Semiconductor device manufacturing method
    1.
    发明授权
    Semiconductor device manufacturing method 有权
    半导体器件制造方法

    公开(公告)号:US07888239B2

    公开(公告)日:2011-02-15

    申请号:US12496406

    申请日:2009-07-01

    IPC分类号: H01L21/78 H01L21/46

    摘要: In a semiconductor device manufacturing method in which a wafer formed with devices in a plurality of areas sectioned by a plurality of streets formed in a lattice-like pattern on the front surface is divided into the individual devices along the streets, when the wafer is divided into the individual devices by exposing cut grooves formed along the streets by a dicing before grinding process, a rigid plate is applied to the front surface of the wafer and an adhesive film is attached to the rear surface of the wafer. Thereafter, a separation groove forming step is performed in which a laser beam is directed to the adhesive film along the cut grooves from the dicing tape side applied with the wafer attached with the adhesive film to form separation grooves in the adhesive film along the cut grooves.

    摘要翻译: 在半导体器件制造方法中,将形成有在前表面上以格子状形成的多个街道的多个区域中的元件形成的晶片沿着街道划分为各个器件,当晶片被分割时 通过在研磨处理之前通过切割将沿着街道形成的切割槽暴露在单个装置中,将刚性板施加到晶片的前表面,并且将粘合剂膜附着到晶片的后表面。 此后,进行分离槽形成步骤,其中激光束沿着切割带从切割带一侧引导到粘合剂膜,所述切割带侧涂覆有安装有粘合剂膜的晶片,以沿着切割槽在粘合膜中形成分离槽 。

    SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    2.
    发明申请
    SEMICONDUCTOR DEVICE MANUFACTURING METHOD 有权
    半导体器件制造方法

    公开(公告)号:US20100015784A1

    公开(公告)日:2010-01-21

    申请号:US12496406

    申请日:2009-07-01

    IPC分类号: H01L21/78

    摘要: In a semiconductor device manufacturing method in which a wafer formed with devices in a plurality of areas sectioned by a plurality of streets formed in a lattice-like pattern on the front surface is divided into the individual devices along the streets, when the wafer is divided into the individual devices by exposing cut grooves formed along the streets by a dicing before grinding process, a rigid plate is applied to the front surface of the wafer and an adhesive film is attached to the rear surface of the wafer. Thereafter, a separation groove forming step is performed in which a laser beam is directed to the adhesive film along the cut grooves form the dicing tape side applied with the wafer attached with the adhesive film to form separation grooves in the adhesive film along the cut grooves.

    摘要翻译: 在半导体器件制造方法中,将形成有在前表面上以格子状形成的多个街道的多个区域中的元件形成的晶片沿着街道划分为各个器件,当晶片被分割时 通过在研磨处理之前通过切割将沿着街道形成的切割槽暴露在单个装置中,将刚性板施加到晶片的前表面,并且将粘合剂膜附着到晶片的后表面。 此后,进行分离槽形成步骤,其中激光束沿着切割槽被引导到粘合膜,形成施加有粘合剂膜的晶片的切割带侧,以沿着切割槽在粘合膜中形成分离槽 。

    Working machine engine and working machine using the same
    6.
    发明授权
    Working machine engine and working machine using the same 有权
    工作机发动机和工作机使用相同

    公开(公告)号:US08915219B2

    公开(公告)日:2014-12-23

    申请号:US13150732

    申请日:2011-06-01

    摘要: A working machine engine is provided. The air flowing through the front side cooling air flow passage and the upper side cooling air flow passage which are provided in the front side and the upper side of the casing, respectively, and the air flowing through the auxiliary air flow passage provided in the back side of the casing join together near the opening. By this means, the air flowing through the auxiliary air flow passage can change the direction of the air flowing lengthwise through the front side cooling air flow passage and the upper side cooling air flow passage.

    摘要翻译: 提供工作机器引擎。 分别设置在壳体的前侧和上侧的流过前侧冷却风流路和上侧冷却风流路的空气以及设置在后侧的辅助空气流路中流动的空气 外壳的一侧在开口附近连接在一起。 通过这种方式,流过辅助空气流动通道的空气可以改变通过前侧冷却空气流动通道和上侧冷却空气流动通道纵向流动的空气的方向。

    Semiconductor device
    8.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US08860146B2

    公开(公告)日:2014-10-14

    申请号:US13052014

    申请日:2011-03-18

    IPC分类号: H01L27/04 H01L27/06

    CPC分类号: H01L27/0629

    摘要: According to one embodiment, a semiconductor device including a field-effect transistor, and a resistance element connected between a gate electrode of the field effect transistor and a connection point connected between a back gate electrode of the field effect transistor and one of source-drain regions of the field effect transistor, a voltage being applied between the other of the source-drain regions and the gate electrode.

    摘要翻译: 根据一个实施例,包括场效应晶体管的半导体器件和连接在场效应晶体管的栅极之间的电阻元件和连接在场效应晶体管的背栅极之间的连接点和源极 - 漏极 场效应晶体管的区域,电压施加在源极 - 漏极区域中的另一个和栅电极之间。

    Focal plane shutter for cameras and digital camera provided with the same
    9.
    发明授权
    Focal plane shutter for cameras and digital camera provided with the same 有权
    用于相机和数码相机的焦平面快门提供相同的

    公开(公告)号:US08454249B2

    公开(公告)日:2013-06-04

    申请号:US13404357

    申请日:2012-02-24

    IPC分类号: G03B9/08

    CPC分类号: G03B9/36 G03B9/20

    摘要: A second blade-driving mechanism includes second blade-driving first member and second blade-driving second member, only the second blade-driving second member is rotated against elastic force of a blade-driving spring while the second blade-driving first member engages and is locked by a locking member at start of cocking operation of the cocking member to keep a second blade covering an exposure aperture, and the second blade-driving first member is disengaged from locking member at final stage of cocking operation, so the second blade-driving first member can be rotated by elastic force of a second blade-cocking spring and the second blade is made to open the exposure aperture. Staring cocking operation of a focal plane shutter is possible irrespective of the length of time during which imaging information can be transferred from an image sensor to storage via an information-processing circuit.

    摘要翻译: 第二叶片驱动机构包括第二叶片驱动第一构件和第二叶片驱动第二构件,只有第二叶片驱动第二构件抵抗叶片驱动弹簧的弹力而旋转,同时第二叶片驱动第一构件接合, 在起动构件的起动操作开始时被锁定构件锁定以保持第二刀片覆盖曝光孔,并且第二刀片驱动第一构件在起动操作的最后阶段与锁定构件脱离接合, 驱动第一构件可以通过第二叶片弹簧的弹力旋转,并且使第二叶片打开曝光孔。 与成像信息可以经由信息处理电路从图像传感器传送到存储的时间长度无关,可以进行焦平面快门的起弧操作。

    Optical recording medium
    10.
    发明授权
    Optical recording medium 失效
    光记录介质

    公开(公告)号:US08067080B2

    公开(公告)日:2011-11-29

    申请号:US12282821

    申请日:2007-03-14

    IPC分类号: G11B7/24

    摘要: Provided is an optical recording medium including, in sequence: a first substrate; a first information recording layer; an intermediate layer; a second information recording layer; and a second substrate having wobble convex portions on its surface, wherein information is recorded on or reproduced from the first information recording layer and second information recording layer by irradiation with a laser beam from a first information recording layer side, wherein the second information recording layer includes, over the second substrate, a light reflective layer, a dye recording layer, and an inorganic protective layer, wherein the inorganic protective layer has a thickness of 3 nm to 40 nm, and wherein the dye recording layer includes a cyanine compound expressed by General Formula (I) and a squarylium compound expressed by General Formula (II):

    摘要翻译: 提供了一种光学记录介质,其依次包括:第一基板; 第一信息记录层; 中间层 第二信息记录层; 以及在其表面上具有摆动凸部的第二基板,其中通过用来自第一信息记录层侧的激光束的照射将信息记录在第一信息记录层和第二信息记录层上或从第一信息记录层再现,其中第二信息记录层 在第二基板上包括光反射层,染料记录层和无机保护层,其中无机保护层的厚度为3nm至40nm,并且其中染料记录层包括由 通式(I)和通式(II)表示的方酸化合物: