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    Chip Housing Having Reduced Induced Vibration
    1.
    发明申请
    Chip Housing Having Reduced Induced Vibration 有权
    降低感应振动的芯片外壳

    公开(公告)号：US20090194860A1

    公开(公告)日：2009-08-06

    申请号：US12226999

    申请日：2007-03-21

    申请人： Martin Holzmann ,  Frieder Haag ,  Michael Knauss ,  Florian Grabmaier

    发明人： Martin Holzmann ,  Frieder Haag ,  Michael Knauss ,  Florian Grabmaier

    IPC分类号： H01L23/12

    CPC分类号： B81B7/0058 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/053

    摘要： A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure.

    摘要翻译： 用于容纳芯片结构的预制外壳包括壳体的第一部分，其连接到芯片结构，并且以可弹性偏转的方式连接到紧固到支撑整个壳体的支撑结构的外壳的附加部分。 提供了一种用于阻尼壳体的连接到芯片结构的第一部分的偏转的机构。

    Chip housing having reduced induced vibration
    2.
    发明授权
    Chip housing having reduced induced vibration 有权
    具有减小的诱发振动的芯片壳体

    公开(公告)号：US07939937B2

    公开(公告)日：2011-05-10

    申请号：US12226999

    申请日：2007-03-21

    申请人： Martin Holzmann ,  Frieder Haag ,  Michael Knauss ,  Florian Grabmaier

    发明人： Martin Holzmann ,  Frieder Haag ,  Michael Knauss ,  Florian Grabmaier

    IPC分类号： H01L23/12

    CPC分类号： B81B7/0058 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/053

    摘要： A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure.

    摘要翻译： 用于容纳芯片结构的预制外壳包括壳体的第一部分，其连接到芯片结构，并且以可弹性偏转的方式连接到紧固到支撑整个壳体的支撑结构的外壳的附加部分。 提供了一种用于阻尼壳体的连接到芯片结构的第一部分的偏转的机构。

    Microphone package and method for manufacturing same
    3.
    发明授权
    Microphone package and method for manufacturing same 有权
    麦克风包装及其制造方法

    公开(公告)号：US08705776B2

    公开(公告)日：2014-04-22

    申请号：US13306017

    申请日：2011-11-29

    申请人： Michael Knauss ,  Scott Naugle ,  Andy Doller ,  Eric Ochs

    发明人： Michael Knauss ,  Scott Naugle ,  Andy Doller ,  Eric Ochs

    IPC分类号： H04R1/02 ,  H04R19/00 ,  H04R19/04 ,  H04R1/28

    CPC分类号： H04R19/005 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/086 ,  H04R1/2807 ,  H04R1/406 ,  H04R19/04 ,  H04R31/00 ,  Y10T29/49005 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A System and method to provide a cost-effective implementation of a microphone package, very good microphone performance being achieved even with a high degree of miniaturization. A microphone package includes a MEMS microphone component having a microphone diaphragm, and a housing having a housing base and a housing cover, the housing enclosing the back-side volume of the microphone component, and an acoustic access channel to the microphone diaphragm being provided in the housing which is closed off with respect to the back-side volume and which connects at least one sound opening in the housing to one side of the microphone diaphragm. An interposer is mounted inside the housing which defines the acoustic access channel to the microphone diaphragm in that the interposer is coupled to the sound opening in the housing, and has at least one exit opening above which the microphone component together with the microphone diaphragm is mounted.

    摘要翻译： 一种提供麦克风封装的成本有效的实现的系统和方法，即使在高度小型化的情况下也能实现非常好的麦克风性能。 麦克风封装包括具有麦克风隔膜的MEMS麦克风组件，以及具有壳体底座和壳体盖的壳体，该壳体包围麦克风组件的背面体积，以及提供到麦克风隔膜的声学通道 所述壳体相对于后侧体积被封闭，并且将所述壳体中的至少一个声音开口连接到所述麦克风隔膜的一侧。 插入器安装在壳体内部，其限定到麦克风隔膜的声学通道，因为插入器耦合到壳体中的声音开口，并且具有至少一个出口，在该出口处，麦克风组件与麦克风隔膜一起被安装 。

    Method and system for detecting a spatial movement state of moving objects
    6.
    发明授权
    Method and system for detecting a spatial movement state of moving objects 失效
    用于检测移动物体的空间运动状态的方法和系统

    公开(公告)号：US06925413B2

    公开(公告)日：2005-08-02

    申请号：US10320278

    申请日：2002-12-16

    申请人： Dietmar Krieg ,  Reinhard Neul ,  Dorothea Papathanassiou ,  Roland Mueller-Fiedler ,  Michael Knauss

    发明人： Dietmar Krieg ,  Reinhard Neul ,  Dorothea Papathanassiou ,  Roland Mueller-Fiedler ,  Michael Knauss

    IPC分类号： B60R21/01 ,  B60R21/0132 ,  G01C21/16 ,  G01P9/04 ,  G01P15/18 ,  H05K3/30 ,  G01C17/00 ,  G01C19/00

    CPC分类号： G01C17/00 ,  B60R21/0132 ,  B60R2021/01184 ,  B60R2021/0119 ,  B60R2021/01327 ,  G01C21/16 ,  G01P15/18 ,  H05K3/301

    摘要： A method and a system for detecting the spatial movement state of moving objects, e.g., vehicles. Due to a, for example, non-cartesian arrangement of four rotational rate sensors and/or acceleration sensors, it is also possible to obtain a redundant signal in addition to the desired useful signal indicating the spatial movement state, e.g., the rotational movement and/or acceleration in space; if this redundant signal is large enough in comparison with the rotational rate actually applied, it may be used for detection of the size of the error and the defective sensor. The four sensors are mounted, for example, on a sensor platform forming a three-sided truncated pyramid so that all possible three-way combinations of sensors are mutually linearly independent. The accuracy about the vertical axis is defined by the angle of inclination of the side faces of the truncated pyramid.

    摘要翻译： 一种用于检测运动物体（例如车辆）的空间运动状态的方法和系统。 例如，由于例如四个转速传感器和/或加速度传感器的非笛卡尔布置，除了表示空间运动状态的期望的有用信号之外，还可以获得冗余信号，例如旋转运动和 /或空间加速; 如果该冗余信号与实际施加的旋转速度相比足够大，则其可用于检测误差的尺寸和有缺陷的传感器。 四个传感器例如安装在形成三边截棱锥的传感器平台上，使得传感器的所有可能的三向组合相互线性独立。 垂直轴的精度由截顶棱锥的侧面的倾斜角定义。

    Sensor system
    7.
    发明授权
    Sensor system 有权
    传感器系统

    公开(公告)号：US08671752B2

    公开(公告)日：2014-03-18

    申请号：US12931011

    申请日：2011-01-21

    申请人： Holger Hoefer ,  Uwe Hansen ,  Michael Knauss

    发明人： Holger Hoefer ,  Uwe Hansen ,  Michael Knauss

    IPC分类号： G01D11/10 ,  G01D11/24 ,  H01L29/84 ,  G01P15/08

    CPC分类号： G01P1/023 ,  B81B7/0048 ,  G01D3/028 ,  G01D11/245 ,  G06K19/07747 ,  H01L2224/48137

    摘要： A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.

    摘要翻译： 传感器系统包括支撑元件和附接到支撑元件并具有主平面延伸的传感器元件。 所述支撑元件具有（i）至少一个用于所述传感器系统的电接触的接触元件和（ii）用于应力解耦的至少一个浮雕结构，所述至少一个浮雕结构位于平行于所述主延伸平面的平面中 基本上在所述至少一个接触元件和所述传感器元件之间。

    Sensor system
    9.
    发明申请
    Sensor system 有权
    传感器系统

    公开(公告)号：US20110203369A1

    公开(公告)日：2011-08-25

    申请号：US12931011

    申请日：2011-01-21

    申请人： Holger Hoefer ,  Uwe Hansen ,  Michael Knauss

    发明人： Holger Hoefer ,  Uwe Hansen ,  Michael Knauss

    IPC分类号： G01D11/24

    CPC分类号： G01P1/023 ,  B81B7/0048 ,  G01D3/028 ,  G01D11/245 ,  G06K19/07747 ,  H01L2224/48137

    摘要： A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.

    摘要翻译： 传感器系统包括支撑元件和附接到支撑元件并具有主平面延伸的传感器元件。 所述支撑元件具有（i）至少一个用于所述传感器系统的电接触的接触元件和（ii）用于应力解耦的至少一个浮雕结构，所述至少一个浮雕结构位于平行于所述主延伸平面的平面中 基本上在所述至少一个接触元件和所述传感器元件之间。