摘要:
This invention provides a novel speech coding system which recursively executes a filter-applied "Toeplitz characteristic" by causing a drive signal (i.e., an excitation signal) to be converted into a "Toeplitz matrix" when detecting a pitch period in which distortion of the input vector and the vector subsequent to the application of filter-applied computation to the drive signal vector in the pitch forecast called either "closed loop" or "compatible code book" is minimized. The vector quantization method substantially making up the speech coding system of the invention is characteristically used by the system.
摘要:
This invention provides a novel speech coding system which recursively executes a filter-applied "Toeplitz characteristic" by causing a drive signal (i.e., an excitation signal) to be converted into a "Toeplitz matrix" when detecting a pitch period in which distortion of the input vector and the vector subsequent to the application of filter-applied computation to the drive signal vector in the pitch forecast called either "closed loop" or "compatible code book" is minimized. The vector quantization method substantially making up the speech coding system of the invention is characteristically used by the system.
摘要:
A speech communication apparatus of the present invention includes, in addition to an echo canceller for canceling an acoustic echo generated in a hands-free speech space, a chirp signal generating unit and a training unit. The chirp signal generating unit generates a chirp signal adequate for initial training of the echo canceller. The training control unit enables the chirp signal generating unit to generate a chirp signal, when a predetermined condition for starting hands-free speaking is satisfied, and a chirp tone corresponding to the chirp signal to be output as a volume-amplified tone from the hands-free speaker. The echo canceller performs initial training of the echo canceller based on the chirp tone.
摘要:
A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
摘要:
A wobble determination device 1 appropriately determines the wobble of a vehicle and does not cause inconvenience for a driver.The wobble determination device 1 includes a steering determination unit 41 that determines whether the driver of a vehicle performs sudden steering after a non-steering state of the driver is maintained for a predetermined period of time and performs sudden return steering over a steering position in the non-steering state in a direction opposite to a direction of the sudden steering after the sudden steering and a wobble determination unit 42 that determines that the vehicle wobbles when the steering determination unit 41 determines that the steering of the driver is the sudden return steering which is performed over the steering position in the non-steering state.
摘要:
The low-level consciousness determination system includes curved road determination means for determining whether a road on which the vehicle is traveling is a curved road and determining whether the vehicle is traveling on the outside of the curved road or on the inside of the curved road when the road is the curved road, threshold value setting means for setting different sudden steering determination threshold values when the curved road determination means determines that the road is not the curved road, when the curved road determination means determines that the vehicle is traveling on the outside of the curved road, and when the curved road determination means determines that the vehicle is traveling on the inside of the curved road, and sudden steering detection means for detecting the sudden steering on the basis of the threshold values set by the threshold value setting means after the non-steering state is detected.
摘要:
A drift-assessment device includes a turn information detection unit that detects turn information of a vehicle, an image recognition and detection unit that detects position information of the vehicle relative to a lane, a vehicle speed detection unit that detects a vehicle speed, a selection unit that selects the image recognition and detection unit when the vehicle speed is equal to or greater than a predetermined vehicle speed and selects the turn information detection unit when the vehicle speed is less than the predetermined vehicle speed, and a drift-assessment unit that determines the drift of the vehicle based on the position information of the vehicle relative to the lane when the selection unit selects the image recognition and detection unit and determines the drift of the vehicle based on the turn information of the vehicle when the selection unit selects the turn information detection unit.
摘要:
The present invention aims at providing a steering assistance apparatus which can accurately detect a curve exit of a running path and perform steering assistance control with an excellent running path following capability. The steering assistance apparatus of the present invention is a steering assistance apparatus 1 for providing a steering mechanism with a steering torque such that a vehicle runs along a running path according to an image capturing the running path in front of the vehicle, which estimates a curve direction of the running path by processing the image, estimates a steering direction of a driver of the vehicle according to a steering operation of the driver, and determines that the vehicle is running through a curve exit according to a fact that the estimated curve direction and steering direction do not coincide with each other. This makes it possible to determine the curve exit of the running path accurately and perform appropriate steering assistance control.
摘要:
A method of forming a laminated body includes a first lamination step of forming a preceding lamination sheet which is substantially treated as one green sheet by laminating and bonding at least two green sheets out of a plurality of green sheets with predetermined pattern printed thereon; a printing step of printing a predetermined pattern on the preceding lamination sheet and at least one non-preceding lamination sheet which is a not used for forming the preceding lamination sheet; and a second lamination step of laminating and bonding the preceding lamination sheet and non-preceding lamination sheet, on which the predetermined pattern is printed in the printing step, in a predetermined order.
摘要:
A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.