公开(公告)号：US20090086458A1

公开(公告)日：2009-04-02

申请号：US12233722

申请日：2008-09-19

申请人： Masashi Terauchi ,  Yoshiaki Kurosu ,  Masakazu Ueno ,  Norio Okazaki ,  Kazumasa Arai

发明人： Masashi Terauchi ,  Yoshiaki Kurosu ,  Masakazu Ueno ,  Norio Okazaki ,  Kazumasa Arai

IPC分类号： H05K7/06

CPC分类号： G09G3/296 ,  H01L24/45 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/451 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0295 ,  H05K1/053 ,  H05K1/111 ,  H05K2201/09954 ,  H05K2201/10166 ,  H01L2924/00 ,  H01L2224/05599

摘要： In plasma displays in different inch sizes, there is a disadvantage in that because each of the plasma displays in different inch sizes has an output semiconductor device with a different outer shape, a pitch of the external lead and the number of the output semiconductor devices vary, so that printed circuit boards need be designed differently for the different inch sizes. A hybrid integrated circuit includes mounting portions which are composed of a conductive path on an insulated metal substrate, and into which at least an output semiconductor device of a discharge maintaining circuit is incorporated, and includes external terminals arranged at a constant pitch. When the inch size of the plasma display is changed, the mounting portions are designed to have a size enough to accommodate the output semiconductor device for the greatest inch size. Thus, the same hybrid integrated circuit is commonly used.

摘要翻译： 在不同英寸尺寸的等离子体显示器中，存在的缺点在于，因为不同英寸尺寸的等离子体显示器具有不同外形的输出半导体器件，外部引线的间距和输出半导体器件的数量变化 ，因此不同英寸尺寸的印刷电路板需要不同的设计。 混合集成电路包括由绝缘金属基板上的导电路径构成的安装部，并且至少包括放电维持电路的输出半导体装置，并且包括以恒定间距排列的外部端子。 当等离子体显示器的英制尺寸改变时，安装部分被设计成具有足以容纳最大英寸尺寸的输出半导体器件的尺寸。 因此，通常使用相同的混合集成电路。

公开(公告)号：US08064212B2

公开(公告)日：2011-11-22

申请号：US12233682

申请日：2008-09-19

申请人： Masami Motegi ,  Masashi Terauchi ,  Takashi Higo

发明人： Masami Motegi ,  Masashi Terauchi ,  Takashi Higo

IPC分类号： H05K7/00

CPC分类号： H05K3/284 ,  G09G3/296 ,  H05K1/0231 ,  H05K1/053 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/1322 ,  Y02P70/611

摘要： In a hybrid integrated circuit device that uses a metal substrate, a sound noise is prevented, which would otherwise be generated due to transmission, to the metal substrate, of vibration caused when a ceramic capacitor expands and contracts by switching ON and OFF a transistor. For improving a heat dissipation effect, a switching transistor driven by a driving pulse and a ceramic capacitor connected to the switching transistor are incorporated on a conductive path on an insulated metal substrate. Both ends of the ceramic capacitor are fixed to the conductive path by solders which are covered with a hard resin to be protected from a solder crack by thermal expansion of the metal substrate. The ceramic capacitor and the hard resin are wholly covered with a soft resin which absorbs noise due to expansion caused when the ceramic capacitor is switched, so that the metal substrate is prevented from resonating.

摘要翻译： 在使用金属基板的混合集成电路装置中，当陶瓷电容器通过接通和断开晶体管而膨胀和收缩时，防止由于传输而向金属基板产生振动的声音噪声。 为了提高散热效果，由驱动脉冲驱动的开关晶体管和连接到开关晶体管的陶瓷电容器并入绝缘金属基板上的导电路径上。 陶瓷电容器的两端通过被硬质树脂覆盖的焊料固定到导电路径上，以通过金属基板的热膨胀来防止焊料裂纹。 陶瓷电容器和硬树脂完全被柔性树脂覆盖，该软树脂在陶瓷电容器被切换时由于膨胀而吸收噪声，从而防止金属基板发生谐振。

公开(公告)号：US20090086457A1

公开(公告)日：2009-04-02

申请号：US12233682

申请日：2008-09-19

申请人： Masami Motegi ,  Masashi Terauchi ,  Takashi Higo

发明人： Masami Motegi ,  Masashi Terauchi ,  Takashi Higo

IPC分类号： H05K7/02

CPC分类号： H05K3/284 ,  G09G3/296 ,  H05K1/0231 ,  H05K1/053 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/1322 ,  Y02P70/611

摘要： In a hybrid integrated circuit device that uses a metal substrate, a sound noise is prevented, which would otherwise be generated due to transmission, to the metal substrate, of vibration caused when a ceramic capacitor expands and contracts by switching ON and OFF a transistor. For improving a heat dissipation effect, a switching transistor driven by a driving pulse and a ceramic capacitor connected to the switching transistor are incorporated on a conductive path on an insulated metal substrate. Both ends of the ceramic capacitor are fixed to the conductive path by solders which are covered with a hard resin to be protected from a solder crack by thermal expansion of the metal substrate. The ceramic capacitor and the hard resin are wholly covered with a soft resin which absorbs noise due to expansion caused when the ceramic capacitor is switched, so that the metal substrate is prevented from resonating.

摘要翻译： 在使用金属基板的混合集成电路装置中，当陶瓷电容器通过接通和断开晶体管而膨胀和收缩时，防止由于传输而向金属基板产生振动的声音噪声。 为了提高散热效果，由驱动脉冲驱动的开关晶体管和连接到开关晶体管的陶瓷电容器并入绝缘金属基板上的导电路径上。 陶瓷电容器的两端通过被硬质树脂覆盖的焊料固定到导电路径上，以通过金属基板的热膨胀来防止焊料裂纹。 陶瓷电容器和硬树脂完全被柔性树脂覆盖，该软树脂在陶瓷电容器被切换时由于膨胀而吸收噪声，从而防止金属基板发生谐振。