摘要:
A braille printing apparatus utilizes non-impact printing technology to provide high-speed, high-volume production of printed braille materials. The document carrying the information to be printed in braille is scanned and read under the control of a computer. The computer outputs the object information in the form of control signals. In accordance with these control signals, a write head projects a beam of light to form a latent image on the charged surface of a rotating drum. Toner is used to develop the image and transfer it to paper, where it is fused. A coarse-grain toner is used, and is applied in a sufficient quantities thereby produce printed braille materials.
摘要:
The present invention is directed to an LED array chip which includes a plurality of LEDs which are integrated thereon and has a thermal conductor on the array chip in the vicinity of, and on the same side as a light emitting surface of each LED on the array chip. The thermal conductor extends away from each LED and is connected to a radiating member such as a heat sink which is provided outside of the array chip. The thermal conductor can be electrically conductive, and in such case can be electrically connected to an electrode on a surface of the array chip opposite to the light emitting surfaces of the plurality of LEDs.
摘要:
A pattern inspection method and apparatus are provided for sequentially imaging plural chips formed on a substrate to be inspected to and obtaining inspection images and reference images, calculating a position gap between the inspection images and the reference images using a recipe created in advance by using another substrate of the same kind or type as the substrate, the recipe including information for determining which pattern sections are to be selected and discarded, aligning the inspection images and the reference images using information of the position gap from the calculating step, and comparing the inspection images with the reference images aligned by the aligning step and extracting a defect candidate.
摘要:
An array of light-emitting diodes each having a junction between a region of a first conductivity type and a region of a second conductivity type. The array fabrication process offers the elimination of wafer breakage is eliminated and an array with stable optical output power.
摘要:
A pattern inspection method including: sequentially imaging plural chips formed on a substrate; selecting a pattern which is suitable for calculating position gap between an inspection image of a subject chip and reference image stored in memory from an image of a firstly imaged chip among said sequentially imaged plural chips formed on the substrate; computing position gap between an inspection image of a chip obtained by the sequential imaging and reference image stored in a memory by using a positional information of a pattern image included in the inspection image and a reference pattern image included in the reference image which are both corresponding to the pattern selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image and extracting a difference as a defect candidate.
摘要:
An apparatus correctly detects critical defects in spaces between wiring patterns on semiconductor integrated devices. The apparatus picks up gray level images from semiconductor dies, sequentially reads the images strip by strip, each strip consisting of pixels aligned in a row or column direction, calculates an optimum grouping operator for the strip, divides the pixels into groups according to the grouping operators, sets thresholds for the groups, compares the thresholds with gray level differences between the gray level images, and detects defects on the semiconductor dies. Also provided is a method to achieve this technique.
摘要:
A surface emitting light-emitting diode has in a body of a semiconductor material a light-emitting p-n junction, a first electrode on a portion of one surface of the body and a second electrode on another surface of the body opposite the one surface. A current-block region is provided in the body under the first electrode and between the first electrode and the p-n junction. This suppresses light emission from beneath the first electrode and applies current injection only to regions where it is effective for producing surface emission so as to improve the emission efficiency of the diode.
摘要:
A pattern inspection method including: sequentially imaging plural chips formed on a substrate; selecting a pattern which is suitable for calculating position gap between an inspection image of a subject chip and reference image stored in memory from an image of a firstly imaged chip among said sequentially imaged plural chips formed on the substrate; computing position gap between an inspection image of a chip obtained by the sequential imaging and reference image stored in a memory by using a positional information of a pattern image included in the inspection image and a reference pattern image included in the reference image which are both corresponding to the pattern selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image and extracting a difference as a defect candidate.
摘要:
Disclosed are a method and apparatus for inspection by pattern comparison enabling cell-cell comparison by software processing even when the array pitch R of the cells is not a whole multiple of the pixel pitch P, wherein provision is made of an imaging device for capturing an image of patterns having a plurality of basic patterns repeating at a predetermined pitch and generating pixel data, a memory for storing the image data, and an image processor unit for successively comparing corresponding pixel data of the basic patterns based on the pixel data, the image processor unit setting a first whole number by which the length of the predetermined pitch multiplied by the first whole number becomes a whole multiple of the pixel pitch when the predetermined pitch is expressed by a resolution of at least a predetermined resolution pitch smaller than the pixel pitch and successively comparing the corresponding pixel data of basic patterns said first whole number of pattern away.
摘要:
A pattern inspection method including: sequentially imaging plural chip formed on a substrate; selecting at least one of pattern sections of each inspection image obtained by the imaging, while discarding other pattern sections, based on a recipe created in advance, the recipe including information for determining which pattern sections to be selected or discarded; calculating position gap between an inspection image of a chip obtained by the imaging and a reference image stored in a memory by using positional information of pattern images included in the inspection image and reference pattern images which are both corresponding to the at least one of pattern sections selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image, and extracting a difference between the two images as a defect candidate.