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公开(公告)号：US08536017B2
公开(公告)日：2013-09-17
申请号：US13363312
申请日：2012-01-31
IPC分类号： H01L21/76
CPC分类号： H01L21/76229
摘要： A polysilazane film is formed over the main surface of a semiconductor substrate in such a manner that the upper surface level of the polysilazane film buried in a trench of 0.2 μm or less in width becomes higher than that of a pad insulating film and the upper surface level of the polysilazane film buried in a trench of 1.0 μm or more in width becomes lower than that of the pad insulating film. Then, heat treatment is conducted at 300° C. or more to convert the polysilazane film into a first buried film made of silicon oxide (SiO2) and remove a void in the upper portion of the narrower trench.
摘要翻译： 在半导体衬底的主表面上形成聚硅氮烷膜，使得埋在宽度为0.2μm或更小的沟槽中的聚硅氮烷膜的上表面水平高于衬垫绝缘膜的上表面水平， 埋入宽度为1.0μm以上的沟槽中的聚硅氮烷膜的水平比焊垫绝缘膜低。 然后，在300℃以上进行热处理，将聚硅氮烷膜转换为由氧化硅（SiO 2）构成的第一掩埋膜，并且在较窄的沟槽的上部除去空隙。
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公开(公告)号：US20120208346A1
公开(公告)日：2012-08-16
申请号：US13363312
申请日：2012-01-31
IPC分类号： H01L21/762
CPC分类号： H01L21/76229
摘要： A polysilazane film is formed over the main surface of a semiconductor substrate in such a manner that the upper surface level of the polysilazane film buried in a trench of 0.2 μm or less in width becomes higher than that of a pad insulating film and the upper surface level of the polysilazane film buried in a trench of 1.0 μm or more in width becomes lower than that of the pad insulating film. Then, heat treatment is conducted at 300° C. or more to convert the polysilazane film into a first buried film made of silicon oxide (SiO2) and remove a void in the upper portion of the narrower trench.
摘要翻译： 在半导体衬底的主表面上形成聚硅氮烷膜，使得掩埋在宽度为0.2μm以下的沟槽中的聚硅氮烷膜的上表面水平高于衬垫绝缘膜的上表面水平， 埋入宽度为1.0μm以上的沟槽中的聚硅氮烷膜的水平比焊垫绝缘膜低。 然后，在300℃以上进行热处理，将聚硅氮烷膜转换为由氧化硅（SiO 2）构成的第一掩埋膜，并且在较窄的沟槽的上部除去空隙。
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公开(公告)号：US20120045876A1
公开(公告)日：2012-02-23
申请号：US13183996
申请日：2011-07-15
IPC分类号： H01L21/8238
CPC分类号： H01L21/823857 , H01L21/823842
摘要： There is provided a technology capable of preventing the increase in threshold voltages of n channel type MISFETs and p channel type MISFETs in a semiconductor device including CMISFETs having high dielectric constant gate insulation films and metal gate electrodes. When a rare earth element or aluminum is introduced into a Hf-containing insulation film which is a high dielectric constant gate insulation film for the purpose of adjusting the threshold value of the CMISFET, a threshold adjustment layer including a lanthanum film scarcely containing oxygen, and a threshold adjustment layer including an aluminum film scarcely containing oxygen are formed over the Hf-containing insulation film in an nMIS formation region and a pMIS formation region, respectively. This prevents oxygen from being diffused from the threshold adjustment layers into the Hf-containing insulation film and the main surface of a semiconductor substrate.
摘要翻译： 提供了能够防止包括具有高介电常数栅极绝缘膜和金属栅电极的CMISFET的半导体器件中的n沟道型MISFET和p沟道型MISFET的阈值电压增加的技术。 当为了调整CMISFET的阈值而将稀土元素或铝引入到作为高介电常数栅极绝缘膜的Hf的绝缘膜中时，包括几乎不含有氧的镧膜的阈值调整层和 在nMIS形成区域和pMIS形成区域中分别在Hf的绝缘膜上形成包含几乎不含氧的铝膜的阈值调整层。 这防止氧从阈值调节层扩散到含Hf的绝缘膜和半导体衬底的主表面。
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公开(公告)号：US20110284971A1
公开(公告)日：2011-11-24
申请号：US13109736
申请日：2011-05-17
IPC分类号： H01L27/092 , H01L21/28
CPC分类号： H01L21/823857 , H01L21/28088 , H01L27/092 , H01L29/513 , H01L29/518 , H01L29/66492
摘要： There are provided a semiconductor device in which the threshold voltage of a p-channel field effect transistor is reliably controlled to allow a desired characteristic to be obtained, and a manufacturing method thereof. As a heat treatment performed at a temperature of about 700 to 900° C. proceeds, in an element formation region, aluminum (Al) in an aluminum (Al) film is diffused into a hafnium oxynitride (HfON) film, and thereby added as an element to the hafnium oxynitride (HfON) film. In addition, aluminum (Al) and titanium (Ti) in a hard mask formed of a titanium aluminum nitride (TiAlN) film are diffused into the hafnium oxynitride (HfON) film, and thereby added as elements to the hafnium oxynitride (HfON) film.
摘要翻译： 提供一种可以可靠地控制p沟道场效应晶体管的阈值电压以获得期望特性的半导体器件及其制造方法。 当在700〜900℃左右的温度下进行热处理时，在元素形成区域中，将铝（Al）膜中的铝（Al）扩散到氮氧化铪（HfON）膜中， 铪氧氮化铪（HfON）膜的元素。 另外，由氮化钛（TiAlN）膜形成的硬掩模中的铝（Al）和钛（Ti）扩散到氮氧化铪（HfON）膜中，从而作为元素添加到氮氧化铪（HfON）膜 。
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公开(公告)号：US20050093428A1
公开(公告)日：2005-05-05
申请号：US10969015
申请日：2004-10-21
CPC分类号： H01L33/145 , H01L2224/48463 , H01L2924/3025 , H01L2924/00
摘要： A semiconductor light-emitting device includes: a semiconductor substrate; a light-emitting layer formed on the semiconductor substrate; a current-blocking layer formed on a part of the light-emitting layer for restricting light-emission; a current-spreading layer formed on the current-blocking layer and the other part of the light-emitting layer; a front electrode formed on the current-spreading layer; and a rear electrode formed on a rear side of the semiconductor substrate. The current-blocking layer is composed of a central region and an outer region which surrounds the central region via a part of the current-spreading layer, so that a light-emitting region that appears on a front surface of the device has an annular shape. The front electrode and the central region of the current-blocking layer are opposed to each other.
摘要翻译： 半导体发光器件包括：半导体衬底; 形成在所述半导体基板上的发光层; 形成在用于限制发光的发光层的一部分上的电流阻挡层; 形成在电流阻挡层和发光层的另一部分上的电流扩散层; 形成在电流扩展层上的前电极; 以及形成在半导体基板的后侧的后电极。 电流阻挡层由中心区域和外部区域构成，该区域通过电流扩展层的一部分围绕中心区域，使得出现在器件的前表面上的发光区域具有环形形状 。 电流阻挡层的前电极和中心区域彼此相对。
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公开(公告)号：US06812536B2
公开(公告)日：2004-11-02
申请号：US10383753
申请日：2003-03-10
申请人： Shuichi Ueno , Yukio Nishida , Hiroshi Umeda , Kenichi Ohto , Takashi Terauchi , Shigeru Shiratake , Akinori Kinugasa
发明人： Shuichi Ueno , Yukio Nishida , Hiroshi Umeda , Kenichi Ohto , Takashi Terauchi , Shigeru Shiratake , Akinori Kinugasa
IPC分类号： H01L2976
CPC分类号： H01L29/42368 , H01L21/28247
摘要： A smile oxide film, serving as a gate oxide film, is formed under a three-layer poly-metal gate consisting of a doped polysilicon layer, a tungsten layer, and a SiON layer. The smile oxide film has a first region located beneath an edge of the poly-metal gate and a second region located beneath a central portion of the poly-metal gate. A film thickness of the first region is larger than a film thickness of the second region. An anti-oxidizing film, having a small oxygen diffusion rate compared with the polysilicon layer, entirely covers the poly-metal gate without exposing.
摘要翻译： 作为栅极氧化膜的微笑氧化膜形成在由掺杂多晶硅层，钨层和SiON层构成的三层多金属栅极的下方。 微笑氧化膜具有位于多金属栅极的边缘下方的第一区域和位于多金属栅极的中心部分下方的第二区域。 第一区域的膜厚度大于第二区域的膜厚度。 与多晶硅层相比具有小的氧扩散速率的抗氧化膜完全覆盖多金属栅极而不暴露。
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公开(公告)号：US5645502A
公开(公告)日：1997-07-08
申请号：US543441
申请日：1995-10-16
申请人： Shozo Wakabayashi , Yukio Tomimura , Koji Morishige , Hiroshi Umeda , Park Woo Serk , Mark Alan Boshart
发明人： Shozo Wakabayashi , Yukio Tomimura , Koji Morishige , Hiroshi Umeda , Park Woo Serk , Mark Alan Boshart
摘要： The power transmission chain of the present invention is formed of two parallel chains that are phased or offset by approximately one-half pitch. The chains are connected by struts that extend across the entire width of both chains. The power transmission chain belt of this invention provides for a restricting device in the interchain gap of the load block. Offset occurring during the speed change of a continuously variable transmission can be absorbed by the above mentioned gap. In one embodiment, the restricting device is in the form of a stop ring provided near the middle of the gap between the two side-by-side chains.
摘要翻译： 本发明的动力传递链由两个平行的链构成，这些平行链被相位或偏移大约一半的间距。 这些链通过跨越两条链的整个宽度的支柱连接。 本发明的传动链带提供了负载块的链间间隙中的限制装置。 在无级变速器的变速期间发生的偏移可以被上述间隙吸收。 在一个实施例中，限制装置是设置在两个并排链之间的间隙中间附近的止动环的形式。
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公开(公告)号：US5036936A
公开(公告)日：1991-08-06
申请号：US405540
申请日：1989-09-11
申请人： Atsuhiro Kawano , Yoshiaki Sano , Hiroshi Umeda , Takeshi Nishimura , Yasunobu Miyata , Keiji Inagaki
发明人： Atsuhiro Kawano , Yoshiaki Sano , Hiroshi Umeda , Takeshi Nishimura , Yasunobu Miyata , Keiji Inagaki
CPC分类号： B60K31/047 , B60W2050/0057 , B60W2710/0605 , F16H2061/0081 , Y10S706/90 , Y10T477/676
摘要： A cruise control device is provided with a vehicle speed sensor for detecting the actual vehicle speed, and an electronic controller for controlling the opening of the throttle valve based on the detected vehicle speed, to bring the vehicle speed close to a target vehicle speed. The electronic controller serves to obtain a vehicle speed deviation between the target vehicle speed set by a set switch and the actual vehicle speed, select one of a P control mode, a P/D control mode and a fuzzy control mode corresponding to the magnitude of the vehicle speed deviation, and control the opening of the throttle valve. In addition to these functions, the electronic controller may additionally have the function of estimating a change in the vehicle speed provided that the current opening of the throttle valve is maintained, to obtain a correction value for the vehicle speed so that a corrected vehicle speed corrected by the correction value is used to control the opening of the throttle valve. Further, in the case of a vehicle provided with an automatic transmission, a shift diagram applied to a cruise control mode may be prepared in addition to the shift diagram for the automatic transmission itself, so that the electronic controller may have the function of effecting a shifting of the gear ratios of the automatic transmission.
摘要翻译： 巡航控制装置设置有用于检测实际车速的车速传感器和用于基于检测到的车速来控制节气门的打开的电子控制器，以使车速接近目标车速。 电子控制器用于获得由设定开关设定的目标车速与实际车速之间的车速偏差，选择P控制模式，P / D控制模式和对应于模拟控制模式的模糊控制模式 车速偏差，并控制节流阀的开度。 除了这些功能之外，如果维持节流阀的当前开度，电子控制器还可以具有估计车速的变化的功能，以获得车速的校正值，从而校正车辆速度 通过校正值来控制节流阀的开度。 此外，在设置有自动变速器的车辆的情况下，除了自动变速器本身的变速图之外，还可以准备应用于巡航控制模式的换档图，使得电子控制器可以具有实现 换档自动变速箱的齿轮比。
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公开(公告)号：US06675866B2
公开(公告)日：2004-01-13
申请号：US10009642
申请日：2001-12-12
IPC分类号： B22D1732
摘要： To provide a monitoring system for remotely monitoring the operation of a molding apparatus or an air-flow and press molding apparatus. The monitoring systems for monitoring a molding apparatus and an air-flow and press molding apparatus include sensors, a local unit, and a remote unit. The local unit transmits the signals associated with the required attributes, which are measured by the sensors, of the molding apparatus to the remote unit via the communication network. The remote unit is designed so that it receives the signals transmitted from the local unit; thereby the user can monitor the molding apparatus or the air-flow and press molding apparatus remotely at the production and operation by them.
摘要翻译： 提供用于远程监视模制设备或气流和压制成型设备的操作的监控系统。 用于监测成型设备和空气流动和压制成型设备的监控系统包括传感器，本地单元和远程单元。 本地单元经由通信网络将与成型设备所测量的所需属性相关联的信号传送到远程单元。 遥控单元被设计成接收从本地单元发送的信号; 从而用户可以在生产和操作时远程监控成型设备或气流和压模设备。
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公开(公告)号：US06521509B2
公开(公告)日：2003-02-18
申请号：US09887322
申请日：2001-06-25
申请人： Akinobu Teramoto , Kousuke Yagi , Hiroshi Umeda
发明人： Akinobu Teramoto , Kousuke Yagi , Hiroshi Umeda
IPC分类号： H01L2176
CPC分类号： H01L21/76224
摘要： A highly reliable semiconductor device is provided. A silicon nitride film having an opening is formed on a main surface of a silicon substrate. The opening is formed with a side surface. The silicon substrate is etched using the silicon nitride film as a mask to form a trench. The side surface of the silicon nitride film is altered in quality to form a silicon oxide film. A silicon oxide film filling the trench is formed in contact with the silicon oxide film. The silicon nitride film is removed with the silicon oxide film in contact with the silicon oxide film remaining.
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