摘要:
A multi-set robot is provided that includes a first robot set having a first motor coupled to a first rotatable member that is rotatable about an axis; a second motor coupled to a second rotatable member that is rotatable about the axis; a first plurality of blades vertically spaced from one another; and a first linkage adapted to enable coordinated movement of the blades on rotation of the first and second rotatable members. The robot also includes a second robot set positioned above the first robot set having a third motor coupled to a third rotatable member that is rotatable about the axis; a fourth motor coupled to a fourth rotatable member that is rotatable about the axis; a second plurality of blades vertically spaced from one another; and a second linkage adapted to enable coordinated movement of the blades on rotation of the third and fourth rotatable members. Other aspects are provided.
摘要:
An apparatus for processing semiconductor wafers has an automatic robot for independently and simultaneously handling two wafers (W) at the same time on two separate transfer planes. The robot comprises a first arm assembly having a left and a right arm each mounted at one end for independent rotation in a first horizontal plane about a center vertical axis, the other ends of the arms being movably joined together and holding a blade on which a wafer can be carried, the arms being horizontally bendable near their centers so they can be folded to retract the blade toward the center axis and rotated to a desired angular position, the arms being extendable along a radius from the center axis by moving the arms together near their centers to bring the arms nearly parallel to each other and to extend the blade from the center axis by a maximum amount; and a second arm assembly substantially identical to the first assembly and rotatable in a second horizontal plane closely spaced above the first plane, the operation of the second assembly being substantially identical to that of the first assembly but independent thereof.
摘要:
In a first aspect, a substrate loading station is served by a conveyor which continuously transports substrate carriers. A substrate carrier handler that is part of the substrate loading station operates to exchange substrate carriers with the conveyor while the conveyor is in motion. A carrier exchange procedure may include moving an end effector of the substrate carrier handler at a velocity that substantially matches a velocity of the conveyor. Numerous other aspects are provided.
摘要:
In a first aspect, a wafer loading station adapted to exchange wafer carriers with a wafer carrier transport system comprises a biasing element adapted to urge the end effector of the wafer loading station away from a moveable conveyor of the wafer carrier transport system upon the occurrence of a unscheduled event such as a power failure or an emergency shutdown. In a second aspect, an uninterruptible power supply commands a controller to cause the wafer carrier handler to retract the end effector from the wafer carrier transport system upon the occurrence of the unscheduled event, and provides the power necessary for the same. Numerous other aspects are provided.
摘要:
In a first aspect, a method of opening a substrate carrier is provided. The method includes moving the substrate carrier such that a door of the substrate carrier contacts a supporting member; employing the supporting member to support the door; moving a housing of the substrate carrier away from the supporting member; and pivoting the supporting member and door below a bottom surface of the substrate carrier. Numerous other aspects are provided.
摘要:
In a first aspect, a first apparatus is provided for use in supporting a substrate carrier. The first apparatus includes an overhead transfer flange adapted to couple to a substrate carrier body and an overhead carrier support. The overhead transfer flange has a first side and a second side opposite the first side that is wider than the first side. Numerous other aspects are provided.
摘要:
A kinematic pin and a substrate carrier adapted to deter dislodgment of the substrate carrier from the kinematic pin are provided. A shear member on the kinematic pin interacts with a shear feature of the substrate carrier to deter lateral movement of the substrate carrier relative to the kinematic pin. A substrate carrier handler that employs the kinematic pin is also provided.
摘要:
In a first aspect, a first method of calibrating a substrate carrier loader to a moving conveyor is provided. The first method includes the steps of (1) providing a substrate carrier loader adapted to load substrate carriers onto a moving conveyor; (2) aligning the substrate carrier loader to the moving conveyor; and (3) calibrating the substrate carrier loader to the moving conveyor. Numerous other aspects are provided.
摘要:
In a first aspect, a substrate loading station is served by a conveyor which continuously transports substrate carriers. A substrate carrier handler that is part of the substrate loading station operates to exchange substrate carriers with the conveyor while the conveyor is in motion. A carrier exchange procedure may include moving an end effector of the substrate carrier handler at a velocity that substantially matches a velocity of the conveyor. Numerous other aspects are provided.
摘要:
In a first aspect, a substrate loading station is served by a conveyor which continuously transports substrate carriers. A substrate carrier handler that is part of the substrate loading station operates to exchange substrate carriers with the conveyor while the conveyor is in motion. A carrier exchange procedure may include moving an end effector of the substrate carrier handler at a velocity that substantially matches a velocity of the conveyor. A balancing mass is coupled directly or indirectly to a frame on which the substrate carrier handler is mounted and is adapted to accelerate in a direction opposite to the direction of end effector acceleration, as the end effector accelerates. Thus, inertial loads may be substantially balanced, and frame vibration reduced, despite potentially high rates of acceleration. Numerous other aspects are provided.