摘要:
An image correction data generating system for a display panel that uses unpolished glass is equipped with a signal generator, an imager, and a controller. The signal generator supplies the display panel with a signal for causing that display panel to output an image. The imager captures an output image. The imager is able to resolve an area smaller than the individual pixel sizes of a plurality of pixels. The controller is equipped with an instructing unit, an image acquirer, a high-pass filter, and a correction data generator. The instructing unit outputs instructions for supplying a signal value shared across the entire surface of the display panel to the signal generator. The image acquirer acquires output image data from the imager. The high-pass filter computes high-pass data by applying high-pass filtering to the output image data. The correction data generator outputs an image correction table corresponding to the high-pass data.
摘要:
A honeycomb structure is provided that includes a plurality of pillar-shaped honeycomb fired bodies, each having a number of cells longitudinally disposed in parallel with one another with a cell wall therebetween. An adhesive layer is interposed between adjacent honeycomb fired bodies of the plurality of honeycomb fired bodies to combine the plurality of honeycomb fired bodies together, and a sealing material layer is formed on an outer peripheral face of the combined plurality of honeycomb fired bodies. At least two honeycomb fired bodies of the plurality of honeycomb fired bodies have an outer wall that forms a portion of the outer peripheral face of the combined plurality of honeycomb fired bodies. At least one of the outer walls has a protruding portion extending from a surface thereof, and the protruding portion is made from a same material as a material of the at least one outer wall.
摘要:
The vacuum chuck according to the present invention is provided with a sucking plate for sucking and holding an object to be sucked, in which a sucking layer made of a porous ceramic and a dense material layer are integrated, the sucking layer being located on the side for sucking the object to be sucked, wherein the dense material layer is formed by impregnating the porous ceramic with a metal.
摘要:
A honeycomb structure includes a plurality of honeycomb fired bodies. Each of the plurality of honeycomb fired bodies has a longitudinal direction and cell walls extending along the longitudinal direction to define cells. An adhesive layer is provided between the plurality of honeycomb fired bodies to connect the plurality of honeycomb fired bodies so that each longitudinal direction is substantially in parallel with each other. The plurality of honeycomb fired bodies include at least one center-portion honeycomb fired body located at a center portion of the honeycomb structure and at least one periphery honeycomb fired body surrounding the center-portion honeycomb fired body to form a peripheral face of the honeycomb structure. The periphery honeycomb fired body includes contact faces contacting the adhesive layer. At least one of the contact faces has irregularities.
摘要:
The vacuum chuck according to the present invention is provided with a sucking plate for sucking and holding an object to be sucked, in which a sucking layer made of a porous ceramic and a dense material layer are integrated, the sucking layer being located on the side for sucking the object to be sucked, wherein the dense material layer is formed by impregnating the porous ceramic with a metal.
摘要:
A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
摘要:
A honeycomb structure includes a ceramic block formed by a plurality of pillar-shaped honeycomb fired bodies each having a large number of cells longitudinally disposed in parallel with one another with a cell wall between the cells. The plurality of honeycomb fired bodies are combined with one another by interposing an adhesive layer with a sealing material layer formed on a peripheral face of the ceramic block and include a plurality of different shapes of the honeycomb fired bodies. A thickness of a peripheral wall forming the peripheral face of the ceramic block is virtually even. A shape of a cell located at an outermost periphery of the ceramic block is virtually identical with a shape of a cell located at a place other than the outermost periphery of the ceramic block. On the peripheral wall of the honeycomb fired body, a step is provided.
摘要:
A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
摘要:
A method is provided that includes extrusion-molding a raw material composition containing ceramic powder and a binder to manufacture a coupled honeycomb molded body having a shape in which a plurality of pillar-shaped honeycomb molded bodies, each having a number of cells disposed in parallel with one another in a longitudinal direction with a cell wall therebetween, are integrated with one another by interposing a coupling portion. The method includes firing the coupled honeycomb molded body to manufacture a coupled honeycomb fired body, cutting the coupling portion to manufacture coupling-portion-cut honeycomb fired bodies, and binding a plurality of honeycomb fired bodies by interposing an adhesive layer, where at least one of the bound honeycomb fired bodies is a coupling-portion-cut honeycomb fired body.