公开(公告)号：US20090086457A1

公开(公告)日：2009-04-02

申请号：US12233682

申请日：2008-09-19

申请人： Masami Motegi ,  Masashi Terauchi ,  Takashi Higo

发明人： Masami Motegi ,  Masashi Terauchi ,  Takashi Higo

IPC分类号： H05K7/02

CPC分类号： H05K3/284 ,  G09G3/296 ,  H05K1/0231 ,  H05K1/053 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/1322 ,  Y02P70/611

摘要： In a hybrid integrated circuit device that uses a metal substrate, a sound noise is prevented, which would otherwise be generated due to transmission, to the metal substrate, of vibration caused when a ceramic capacitor expands and contracts by switching ON and OFF a transistor. For improving a heat dissipation effect, a switching transistor driven by a driving pulse and a ceramic capacitor connected to the switching transistor are incorporated on a conductive path on an insulated metal substrate. Both ends of the ceramic capacitor are fixed to the conductive path by solders which are covered with a hard resin to be protected from a solder crack by thermal expansion of the metal substrate. The ceramic capacitor and the hard resin are wholly covered with a soft resin which absorbs noise due to expansion caused when the ceramic capacitor is switched, so that the metal substrate is prevented from resonating.

摘要翻译： 在使用金属基板的混合集成电路装置中，当陶瓷电容器通过接通和断开晶体管而膨胀和收缩时，防止由于传输而向金属基板产生振动的声音噪声。 为了提高散热效果，由驱动脉冲驱动的开关晶体管和连接到开关晶体管的陶瓷电容器并入绝缘金属基板上的导电路径上。 陶瓷电容器的两端通过被硬质树脂覆盖的焊料固定到导电路径上，以通过金属基板的热膨胀来防止焊料裂纹。 陶瓷电容器和硬树脂完全被柔性树脂覆盖，该软树脂在陶瓷电容器被切换时由于膨胀而吸收噪声，从而防止金属基板发生谐振。

公开(公告)号：US08064212B2

公开(公告)日：2011-11-22

申请号：US12233682

申请日：2008-09-19

申请人： Masami Motegi ,  Masashi Terauchi ,  Takashi Higo

发明人： Masami Motegi ,  Masashi Terauchi ,  Takashi Higo

IPC分类号： H05K7/00

CPC分类号： H05K3/284 ,  G09G3/296 ,  H05K1/0231 ,  H05K1/053 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/1322 ,  Y02P70/611

摘要： In a hybrid integrated circuit device that uses a metal substrate, a sound noise is prevented, which would otherwise be generated due to transmission, to the metal substrate, of vibration caused when a ceramic capacitor expands and contracts by switching ON and OFF a transistor. For improving a heat dissipation effect, a switching transistor driven by a driving pulse and a ceramic capacitor connected to the switching transistor are incorporated on a conductive path on an insulated metal substrate. Both ends of the ceramic capacitor are fixed to the conductive path by solders which are covered with a hard resin to be protected from a solder crack by thermal expansion of the metal substrate. The ceramic capacitor and the hard resin are wholly covered with a soft resin which absorbs noise due to expansion caused when the ceramic capacitor is switched, so that the metal substrate is prevented from resonating.

摘要翻译： 在使用金属基板的混合集成电路装置中，当陶瓷电容器通过接通和断开晶体管而膨胀和收缩时，防止由于传输而向金属基板产生振动的声音噪声。 为了提高散热效果，由驱动脉冲驱动的开关晶体管和连接到开关晶体管的陶瓷电容器并入绝缘金属基板上的导电路径上。 陶瓷电容器的两端通过被硬质树脂覆盖的焊料固定到导电路径上，以通过金属基板的热膨胀来防止焊料裂纹。 陶瓷电容器和硬树脂完全被柔性树脂覆盖，该软树脂在陶瓷电容器被切换时由于膨胀而吸收噪声，从而防止金属基板发生谐振。

公开(公告)号：US08084301B2

公开(公告)日：2011-12-27

申请号：US12557882

申请日：2009-09-11

申请人： Katsuyoshi Mino ,  Masaru Kanakubo ,  Masami Motegi

发明人： Katsuyoshi Mino ,  Masaru Kanakubo ,  Masami Motegi

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/49531 ,  H01L21/565 ,  H01L23/49551 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/0166 ,  H05K2203/1316 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Provided is a circuit device manufacturing method for coating a bottom surface of a circuit board with a thin coating of sealing resin. In the present invention, a circuit board having a circuit element such as a semiconductor element embedded therein is placed in a molding die, and a resin sheet containing a thermosetting resin is interposed between the circuit board and a bottom surface of an inner wall of the molding die. Under this condition, the molding die is heated to about 180° C., and a sealing resin in liquid form is injected through a gate. Thereby, the bottom surface of the circuit board can be coated with a thin coating of the sealing resin made of the molten resin sheet.

摘要翻译： 提供了一种用薄型密封树脂涂覆电路板底面的电路器件制造方法。 在本发明中，将具有嵌入其中的半导体元件等电路元件的电路基板放置在成型模具中，将含有热固化性树脂的树脂片插入在电路基板与内部的内壁的底面之间 成型模具。 在这种条件下，将模具加热至约180℃，并通过浇口注入液体形式的密封树脂。 由此，电路板的底面可以涂覆有由熔融树脂片制成的密封树脂的薄涂层。

公开(公告)号：US09572294B2

公开(公告)日：2017-02-14

申请号：US13882952

申请日：2011-10-12

申请人： Nobuhisa Onai ,  Masami Motegi

发明人： Nobuhisa Onai ,  Masami Motegi

IPC分类号： H05K13/04 ,  H05K1/02 ,  H01L21/56 ,  H01L23/14 ,  H01L23/31 ,  H01L23/36 ,  H01L23/433 ,  H01L23/00 ,  H01L25/00 ,  H05K3/34 ,  H01L25/18

CPC分类号： H05K13/0465 ,  H01L21/563 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0298 ,  H05K3/341 ,  H05K3/3484 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10969 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/1476 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/2076

摘要： Provided are: a circuit device which has improved connection reliability in a solder joint portion by suppressing the occurrence of sink of solder; and a method for manufacturing the circuit device. In a method for manufacturing a circuit device of the present invention, a plurality of solders (19), which are apart from each other, are firstly formed on the upper surface of a pad (18A), and a chip component (14B) and a transistor (14C) are affixed at the same time. After that, a solder paste (31) is supplied to the upper surface of the pad (18A) using a syringe (30), a heatsink (14D) is mounted on top of the solder paste (31), and melting is caused by a reflow process. There is little risk of sinking of the solders (19) in the present invention since the solders (19) are discretely arranged on the upper surface of the pad (18A).

摘要翻译： 提供：通过抑制焊料凹陷的发生，提高焊接部的连接可靠性的电路装置; 以及电路装置的制造方法。 在本发明的电路装置的制造方法中，首先在焊盘（18A）的上表面上形成有彼此分离的多个焊料（19），芯片部件（14B）和 同时固定晶体管（14C）。 之后，使用注射器（30）将焊膏（31）供给到焊盘（18A）的上表面，将散热器（14D）安装在焊膏（31）的顶部，并且由 回流过程。 由于焊料（19）离散地布置在焊盘（18A）的上表面上，所以本发明中焊料（19）的沉没风险很小。

公开(公告)号：US08624408B2

公开(公告)日：2014-01-07

申请号：US13189121

申请日：2011-07-22

申请人： Katsuyoshi Mino ,  Masaru Kanakubo ,  Akira Iwabuchi ,  Masami Motegi

发明人： Katsuyoshi Mino ,  Masaru Kanakubo ,  Akira Iwabuchi ,  Masami Motegi

IPC分类号： H01L23/29

CPC分类号： H01L23/295 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3675 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/0209 ,  H05K2201/1034 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： In a circuit device of the present invention, the lower surface side of a circuit board and part of side surfaces thereof are covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

摘要翻译： 在本发明的电路装置中，电路基板的下表面侧及其侧面的一部分被第二树脂密封剂覆盖，电路基板的上表面侧等被第一树脂密封剂 。 由于主要通过第二树脂密封剂实现对电路器件外部的散热，所以第二树脂密封剂中包含的填料的粒径大于第一树脂密封剂中所含的填料的粒径。 对电路设备外部的散热大大提高。

公开(公告)号：US20130286594A1

公开(公告)日：2013-10-31

申请号：US13882952

申请日：2011-10-12

申请人： Nobuhisa Onai ,  Masami Motegi

发明人： Nobuhisa Onai ,  Masami Motegi

IPC分类号： H05K13/04 ,  H05K1/02

CPC分类号： H05K13/0465 ,  H01L21/563 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0298 ,  H05K3/341 ,  H05K3/3484 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10969 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/1476 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/2076

摘要： Provided are: a circuit device which has improved connection reliability in a solder joint portion by suppressing the occurrence of sink of solder; and a method for manufacturing the circuit device. In a method for manufacturing a circuit device of the present invention, a plurality of solders (19), which are apart from each other, are firstly formed on the upper surface of a pad (18A), and a chip component (14B) and a transistor (14C) are affixed at the same time. After that, a solder paste (31) is supplied to the upper surface of the pad (18A) using a syringe (30), a heatsink (14D) is mounted on top of the solder paste (31), and melting is caused by a reflow process. There is little risk of sinking of the solders (19) in the present invention since the solders (19) are discretely arranged on the upper surface of the pad (18A).

摘要翻译： 提供：通过抑制焊料凹陷的发生，提高焊接部的连接可靠性的电路装置; 以及电路装置的制造方法。 在本发明的电路装置的制造方法中，首先在焊盘（18A）的上表面上形成有彼此分离的多个焊料（19），芯片部件（14B）和 同时固定晶体管（14C）。 之后，使用注射器（30）将焊膏（31）供给到焊盘（18A）的上表面，将散热器（14D）安装在焊膏（31）的顶部，并且由 回流过程。 由于焊料（19）离散地布置在焊盘（18A）的上表面上，所以在本发明中几乎没有焊接（19）的风险。

公开(公告)号：US20100065960A1

公开(公告)日：2010-03-18

申请号：US12557882

申请日：2009-09-11

申请人： Katsuyoshi MINO ,  Masaru Kanakubo ,  Masami Motegi

发明人： Katsuyoshi MINO ,  Masaru Kanakubo ,  Masami Motegi

IPC分类号： H01L23/48 ,  H01L21/78 ,  H01L21/56 ,  H01L21/50

CPC分类号： H01L23/49531 ,  H01L21/565 ,  H01L23/49551 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/0166 ,  H05K2203/1316 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Provided is a circuit device manufacturing method for coating a bottom surface of a circuit board with a thin coating of sealing resin. In the present invention, a circuit board having a circuit element such as a semiconductor element embedded therein is placed in a molding die, and a resin sheet containing a thermosetting resin is interposed between the circuit board and a bottom surface of an inner wall of the molding die. Under this condition, the molding die is heated to about 180° C., and a sealing resin in liquid form is injected through a gate. Thereby, the bottom surface of the circuit board can be coated with a thin coating of the sealing resin made of the molten resin sheet.

摘要翻译： 提供了一种用薄型密封树脂涂覆电路板底面的电路器件制造方法。 在本发明中，将具有嵌入其中的半导体元件等电路元件的电路基板放置在成型模具中，将含有热固化性树脂的树脂片插入在电路基板与内部的内壁的底面之间 成型模具。 在这种条件下，将模具加热至约180℃，并通过浇口注入液体形式的密封树脂。 由此，电路板的底面可以涂覆有由熔融树脂片制成的密封树脂的薄涂层。

公开(公告)号：US20060065421A1

公开(公告)日：2006-03-30

申请号：US11237856

申请日：2005-09-29

申请人： Kazumasa Arai ,  Yutaka Kubota ,  Yusuke Igarashi ,  Hidefumi Saito ,  Masami Motegi ,  Noriaki Sakamoto

发明人： Kazumasa Arai ,  Yutaka Kubota ,  Yusuke Igarashi ,  Hidefumi Saito ,  Masami Motegi ,  Noriaki Sakamoto

IPC分类号： H05K5/06

CPC分类号： H01L21/565 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/0315 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Warping of a hybrid integrated circuit device 10 due to shrinkage on curing of a sealing resin 14 is suppressed. The hybrid integrated circuit device 10 includes: a conductive pattern 13 provided on a surface of a circuit board 11; circuit elements 15 fixed to the conductive pattern 13; thin metal wires 17 electrically connecting the circuit elements 15 to the conductive pattern; leads 16 which are connected to the conductive pattern 13 to become output or input and extended to the outside; and a sealing resin 14 which is made of a thermosetting resin and covers the circuit board 11 by transfer molding while at least a rear surface of the circuit board is exposed. Here, a thermal expansion coefficient of the sealing resin 14 is set to be smaller than a thermal expansion coefficient of the circuit board 11. Thus, warping of the circuit board 11 in an after cure step can be prevented.

摘要翻译： 由于密封树脂14的固化收缩而导致混合集成电路装置10的翘曲被抑制。 混合集成电路装置10包括：设置在电路板11的表面上的导电图案13; 固定到导电图案13的电路元件15; 将电路元件15电连接到导电图案的细金属线17; 引线16，其连接到导电图案13以输出或输入并延伸到外部; 以及密封树脂14，其由热固性树脂制成，并且在电路板的至少后表面露出时通过传递模塑覆盖电路板11。 这里，将密封树脂14的热膨胀系数设定为小于电路基板11的热膨胀系数。 因此，可以防止在后固化步骤中的电路板11的翘曲。

公开(公告)号：US08614397B2

公开(公告)日：2013-12-24

申请号：US13188707

申请日：2011-07-22

申请人： Katsuyoshi Mino ,  Akira Iwabuchi ,  Ko Nishimura ,  Masami Motegi

发明人： Katsuyoshi Mino ,  Akira Iwabuchi ,  Ko Nishimura ,  Masami Motegi

IPC分类号： H05K1/16

CPC分类号： H01L21/565 ,  H01L21/481 ,  H01L23/142 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/3737 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00

摘要： In a circuit device of the present invention, the lower surface side of a circuit board is covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

摘要翻译： 在本发明的电路装置中，电路板的下表面侧被第二树脂密封剂覆盖，电路板的上表面等被第一树脂密封剂覆盖。 由于主要通过第二树脂密封剂实现对电路器件外部的散热，所以第二树脂密封剂中包含的填料的粒径大于第一树脂密封剂中所含的填料的粒径。 对电路设备外部的散热大大提高。

公开(公告)号：US20120018906A1

公开(公告)日：2012-01-26

申请号：US13189121

申请日：2011-07-22

申请人： Katsuyoshi MINO ,  Masaru Kanakubo ,  Akira Iwabuchi ,  Masami Motegi

发明人： Katsuyoshi MINO ,  Masaru Kanakubo ,  Akira Iwabuchi ,  Masami Motegi

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/295 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3675 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/0209 ,  H05K2201/1034 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： In a circuit device of the present invention, the lower surface side of a circuit board and part of side surfaces thereof are covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

摘要翻译： 在本发明的电路装置中，电路基板的下表面侧及其侧面的一部分被第二树脂密封剂覆盖，电路基板的上表面侧等被第一树脂密封剂 。 由于主要通过第二树脂密封剂实现对电路器件外部的散热，所以第二树脂密封剂中包含的填料的粒径大于第一树脂密封剂中所含的填料的粒径。 对电路设备外部的散热大大提高。