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公开(公告)号：US07378030B2
公开(公告)日：2008-05-27
申请号：US11041773
申请日：2005-01-24
CPC分类号： B41J2/14201 , B41J2/1433 , B41J2/1607 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1642 , B41J2/1646 , B41J2002/1437 , B41J2202/15 , H01L41/0973 , H01L41/316 , Y10T29/49401
摘要： A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, filling the trench with a fill material, forming a first portion of the opening in the substrate from the second side of the substrate toward the mask layer, and forming a second portion of the opening in the substrate through the mask layer and the fill material, including communicating the second portion of the opening with the first portion of the opening and the first side of the substrate.
摘要翻译： 通过具有第一侧和与第一侧相对的第二侧的衬底形成开口的方法包括在衬底的第一侧中形成沟槽，在沟槽内形成掩模层，用填充材料填充沟槽，形成 从衬底的第二侧到掩模层的衬底中的开口的第一部分，以及通过掩模层和填充材料在衬底中形成开口的第二部分，包括使开口的第二部分与第 开口的第一部分和基底的第一侧。
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公开(公告)号：US06883903B2
公开(公告)日：2005-04-26
申请号：US10348384
申请日：2003-01-21
CPC分类号： B41J2/14201 , B41J2/1433 , B41J2/1607 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1642 , B41J2/1646 , B41J2002/1437 , B41J2202/15 , H01L41/0973 , H01L41/316 , Y10T29/49401
摘要： A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, filling the trench with a fill material, forming a first portion of the opening in the substrate from the second side of the substrate toward the mask layer, and forming a second portion of the opening in the substrate through the mask layer and the fill material, including communicating the second portion of the opening with the first portion of the opening and the first side of the substrate.
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公开(公告)号：US07443017B2
公开(公告)日：2008-10-28
申请号：US11447764
申请日：2006-06-06
IPC分类号： H01L23/02
CPC分类号： B81C1/00269
摘要： A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.
摘要翻译： 用于容纳微机电器件的封装包括第一衬底晶片和由光学质量材料制成的第二衬底晶片。 在第一和第二基板晶片之间插入底部凹凸。 底部凹坑由间隔区域和局部粘结区域组成。 第一和第二衬底晶片和底部凹部限定包含至少一个微电子器件的腔室。
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公开(公告)号：US06821450B2
公开(公告)日：2004-11-23
申请号：US10347888
申请日：2003-01-21
IPC分类号： B41J204
CPC分类号： B41J2/1628 , B41J2/1601 , B41J2/1607 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634
摘要： A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.
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公开(公告)号：US07067355B2
公开(公告)日：2006-06-27
申请号：US10854110
申请日：2004-05-26
CPC分类号： B81C1/00269
摘要： A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.
摘要翻译： 用于容纳微机电器件的封装包括第一衬底晶片和由光学质量材料制成的第二衬底晶片。 在第一和第二基板晶片之间插入底部凹凸。 底部凹坑由间隔区域和局部粘结区域组成。 第一和第二衬底晶片和底部凹部限定包含至少一个微电子器件的腔室。
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公开(公告)号：US07018015B2
公开(公告)日：2006-03-28
申请号：US10992159
申请日：2004-11-18
CPC分类号： B41J2/1628 , B41J2/1601 , B41J2/1607 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634
摘要： A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.
摘要翻译： 通过具有第一侧和与第一侧相对的第二侧的衬底形成开口的方法包括在衬底的第一侧中形成沟槽，在沟槽内形成掩模层，在掩模层中形成至少一个孔 填充所述沟槽和所述至少一个孔，从所述衬底的所述第二侧到所述掩模层形成所述衬底中的所述开口的第一部分，以及从所述衬底的所述第二侧形成所述衬底中的所述开口的第二部分 衬底通过掩模层中的至少一个孔到衬底的第一侧。
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公开(公告)号：US06481831B1
公开(公告)日：2002-11-19
申请号：US09611810
申请日：2000-07-07
IPC分类号： B41J205
CPC分类号： B41J2/1629 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1642 , B41J2/1646
摘要： An inkjet printhead and a method of fabricating an inkjet printhead is disclosed. The inkjet printhead includes a conducting material layer deposited on an insulative dielectric. The conducting material layer has a chamber formed between a first and a second section of the conducting material layer. A dielectric material is fabricated on the first and second sections of the conducting material layer and on the insulative dielectric in the chamber. The dielectric material has a planarized top surface. A first via is formed in the dielectric material, thereby exposing a portion of the first section of the conducting material layer. A second via is formed in the dielectric material, thereby exposing a portion of the second section of the conducting material layer. The first and second vias each having sidewalls sloped at an angle in the range of approximately 10-60 degrees. A resistive material layer is formed in the first and second vias and on the planarization dielectric between the first and second vias through a single photoresist mask and a single etch process. A passivation material layer is formed onto the planarization dielectric material and onto the resistive material layer.
摘要翻译： 公开了喷墨打印头和制造喷墨打印头的方法。 喷墨打印头包括沉积在绝缘电介质上的导电材料层。 导电材料层具有形成在导电材料层的第一和第二部分之间的室。 介电材料制造在导电材料层的第一和第二部分以及室中的绝缘电介质上。 电介质材料具有平坦化的顶表面。 在电介质材料中形成第一通孔，从而暴露导电材料层的第一部分的一部分。 在电介质材料中形成第二通道，从而暴露导电材料层的第二部分的一部分。 第一和第二通孔各自具有以大约10-60度的角度倾斜的侧壁。 电阻材料层通过单个光致抗蚀剂掩模和单个蚀刻工艺在第一和第二通孔中以及在第一和第二通孔之间的平坦化电介质上形成。 在平坦化电介质材料上和电阻材料层上形成钝化材料层。
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公开(公告)号：US06938985B2
公开(公告)日：2005-09-06
申请号：US10601150
申请日：2003-06-20
CPC分类号： B41J2/1628 , B41J2/1404 , B41J2/14145 , B41J2/1603 , B41J2/1629 , B41J2/1634
摘要： The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One embodiment includes a substrate, and a slot received in the substrate. The slot has a central region and one or more terminal region(s). The central region extends at least in part along a pair of sidewalls. Individual terminal region(s) being defined by a terminal sidewall at least a portion of which extends away from both sidewalls of the central region.
摘要翻译： 所描述的实施例涉及用于流体喷射装置的开槽衬底。 一个实施例包括基板和接收在基板中的槽。 槽具有中心区域和一个或多个端子区域。 中心区域沿着一对侧壁至少部分地延伸。 单个端子区域由端子侧壁限定，端子侧壁的至少一部分远离中心区域的两个侧壁延伸。
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公开(公告)号：US06837572B2
公开(公告)日：2005-01-04
申请号：US10643264
申请日：2003-08-19
申请人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
发明人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
IPC分类号： B41J2/16
CPC分类号： B41J2/1628 , B41J2/162 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1642 , B41J2/1645 , B41J2/1646 , Y10T29/49401
摘要： A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.
摘要翻译： 一种用于制造用于喷墨打印机的打印头的液滴板的方法，该方法提供设计灵活性，精确的尺寸控制以及材料坚固性。 还提供了根据该方法制造的液滴板。
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公开(公告)号：US06764605B2
公开(公告)日：2004-07-20
申请号：US10061923
申请日：2002-01-31
申请人： Jeremy Donaldson , Naoto A. Kawamura , Daniel A. Kearl , Donald J. Milligan , J. Daniel Smith , Martha A. Truninger , Diane Lai , Norman L. Johnson , William Edwards , Sadiq Bengali , Timothy R. Emery
发明人： Jeremy Donaldson , Naoto A. Kawamura , Daniel A. Kearl , Donald J. Milligan , J. Daniel Smith , Martha A. Truninger , Diane Lai , Norman L. Johnson , William Edwards , Sadiq Bengali , Timothy R. Emery
IPC分类号： C03C1500
CPC分类号： B41J2/17513 , B41J2/14145 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1642
摘要： In one embodiment, a fluid ejection device comprises a substrate having a fluid slot defined from a first surface through to a second opposite surface; an ejection element formed over the first surface and that ejects fluid therefrom; and a filter having feed holes positioned over the fluid slot near the first surface. Fluid moves from the second surface through the feed holes to the ejection element. In a particular embodiment, the filter is formed of a first material that is surrounded by a second material. In another particular embodiment, the filter is formed from the back side and is formed of the same material as the substrate.
摘要翻译： 在一个实施例中，流体喷射装置包括具有从第一表面到第二相对表面限定的流体槽的基板; 形成在所述第一表面上并从其喷出流体的喷射元件; 以及具有位于第一表面附近的流体槽上方的进料孔的过滤器。 流体从第二表面通过进料孔移动到喷射元件。 在特定实施例中，过滤器由被第二材料包围的第一材料形成。 在另一特定实施例中，过滤器由背面形成并且由与基底相同的材料形成。
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