CORE SHEET FOR CARD
    3.
    发明申请
    CORE SHEET FOR CARD 审中-公开
    卡芯片

    公开(公告)号:US20100021740A1

    公开(公告)日:2010-01-28

    申请号:US12593916

    申请日:2008-03-26

    IPC分类号: B32B27/08 B32B27/36

    摘要: In relation to a core sheet for card for forming an environment-reactive layered card having a plant raw material plastic as a main raw material, a core sheet for card for forming a novel layered card having excellent heat resistance, impact resistance, as well as adhesiveness between each layer (heat fuse-bonding ability), is provided. A core sheet for card is proposed, which is a core sheet for card (A) to be used together with an over-sheet (B) provided with a structure in which at least one layer is a layer having as a main component resin an aromatic polyester series resin or a polycarbonate series resin or a mixed resin of these both for the purpose of forming a layered card, including one layer or two or more layers that are layered, among which at least one layer is a lactic acid series resin layer having a lactic acid series polymer as a main component resin.

    摘要翻译: 关于用于形成具有植物原料塑料作为主要原料的环境反应性分层卡的卡芯片,用于形成具有优异的耐热性,耐冲击性的新型分层卡的卡片芯片,以及 提供各层之间的粘合性(热熔合能力)。 提出了一种用于卡片的芯片,其是与用于与至少一层作为主要成分树脂的层的结构的片材(B)一起使用的卡片(A)的芯片, 芳族聚酯系树脂或聚碳酸酯系树脂或这些的两者的混合树脂,用于形成层叠卡,包括一层或两层以上的层,其中至少一层是乳酸类树脂层 具有乳酸类聚合物作为主要成分树脂。