Current collector for non-aqueous secondary battery, electrode plate for non-aqueous secondary battery using the same, and non-aqueous secondary battery
    1.
    发明授权
    Current collector for non-aqueous secondary battery, electrode plate for non-aqueous secondary battery using the same, and non-aqueous secondary battery 有权
    用于非水二次电池的集电器,使用其的非水二次电池的电极板和非水二次电池

    公开(公告)号:US08202642B2

    公开(公告)日:2012-06-19

    申请号:US12376418

    申请日:2007-11-15

    CPC分类号: H01M4/72 H01M10/052

    摘要: An object of the invention is to provide a current collector for a non-aqueous secondary battery in which the strength of the current collector is sufficient in forming an electrode plate and an active material can be efficiently disposed on the protrusions of the current collector, and to provide an electrode plate for a non-aqueous secondary battery and a non-aqueous secondary battery using the same. The invention relates to a current collector for a non-aqueous secondary battery, including a metal foil for carrying at least a positive electrode active material or negative electrode active material. Protrusions are formed in a predetermined arrangement pattern on at least one face of the metal foil and at least tops of the protrusions are not compressed. The arrangement pattern includes: a row direction in which the protrusions are aligned linearly at an equal pitch; and a column direction in which row units comprising a group of the protrusions aligned in the row direction are aligned in parallel at a predetermined interval. The respective protrusions of any one of the row units are displaced in the row direction from the protrusions of another row unit that is adjacent in the column direction. The invention also pertains to an electrode plate for a non-aqueous secondary battery and a non-aqueous secondary battery using the same.

    摘要翻译: 本发明的目的是提供一种用于非水二次电池的集电器,其中集电器的强度足以形成电极板,并且活性材料可以有效地设置在集电器的突起上,并且 提供一种用于非水二次电池的电极板和使用其的非水二次电池。 本发明涉及一种用于非水二次电池的集电器,其包括用于承载至少一种正极活性材料或负极活性材料的金属箔。 突起以金属箔的至少一个表面上的预定布置图案形成,并且突起的至少顶部不被压缩。 排列图案包括:突起以相等的间距线性排列的行方向; 并且列方向,其中包括在行方向上排列的一组突起的行单元以预定间隔平行排列。 行单元中的任何一个的相应突起从列方向上相邻的另一行单元的突起在行方向上移位。 本发明还涉及一种用于非水二次电池的电极板和使用其的非水二次电池。

    CURRENT COLLECTOR FOR NON-AQUEOUS SECONDARY BATTERY, ELECTRODE PLATE FOR NON AQUEOUS SECONDARY BATTERY USING THE SAME, AND NON-AQUEOUS SECONDARY BATTERY
    2.
    发明申请
    CURRENT COLLECTOR FOR NON-AQUEOUS SECONDARY BATTERY, ELECTRODE PLATE FOR NON AQUEOUS SECONDARY BATTERY USING THE SAME, AND NON-AQUEOUS SECONDARY BATTERY 有权
    用于非水性二次电池的电流收集器,使用相同的非水性二次电池的电极板和非水性二次电池

    公开(公告)号:US20100167111A1

    公开(公告)日:2010-07-01

    申请号:US12376418

    申请日:2007-11-15

    IPC分类号: H01M6/10 H01M4/02

    CPC分类号: H01M4/72 H01M10/052

    摘要: An object of the invention is to provide a current collector for a non-aqueous secondary battery in which the strength of the current collector is sufficient in forming an electrode plate and an active material can be efficiently disposed on the protrusions of the current collector, and to provide an electrode plate for a non-aqueous secondary battery and a non-aqueous secondary battery using the same. The invention relates to a current collector for a non-aqueous secondary battery, including a metal foil for carrying at least a positive electrode active material or negative electrode active material. Protrusions are formed in a predetermined arrangement pattern on at least one face of the metal foil and at least tops of the protrusions are not compressed. The arrangement pattern includes: a row direction in which the protrusions are aligned linearly at an equal pitch; and a column direction in which row units comprising a group of the protrusions aligned in the row direction are aligned in parallel at a predetermined interval. The respective protrusions of any one of the row units are displaced in the row direction from the protrusions of another row unit that is adjacent in the column direction. The invention also pertains to an electrode plate for a non-aqueous secondary battery and a non-aqueous secondary battery using the same.

    摘要翻译: 本发明的目的是提供一种用于非水二次电池的集电器,其中集电器的强度足以形成电极板,并且活性材料可以有效地设置在集电器的突起上,并且 提供一种用于非水二次电池的电极板和使用其的非水二次电池。 本发明涉及一种用于非水二次电池的集电器,其包括用于承载至少一种正极活性材料或负极活性材料的金属箔。 突起以金属箔的至少一个表面上的预定布置图案形成,并且突起的至少顶部不被压缩。 排列图案包括:突起以相等的间距线性排列的行方向; 并且列方向,其中包括在行方向上排列的一组突起的行单元以预定间隔平行排列。 行单元中的任何一个的相应突起从列方向上相邻的另一行单元的突起在行方向上移位。 本发明还涉及一种用于非水二次电池的电极板和使用其的非水二次电池。

    Method of manufacturing thin film which suppresses unnecessary scattering and deposition of a source material
    3.
    发明授权
    Method of manufacturing thin film which suppresses unnecessary scattering and deposition of a source material 有权
    制造薄膜的方法,其抑制源材料的不必要的散射和沉积

    公开(公告)号:US08877291B2

    公开(公告)日:2014-11-04

    申请号:US13390633

    申请日:2011-06-01

    摘要: The present invention provides a thin film manufacturing method which realizes stable, highly-efficient film formation using a nozzle-type evaporation source while avoiding unnecessary scattering and deposition of a film formation material before the start of the film formation. Used is a film forming apparatus including: an evaporation chamber 16; a film forming chamber 17 in which a substrate 21 is provided; an evaporation source 19 holding a film formation material 15 and including an opening surface 14; a moving mechanism 35 configured to cause the evaporation source 19 to move; and a conductance variable structure 34. The film forming chamber 17 and the evaporation chamber 16 are evacuated. In a state where the differential pressure between these chambers can be secured by the conductance variable structure 34, the nonreactive gas is introduced to the evaporation chamber 16 to adjust the pressure in the evaporation chamber 16 to predetermined pressure or more. Thus, the evaporation of the film formation material is suppressed. In the same state as above, the nonreactive gas is introduced to the film forming chamber 17 to adjust the pressure in the film forming chamber 17 to the predetermined pressure or more. The conductance variable structure 34 is activated to cancel the above state. Then, the evaporation source 19 is moved by the moving mechanism 35, so that the opening surface 14 is located close to the substrate 21. The pressure in each chamber is decreased to less than the predetermined pressure. Thus, the suppression of the evaporation of the film formation material is canceled, and the film formation is started.

    摘要翻译: 本发明提供一种薄膜制造方法,其使用喷嘴型蒸发源实现稳定,高效的成膜,同时避免在成膜开始之前成膜材料的不必要的散射和沉积。 使用的成膜装置包括:蒸发室16; 设置有基板21的成膜室17; 保持成膜材料15并包括开口表面14的蒸发源19; 构造成使蒸发源19移动的移动机构35; 和导电可变结构34.成膜室17和蒸发室16被抽真空。 在通过电导可变结构34可以确保这些室之间的压差的状态下,将非反应性气体引入蒸发室16,以将蒸发室16中的压力调节至预定压力或更大。 因此,抑制了成膜材料的蒸发。 在与上述相同的状态下,将非反应性气体引入成膜室17,以将成膜室17中的压力调节至预定压力或更大。 电导变量结构34被激活以消除上述状态。 然后,蒸发源19被移动机构35移动,使得开口表面14位于靠近基板21的位置。每个室中的压力降低到小于预定压力。 因此,抑制成膜材料的蒸发被消除,并且开始成膜。

    Method of manufacturing thin film which suppresses unnecessary scattering and deposition of a source material
    5.
    发明授权
    Method of manufacturing thin film which suppresses unnecessary scattering and deposition of a source material 有权
    制造薄膜的方法,其抑制源材料的不必要的散射和沉积

    公开(公告)号:US08865258B2

    公开(公告)日:2014-10-21

    申请号:US13392433

    申请日:2011-06-01

    摘要: The present invention provides a thin film manufacturing method which realizes stable, highly-efficient film formation using a nozzle-type evaporation source while avoiding unnecessary scattering and deposition of a film formation material after the termination of the film formation. Used is a film forming apparatus including: an evaporation chamber 16; a film forming chamber 17 in which a substrate 21 is provided; an evaporation source 19 holding a film formation material 15 and including an opening surface 14; a moving mechanism 35 configured to cause the evaporation source 19 to move; and a conductance variable structure 34. The film formation is performed in a state where the opening surface 14 of the evaporation source 19 holding the heated film formation material is located close to the substrate 21 while evacuating the evaporation chamber 16 and the film forming chamber 17 without shutting off communication between the evaporation chamber 16 and the film forming chamber 17 by the conductance variable structure 34. Next, the evaporation of the film formation material is suppressed by introducing a nonreactive gas to the evaporation chamber 16 and the film forming chamber 17 to adjust pressure in each chamber to predetermined pressure or more. Then, the evaporation source 19 is moved by the moving mechanism 35 such that the opening surface 14 is located away from the substrate 21. The conductance variable structure is activated to shut off the communication between these chambers, and the film formation material is cooled while continuously introducing the nonreactive gas to the evaporation chamber 16.

    摘要翻译: 本发明提供一种薄膜制造方法,其使用喷嘴型蒸发源实现稳定,高效的成膜,同时避免成膜材料终止后不必要的成膜材料的散射和沉积。 使用的成膜装置包括:蒸发室16; 设置有基板21的成膜室17; 保持成膜材料15并包括开口表面14的蒸发源19; 构造成使蒸发源19移动的移动机构35; 和导电可变结构34.成膜是在保持加热成膜材料的蒸发源19的开口表面14位于靠近基板21的同时抽空蒸发室16和成膜室17的状态下进行的 而不用电导可变结构34关闭蒸发室16和成膜室17之间的连通。接下来,通过向蒸发室16和成膜室17引入非反应性气体来抑制成膜材料的蒸发, 将每个室中的压力调节至预定压力或更大。 然后,蒸发源19被移动机构35移动,使得开口表面14远离基板21.导电可变结构被激活以切断这些室之间的连通,并且成膜材料被冷却,同时 将非反应性气体连续引入蒸发室16。

    METHOD OF MANUFACTURING THIN FILM
    6.
    发明申请
    METHOD OF MANUFACTURING THIN FILM 有权
    制造薄膜的方法

    公开(公告)号:US20120148746A1

    公开(公告)日:2012-06-14

    申请号:US13392433

    申请日:2011-06-01

    IPC分类号: C23C16/448 C23C16/455

    摘要: The present invention provides a thin film manufacturing method which realizes stable, highly-efficient film formation using a nozzle-type evaporation source while avoiding unnecessary scattering and deposition of a film formation material after the termination of the film formation. Used is a film forming apparatus including: an evaporation chamber 16; a film forming chamber 17 in which a substrate 21 is provided; an evaporation source 19 holding a film formation material 15 and including an opening surface 14; a moving mechanism 35 configured to cause the evaporation source 19 to move; and a conductance variable structure 34. The film formation is performed in a state where the opening surface 14 of the evaporation source 19 holding the heated film formation material is located close to the substrate 21 while evacuating the evaporation chamber 16 and the film forming chamber 17 without shutting off communication between the evaporation chamber 16 and the film forming chamber 17 by the conductance variable structure 34. Next, the evaporation of the film formation material is suppressed by introducing a nonreactive gas to the evaporation chamber 16 and the film forming chamber 17 to adjust pressure in each chamber to predetermined pressure or more. Then, the evaporation source 19 is moved by the moving mechanism 35 such that the opening surface 14 is located away from the substrate 21. The conductance variable structure is activated to shut off the communication between these chambers, and the film formation material is cooled while continuously introducing the nonreactive gas to the evaporation chamber 16.

    摘要翻译: 本发明提供一种薄膜制造方法,其使用喷嘴型蒸发源实现稳定,高效的成膜,同时避免成膜材料终止后不必要的成膜材料的散射和沉积。 使用的成膜装置包括:蒸发室16; 设置有基板21的成膜室17; 保持成膜材料15并包括开口表面14的蒸发源19; 构造成使蒸发源19移动的移动机构35; 和导电可变结构34.成膜是在保持加热成膜材料的蒸发源19的开口表面14位于靠近基板21的同时抽空蒸发室16和成膜室17的状态下进行的 而不用电导可变结构34关闭蒸发室16和成膜室17之间的连通。接下来,通过向蒸发室16和成膜室17引入非反应性气体来抑制成膜材料的蒸发, 将每个室中的压力调节至预定压力或更大。 然后,蒸发源19被移动机构35移动,使得开口表面14远离基板21.导电可变结构被激活以切断这些室之间的连通,并且成膜材料被冷却,同时 将非反应性气体连续引入蒸发室16。

    FILM FORMING METHOD AND FILM FORMING APPARATUS
    9.
    发明申请
    FILM FORMING METHOD AND FILM FORMING APPARATUS 审中-公开
    薄膜成型方法和薄膜成型装置

    公开(公告)号:US20100196623A1

    公开(公告)日:2010-08-05

    申请号:US12680043

    申请日:2008-09-09

    摘要: The present invention provides a film forming method and a film forming apparatus each of which is capable of forming films at low cost. The film forming method of the present invention includes the steps of (i) melting a solid material 51 of a thin film to prepare a melted liquid, solidifying the melted liquid 51a to form a rod-shaped body 51b, and pulling out the rod-shaped body 51b, (ii) melting and supplying a part of the rod-shaped body 51b to a melted liquid (evaporation source) 51d, and (iii) using the melted liquid (evaporation source) 51d to form the thin film. The steps (i), (ii), and (iii) are carried out in vacuum.

    摘要翻译: 本发明提供一种能够以低成本形成膜的成膜方法和成膜装置。 本发明的成膜方法包括以下步骤:(i)熔化薄膜的固体材料51以制备熔融液体,使熔融液体51a固化形成杆状体51b, (ii)将棒状体51b的一部分熔融并供给到熔融液体(蒸发源)51d,(iii)使用熔融液(蒸发源)51d来形成薄膜。 步骤(i),(ii)和(iii)在真空中进行。