Method And System For Performing Self-Tests In An Electronic System
    2.
    发明申请
    Method And System For Performing Self-Tests In An Electronic System 失效
    在电子系统中进行自检的方法和系统

    公开(公告)号:US20120013356A1

    公开(公告)日:2012-01-19

    申请号:US13087550

    申请日:2011-04-15

    IPC分类号: G01R31/3187

    CPC分类号: G01R31/31721 G01R31/3004

    摘要: A method and system for performing a self-test of power supply quality for an integrated circuit chip within an electronic system. The electronic system is subjected to a well-defined repetitive activity, such as by using an amplitude modulated system clock tree. With the repetitive activity causing current consumption within the chip, time-domain local power supply voltage (U(t)) is measured for a location on the chip. A set of time-domain measured voltage data (U(t)) is accumulated and transformed into the frequency domain to yield a local voltage profile (U(f)). The local voltage profile (U(f)) is compared with a reference voltage profile (U0(f)) to verify whether power supply quality at the chip location under test is adequate. Alternatively, a local impedance profile Z(f) evaluated from the local voltage profile (U(f)) may be compared to a reference impedance profile Z0(f).

    摘要翻译: 一种用于对电子系统内的集成电路芯片进行电源质量自检的方法和系统。 电子系统受到明确的重复活动,例如通过使用调幅系统时钟树。 由于重复的活动导致芯片内的电流消耗,对于芯片上的位置测量时域本地电源电压(U(t))。 一组时域测量电压数据(U(t))被积累并变换到频域以产生局部电压分布(U(f))。 将本地电压曲线(U(f))与参考电压曲线(U0(f))进行比较,以验证被测芯片位置的电源质量是否足够。 或者,可以将从局部电压分布(U(f))估计的局部阻抗曲线Z(f)与参考阻抗曲线Z0(f)进行比较。

    Method and system for performing self-tests in an electronic system
    3.
    发明授权
    Method and system for performing self-tests in an electronic system 失效
    在电子系统中执行自检的方法和系统

    公开(公告)号:US08659310B2

    公开(公告)日:2014-02-25

    申请号:US13087550

    申请日:2011-04-15

    IPC分类号: G01R31/3187

    CPC分类号: G01R31/31721 G01R31/3004

    摘要: A method and system for performing a self-test of power supply quality for an integrated circuit chip within an electronic system. The electronic system is subjected to a well-defined repetitive activity, such as by using an amplitude modulated system clock tree. With the repetitive activity causing current consumption within the chip, time-domain local power supply voltage (U(t)) is measured for a location on the chip. A set of time-domain measured voltage data (U(t)) is accumulated and transformed into the frequency domain to yield a local voltage profile (U(f)). The local voltage profile (U(f)) is compared with a reference voltage profile (U0(f)) to verify whether power supply quality at the chip location under test is adequate. Alternatively, a local impedance profile Z(f) evaluated from the local voltage profile (U(f)) may be compared to a reference impedance profile Z0(f).

    摘要翻译: 一种用于对电子系统内的集成电路芯片进行电源质量自检的方法和系统。 电子系统受到明确的重复活动,例如通过使用调幅系统时钟树。 由于重复的活动导致芯片内的电流消耗,对于芯片上的位置测量时域本地电源电压(U(t))。 一组时域测量电压数据(U(t))被积累并变换到频域以产生局部电压分布(U(f))。 将本地电压曲线(U(f))与参考电压曲线(U0(f))进行比较,以验证被测芯片位置的电源质量是否足够。 或者,可以将从局部电压分布(U(f))估计的局部阻抗曲线Z(f)与参考阻抗曲线Z0(f)进行比较。

    Determining local voltage in an electronic system
    4.
    发明授权
    Determining local voltage in an electronic system 有权
    确定电子系统中的局部电压

    公开(公告)号:US08866504B2

    公开(公告)日:2014-10-21

    申请号:US13280626

    申请日:2011-10-25

    IPC分类号: G01R31/3187 G01R31/317

    CPC分类号: G01R31/3187 G01R31/31703

    摘要: A system for measuring a test voltage level (Vx) in a location within a chip is presented. The system includes an on-chip measurement device with an on-chip comparator and an on-chip storage. The on-chip comparator is configured for comparing the test voltage (Vx) to be measured to a reference voltage (Vref), while the on-chip storage is configured for storing the result of this comparison. The system also includes external (off-chip) equipment for generating the reference voltage (Vref), for generating probe signals for probing the state of the storage and for retrieving the state of said on-chip storage.

    摘要翻译: 提出了一种用于测量芯片内部位置的测试电压电平(Vx)的系统。 该系统包括具有片上比较器和片上存储器的片上测量装置。 片上比较器被配置为将待测量的测试电压(Vx)与参考电压(Vref)进行比较,而片上存储被配置用于存储该比较的结果。 该系统还包括用于产生参考电压(Vref)的外部(片外)设备,用于产生用于探测存储器的状态并检索所述片上存储器的状态的探测信号。

    DETERMINING LOCAL VOLTAGE IN AN ELECTRONIC SYSTEM
    5.
    发明申请
    DETERMINING LOCAL VOLTAGE IN AN ELECTRONIC SYSTEM 有权
    确定电子系统中的本地电压

    公开(公告)号:US20120146674A1

    公开(公告)日:2012-06-14

    申请号:US13280626

    申请日:2011-10-25

    IPC分类号: G01R31/3187

    CPC分类号: G01R31/3187 G01R31/31703

    摘要: A system for measuring a test voltage level (Vx) in a location within a chip is presented. The system includes an on-chip measurement device with an on-chip comparator and an on-chip storage. The on-chip comparator is configured for comparing the test voltage (Vx) to be measured to a reference voltage (Vref), while the on-chip storage is configured for storing the result of this comparison. The system also includes external (off-chip) equipment for generating the reference voltage (Vref), for generating probe signals for probing the state of the storage and for retrieving the state of said on-chip storage.

    摘要翻译: 提出了一种用于测量芯片内部位置的测试电压电平(Vx)的系统。 该系统包括具有片上比较器和片上存储器的片上测量装置。 片上比较器被配置为将待测量的测试电压(Vx)与参考电压(Vref)进行比较,而片上存储被配置用于存储该比较的结果。 该系统还包括用于产生参考电压(Vref)的外部(片外)设备,用于产生用于探测存储器的状态并检索所述片上存储器的状态的探测信号。

    Industrial Tool
    7.
    发明申请
    Industrial Tool 审中-公开
    工业工具

    公开(公告)号:US20120169485A1

    公开(公告)日:2012-07-05

    申请号:US13337199

    申请日:2011-12-26

    申请人: Martin Eckert

    发明人: Martin Eckert

    IPC分类号: G08C19/12

    CPC分类号: B25B21/00 B25B23/14 B25F5/00

    摘要: An industrial and electrically driven tool includes two mutually independent radio modules so that a redundant communication link to a controller can be set up.

    摘要翻译: 工业和电动工具包括两个相互独立的无线电模块,使得可以建立到控制器的冗余通信链路。

    Test fail analysis on VLSI chips
    8.
    发明授权
    Test fail analysis on VLSI chips 失效
    VLSI芯片测试故障分析

    公开(公告)号:US08180142B2

    公开(公告)日:2012-05-15

    申请号:US12326166

    申请日:2008-12-02

    IPC分类号: G06K9/03

    CPC分类号: G06T7/001 G06T2207/30148

    摘要: Compact graphical representations of common test fail signatures and process related test fails are provided through methods of selecting, calculating and/or presenting information. The input may be a list of failing tests on a sample of devices under test from chip and/or wafer process fails. The failing tests are identified and then other tests that fail at the same time may be identified. Several graphical outputs are provided, including all possible combinations between test fails and between test fails and process fails. The dependencies are printed as sorted two dimensional bitmaps that are compact representations of the results using color codes. Subtraction of two independent bitmaps is provided, which eliminates common properties and emphasizes differences between multiple bitmaps which allows for quick identification of differences of process fails potentially different between the two different bitmaps indicating potential root causes for the selected one of the test fails.

    摘要翻译: 通过选择,计算和/或呈现信息的方法提供常见测试失败签名和过程相关测试失败的紧凑图形表示。 输入可以是从芯片和/或晶片处理失败的被测器件的样本的失败测试的列表。 确定失败的测试,然后可以确定同时失败的其他测试。 提供了几个图形输出,包括测试失败和测试失败和进程失败之间的所有可能的组合。 依赖关系作为排序的二维位图打印,这些位图是使用颜色代码的结果的紧凑表示。 提供了两个独立位图的减法,这消除了通用属性,并且强调了多个位图之间的差异,这允许快速识别两个不同位图之间的差异的过程失败,这两个不同的位图表示所选择的一个测试失败的潜在根本原因。