in a second plane, wherein the first plane is substantially parallel to the second plane.
摘要翻译： 用于测试半导体晶片的探针头具有第一侧和第二侧的探针接触器衬底。 多个探针接触器尖端联接到第一侧并且多个尖端位于第一平面中。 多个安装结构联接到第二侧，每个安装结构各自具有位于第二平面中的顶表面，其中第一平面基本上平行于第二平面。
-
公开(公告)号：US07245135B2
公开(公告)日：2007-07-17
申请号：US11194720
申请日：2005-08-01
申请人： Salleh Ismail , Nim Tea , Yang Hsu , Weilong Tang , Raffi Garabedian , Melvin Khoo
发明人： Salleh Ismail , Nim Tea , Yang Hsu , Weilong Tang , Raffi Garabedian , Melvin Khoo
CPC分类号： G01R1/06727 , G01R1/06738 , G01R3/00 , H01L2924/0002 , Y10T29/49117 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： The present invention relates to A microfabricated tip and post structure comprising a post having a rough top surface that diffuses incident light and a cross-section, and a tip, lithographically plated on the rough top surface of the post, having a smooth reflective surface appropriate for automatic vision recognition, and having a cross-section that is less than the cross-section of the post.
-
公开(公告)号：US20070075717A1
公开(公告)日：2007-04-05
申请号：US11633324
申请日：2006-12-04
IPC分类号： G01R31/02
CPC分类号： G01R1/07378 , H01R12/52 , H01R13/24 , H01R13/2435 , H01R13/2464 , H01R13/2485 , H05K3/325
摘要： The present invention is directed to an interposer having an interposer substrate with an upper surface and a lower surface and at least one resilient contact element having an upper portion and a lower portion. The upper portion extends in a substantially vertical fashion above the upper surface of said interposer substrate, and the lower portion extends in a substantially vertical fashion below the lower surface of said interposer substrate. The upper and lower portions of the resilient contact element are substantially resilient in a direction parallel to the substrate.
摘要翻译： 本发明涉及具有具有上表面和下表面的插入件基板和至少一个具有上部和下部的弹性接触元件的插入件。 上部部分以大致垂直的方式在所述插入器基板的上表面上方延伸，并且下部部分以基本垂直的方式延伸到所述插入器基板的下表面之下。 弹性接触元件的上部和下部在平行于基底的方向上基本上具有弹性。
-
公开(公告)号：US07180316B1
公开(公告)日：2007-02-20
申请号：US11346954
申请日：2006-02-03
申请人： Salleh Ismail , Raffi Garabedian , Steven Wang
发明人： Salleh Ismail , Raffi Garabedian , Steven Wang
IPC分类号： G01R31/02
CPC分类号： G01R1/07307 , G01R31/2889
摘要： A probe head for testing semiconductor wafers has a probe contactor substrate have a first side and a second side. A plurality of probe contactor tips are coupled to the first side and the plurality of tips lie in a first plane. A plurality of mounting structures are coupled to the second side with each of the mounting structures each having a top surface lying in a second plane, wherein the first plane is substantially parallel to the second plane.
摘要翻译： 用于测试半导体晶片的探针头具有第一侧和第二侧的探针接触器衬底。 多个探针接触器尖端联接到第一侧并且多个尖端位于第一平面中。 多个安装结构联接到第二侧，每个安装结构各自具有位于第二平面中的顶表面，其中第一平面基本上平行于第二平面。
-
-
-
-
-
-
-
-
-
搜索结果
42 条记录 (耗时 0.016 秒)
