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公开(公告)号：US07210789B2
公开(公告)日：2007-05-01
申请号：US10919289
申请日：2004-08-17
CPC分类号： G02F1/133385
摘要： A liquid crystal display device in which light from a light source enters a liquid crystal panel and exits therefrom for projection of an image and includes a heat conducting member and a cooling unit. The heat conducting member is contacted with at least one of a light incident surface and a light outgoing surface of the liquid crystal panel, is light-transmissive, and has a larger area than a light transmitting area of the liquid crystal panel. The cooling jacket, which comprises a flow channel for a cooling medium in its inside, is provided around the heat conducting member so that the flow channel exists only outside of the light transmitting area in a surface direction of the liquid crystal panel.
摘要翻译： 一种液晶显示装置，其中来自光源的光进入液晶面板并从其中离开以投影图像，并且包括导热构件和冷却单元。 导热构件与液晶面板的光入射面和光出射面中的至少一个接触是透光性的，并且具有比液晶面板的透光面积大的面积。 在导热构件周围设置有包括用于其内部的冷却介质的流路的冷却套，使得流路仅在液晶面板的表面方向上存在于透光区域的外侧。
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公开(公告)号：US20050213018A1
公开(公告)日：2005-09-29
申请号：US10919289
申请日：2004-08-17
CPC分类号： G02F1/133385
摘要： The present invention provides a liquid crystal display device and a liquid crystal cooling unit, which are reduced in noise and have high cooling capability, and in which air is not directly blown on a liquid crystal panel module or a polarizing plate. A cooling jacket having an internal flow channel is formed by being adhered to a periphery of a light-transmissive, highly heat-conducting sapphire plate larger than a light transmitting area to which a polarizing film is applied or attached, by means of a highly heat-conducting adhesive. A liquid crystal cooling unit is formed by clamping the liquid crystal panel module by inserting a light-transmissive, highly heat-conducting substance. Further, the liquid crystal panel module and the polarizing film are cooled by circulating a cooling medium in the internal flow channel of the cooling jacket.
摘要翻译： 本发明提供了一种液晶显示装置和液晶冷却装置，其噪声降低并且具有高冷却能力，并且其中空气不直接吹在液晶面板模块或偏振板上。 具有内部流动通道的冷却套管通过粘附到透光性高的导热蓝宝石板的周边上，该蓝宝石板大于通过高度热量施加或附着偏光膜的透光区域 导电胶。 通过插入透光性高导热性物质来夹持液晶面板模块来形成液晶冷却单元。 此外，通过在冷却套的内部流路中循环冷却介质来冷却液晶面板模块和偏振膜。
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公开(公告)号：US08240166B2
公开(公告)日：2012-08-14
申请号：US12430153
申请日：2009-04-27
申请人： Noriyo Nishijima , Shigeo Ohashi , Nariaki Shigyo , Tatsuo Morita
发明人： Noriyo Nishijima , Shigeo Ohashi , Nariaki Shigyo , Tatsuo Morita
IPC分类号： F25D23/12
CPC分类号： G03B21/16
摘要： An electronic equipment includes a cooling system using boiling and condensation of a refrigerant, especially stabilizes the cooling performance, and reduces the influence which vibration accompanying phase change of boiling and condensation gives to the electronic equipment. Electronic equipment includes a cooling system including a cooling part which cools heat generating from a heat generator such as a heat generating component by using boiling of a refrigerant and is thermally connected to the heat generator such as the heat generating element, a heat radiation part which radiates heat absorbed by the refrigerant in the cooling part by condensation, a refrigerant drive part for delivering the condensed refrigerant to the cooling part again, and piping which fluidly connects them, and the electronic equipment includes preliminary heating means for heating the refrigerant, which flows to the cooling part from the refrigerant drive part, between the refrigerant drive part and the cooling part.
摘要翻译： 电子设备包括使用制冷剂的沸腾和冷凝的冷却系统，特别是稳定冷却性能，并且减少伴随着冷凝相变的振动对电子设备的影响。 电子设备包括冷却系统，其包括冷却部件，该冷却部件通过使用沸腾的制冷剂来冷却来自诸如发热部件的发热部件的发热的热量，并且与发热元件等发热体热连接;热辐射部件 通过冷凝来散发由冷却部中的制冷剂吸收的热量，再次将冷凝后的制冷剂输送到冷却部的制冷剂驱动部以及流体连接它们的管路，电子设备包括用于加热流过的制冷剂的预热装置 从制冷剂驱动部分到制冷剂驱动部分和冷却部分之间的冷却部分。
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公开(公告)号：US08937390B2
公开(公告)日：2015-01-20
申请号：US14199078
申请日：2014-03-06
申请人： Nae Hisano , Shigeo Ohashi , Yasuo Osone , Yasuhiro Naka , Hiroyuki Tenmei , Kunihiko Nishi , Hiroaki Ikeda , Masakazu Ishino , Hideharu Miyake , Shiro Uchiyama
发明人： Nae Hisano , Shigeo Ohashi , Yasuo Osone , Yasuhiro Naka , Hiroyuki Tenmei , Kunihiko Nishi , Hiroaki Ikeda , Masakazu Ishino , Hideharu Miyake , Shiro Uchiyama
CPC分类号： H01L24/14 , H01L23/3128 , H01L23/34 , H01L23/473 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/06565 , H01L2924/1461 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/18161 , H01L2924/00
摘要： A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.
摘要翻译： 半导体器件包括安装基板，设置在所述安装基板上方的半导体元件，设置在所述安装基板上方的封装基板，其间具有所述半导体元件，并通过主连接凸块与所述半导体元件电连接;冷却所述半导体 液体制冷剂的热接收部分设置在所述半导体元件和所述安装基板之间，以及设置在所述封装基板和所述安装基板之间的多个次级连接凸块。
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公开(公告)号：US20110050654A1
公开(公告)日：2011-03-03
申请号：US12788019
申请日：2010-05-26
IPC分类号： G06F3/038
CPC分类号： G02B6/0078 , G02B6/0046 , G02B6/0055 , G02B6/0068 , G02B6/0073 , G02B6/0083 , G02B6/0085 , G02F1/133603 , G02F2001/133628 , H01L33/644 , H05K1/0203 , H05K1/181 , H05K2201/10106 , H05K2201/10545
摘要： A backlight apparatus includes a plurality of LEDs as light-sources, a plurality of light-guiding plates, lights from the LEDs being made incident into the light-guiding plates, the incident lights being then converted into a surface-like light, and being guided onto the liquid-crystal panel side by the light-guiding plates, a plurality of LED drivers for supplying currents to the plurality of LEDs, and a plurality of LED driving boards on which the plurality of LEDs and LED drivers are implemented, wherein the plurality of LEDs are implemented on one surface of each LED driving board, and each light-guiding plate is also provided thereon, each of the LED drivers being implemented on the other surface of each LED driving board.
摘要翻译： 背光装置包括作为光源的多个LED，多个导光板，来自LED的光入射到导光板中，然后将入射光转换成表面状光，并且 通过导光板引导到液晶面板侧，用于向多个LED供电的多个LED驱动器和多个LED驱动板，多个LED驱动板和LED驱动器在其上被实现，其中， 在每个LED驱动板的一个表面上实现多个LED，并且每个导光板也设置在其上，每个LED驱动器被实施在每个LED驱动板的另一个表面上。
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公开(公告)号：US20060185826A1
公开(公告)日：2006-08-24
申请号：US11288097
申请日：2005-11-29
申请人： Shigeo Ohashi
发明人： Shigeo Ohashi
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： For providing a liquid cooling system for an electronic apparatus having a heat-generating element within a housing thereof, enabling small-sizes thereof and being effective for lowering noises when the apparatus is operated, equipped with a new type of a driving means for a liquid coolant therein, comprises a heat-receiving jacket 100 for transferring heat generated from the heat-generating element to a liquid coolant, to evaporate it, within an inside thereof; a radiator 200 for guiding the evaporated coolant supplied from the heat-receiving jacket into an inside thereof, so as to cool it to be liquefied; and a driving means 300 for applying driving force for circulating the liquid coolant, through repetition of heating and cooling upon a portion of the liquefied liquid coolant supplied from the radiator, while restricting a flow direction of the liquid coolant within an inside thereof into one direction, whereby circulating said liquid coolant within a circulation loop including the heat-receiving jacket, the radiator, and the driving means.
摘要翻译： 为了提供一种用于具有在其壳体内的发热元件的电子设备的液体冷却系统，能够使其小型化并且在设备运行时有效地降低噪声，配备有新型的用于液体的驱动装置 冷却剂包括：热接收套管100，用于将发热元件产生的热量传递到液体冷却剂，以使其在其内部蒸发; 散热器200，用于将从受热套管供给的蒸发的冷却剂引导到其内部，以使其冷却以液化; 以及驱动装置300，用于施加用于使液体冷却剂循环的驱动力，通过对从散热器供应的液化冷却剂的一部分重复进行加热和冷却，同时将其内部的液体冷却剂的流动方向限制在一个方向 使循环回路中的液体冷却剂循环，该循环回路包括受热套，散热器和驱动装置。
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公开(公告)号：US06987668B2
公开(公告)日：2006-01-17
申请号：US10847334
申请日：2004-05-18
申请人： Makoto Kitano , Takashi Naganawa , Yuji Yoshitomi , Rintaro Minamitani , Shigeo Ohashi , Noriyuki Ashiwake , Yoshihiro Kondo , Tsuyoshi Nakagawa
发明人： Makoto Kitano , Takashi Naganawa , Yuji Yoshitomi , Rintaro Minamitani , Shigeo Ohashi , Noriyuki Ashiwake , Yoshihiro Kondo , Tsuyoshi Nakagawa
IPC分类号： G06F1/20
CPC分类号： G06F1/203 , G06F2200/201 , G06F2200/203
摘要： A liquid cooling system having a circulator for circulating a cooling liquid therethrough including an input portion for receiving the cooling liquid and a separate output portion for supplying the cooling liquid. A heat receiving jacket supplied with the cooling liquid from the circulator and positioned to received heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the circulation means so that the cooling liquid circulates within a closed flow passage. An accumulating portion is further formed within a portion of the closed flow passage for accumulating the cooling liquid therein.
摘要翻译： 一种液体冷却系统，具有用于循环冷却液的循环器，包括用于接收冷却液的输入部分和用于供应冷却液的单独的输出部分。 供给来自循环器的冷却液的受热套，并且被配置为接收从发热体产生的热量，散热部，其由通过所述受热外套的冷却液供给的散热用的散热部，以及用于循环的部件 冷却液通过散热部分进入循环装置，使得冷却液体在封闭的流动通道内循环。 在封闭流路的一部分内进一步形成蓄积部，用于将冷却液积存在其中。
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公开(公告)号：US06885556B2
公开(公告)日：2005-04-26
申请号：US10874232
申请日：2004-06-24
申请人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
发明人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
IPC分类号： G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/203 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus includes a case mounting a semiconductor element within an inside thereof, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the casing, and a liquid driver for driving a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein with at least a predetermined volume of the coolant to delimit a coolant surface within the tank, wherein the tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.
摘要翻译： 一种电子设备，包括在其内部安装半导体元件的壳体，与半导体元件热连接的受热部件，设置在壳体的内侧表面上的散热部件和用于驱动液体的液体驱动器 散热构件和受热构件之间的冷却剂。 该装置还包括储存有至少预定体积的冷却剂的液体冷却剂的罐，以限定罐内的冷却剂表面，其中罐，散热构件和受热构件与管连接， 连接到罐中的吸入管的吸入端部位于始终低于冷却剂表面的位置，而与罐的位置的变化无关。
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9.发明授权Electronic apparatus with plate-like member having plural recesses containing heat accumulating material 失效具有板状构件的电子设备具有包含蓄热材料的多个凹部公开(公告)号：US06847113B2
公开(公告)日：2005-01-25
申请号：US10419943
申请日：2003-04-22
IPC分类号： H05K7/20 , H01L23/34 , H01L23/36 , H01L23/427
CPC分类号： H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus, including a plate-like member, enclosing a heat-accumulating material of latent heat type within an inside thereof; a semiconductor element, being connected with the member, thermally; and a housing covering the semiconductor element and the member. A surface of the member, in contact with the semiconductor element, is provided with recess-portions in plural numbers thereof, each being recessed in a direction of the heat-accumulating material of latent heat type, so as to enclose the heat-accumulating material of latent heat type into the recess portions. The plate-like member and the housing are connected with each other, thermally, thereby providing a cooling device, being able to cool the electronic circuit component(s) building up the electronic apparatus, as well as being superior in operability.
摘要翻译： 一种包括板状构件的电子设备，其内部包围有潜热型蓄热材料; 与该构件连接的半导体元件; 以及覆盖半导体元件和构件的壳体。 与半导体元件接触的构件的表面设置有多个凹部，每个凹部沿着潜热型蓄热材料的方向凹陷，以包围蓄热材料 潜热型进入凹部。 板状构件和壳体彼此热连接，从而提供冷却装置，能够冷却构成电子设备的电子电路部件，并且具有优异的可操作性。
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10.发明授权Electronic apparatus having means for cooling a semiconductor element mounted therein 有权具有用于冷却安装在其中的半导体元件的装置的电子设备公开(公告)号：US06430042B1
公开(公告)日：2002-08-06
申请号：US09653584
申请日：2000-08-31
IPC分类号： H05K720
CPC分类号： G06F1/203 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus comprises a semiconductor element mounted inside a housing, a keyboard fitted to the housing, a heat radiating member provided on one face of the semiconductor element and a thermal conductive duct provided on the other face of the element. The electronic apparatus further comprises a wall thermally connecting an upper wall and a lower wall of the duct. The duct is provided with a fan.
摘要翻译： 电子设备包括安装在壳体内的半导体元件，装配到壳体的键盘，设置在半导体元件的一个面上的散热构件和设置在元件的另一个面上的导热管。 电子设备还包括热连接管道的上壁和下壁的壁。 管道设有风扇。
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