公开(公告)号：US20070052342A1

公开(公告)日：2007-03-08

申请号：US11515512

申请日：2006-08-31

申请人： Masatsugu Masuda ,  Masaaki Katoh ,  Kazuhiko Inoguchi ,  Hiroshi Umeda ,  Yuhichi Memida ,  Takashi Oouchida ,  Yuhsuke Fujita ,  Masatoshi Omoto

发明人： Masatsugu Masuda ,  Masaaki Katoh ,  Kazuhiko Inoguchi ,  Hiroshi Umeda ,  Yuhichi Memida ,  Takashi Oouchida ,  Yuhsuke Fujita ,  Masatoshi Omoto

IPC分类号： H01J1/62

CPC分类号： C09K11/7774 ,  C09K11/0883 ,  C09K11/7734 ,  H05B33/14 ,  Y02B20/181

摘要： A light-emitting device includes a light-emitting element emitting primary light and a wavelength conversion portion absorbing a part of the primary light and emitting secondary light having a wavelength equal to or longer than the wavelength of the primary light. The wavelength conversion portion includes a plurality of green or yellow light-emitting phosphors and a plurality of red light-emitting phosphors. The green or yellow light-emitting phosphor is implemented by at least one selected from a specific europium (II)-activated silicate phosphor (A-1) and a specific cerium (III)-activated silicate phosphor (A-2). The red light-emitting phosphor is implemented by a specific europium (II)-activated nitride phosphor (B). The light-emitting device emitting white light at efficiency and color rendering property higher than in a conventional example can thus be provided.

摘要翻译： 发光装置包括发射原色光的发光元件和吸收一次光的一部分的波长转换部分，并且发射具有等于或大于初级光的波长的波长的二次光。 波长转换部分包括多个绿色或黄色发光荧光体和多个红色发光荧光体。 绿色或黄色的发光荧光体由选自特定的铕（II）活化的硅酸盐荧光体（A-1）和特定的铈（III）活化的硅酸盐荧光体（A-2）中的至少一种来实现。 红色发光荧光体由特定的铕（II）活化氮化物荧光体（B）实现。 因此，可以提供比现有例更高效率和显色性发光白光的发光装置。

公开(公告)号：US07176612B2

公开(公告)日：2007-02-13

申请号：US10830379

申请日：2004-04-21

申请人： Masatoshi Omoto ,  Masatsugu Masuda ,  Masaharu Kitano

发明人： Masatoshi Omoto ,  Masatsugu Masuda ,  Masaharu Kitano

IPC分类号： H01L27/15 ,  H01L29/26

CPC分类号： C09K11/62 ,  C09K11/0883 ,  C09K11/54 ,  C09K11/584 ,  C09K11/595 ,  C09K11/662 ,  C09K11/7729 ,  C09K11/7734 ,  C09K11/7792 ,  H01L25/0753 ,  H01L33/502 ,  H01L33/504 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/181 ,  H04N5/2256 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An LED device at least including a blue light emitting element having peak emission wavelength of 420 nm to 480 nm, a green fluorescent substance having peak wavelength of fluorescent spectrum in the range of 500 nm to 580 nm with the emission of the blue light emitting element, and a red light emitting element having peak emission wavelength of 600 nm to 670 nm is provided. The device may further include an ultraviolet/violet light emitting element for exciting green fluorescent substance. As a result, an LED device capable of attaining bright white light with good color reproduction characteristic is provided.

摘要翻译： 一种LED装置，其至少包括具有420nm至480nm的峰值发射波长的蓝色发光元件，具有500nm至580nm范围内的荧光光谱的峰值波长的绿色荧光物质与蓝色发光​​元件的发射 并且提供具有600nm至670nm的峰值发射波长的红色发光元件。 该装置还可以包括用于激发绿色荧光物质的紫外/紫色发光元件。 结果，提供了能够获得具有良好的色彩再现特性的亮白光的LED装置。

公开(公告)号：US07473014B2

公开(公告)日：2009-01-06

申请号：US11246236

申请日：2005-10-11

申请人： Masaaki Katoh ,  Masatoshi Omoto ,  Masataka Miyata ,  Keiji Takasugi ,  Masahiro Seko

发明人： Masaaki Katoh ,  Masatoshi Omoto ,  Masataka Miyata ,  Keiji Takasugi ,  Masahiro Seko

IPC分类号： F21V5/00

CPC分类号： H01L33/54 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED lamp has a convex lens 3 which has an upper portion 5 and a lower portion 6. An upper curved surface 5A of the upper portion is different in shape from a lower curved surface 6A of the lower portion 6 so as to refract rays of light from an LED chip 2 more strongly than the lower curved surface 6A does. This avoids reflection of incident outside light toward a front and hence prevents misrecognition. An interface plane S1 between the upper and lower portions 5 and 6 of the convex lens 3 is located on an upper end face 2A to thereby prevent collection of outgoing light upon the interface plane S1 and generation of an irregular emission peak at the front.

摘要翻译： LED灯具有具有上部5和下部6的凸透镜3.上部的上曲面5A的形状与下部6的下弯曲面6A的形状不同， 来自LED芯片2的光比下曲面6A更强。 这避免了事件外侧的光线向前方反射，从而防止误识别。 凸透镜3的上下部分5和6之间的界面S1位于上端面2A上，从而防止出射光在界面S1上的收集，并在前面产生不规则的发射峰。

公开(公告)号：US20060039143A1

公开(公告)日：2006-02-23

申请号：US11246236

申请日：2005-10-11

申请人： Masaaki Katoh ,  Masatoshi Omoto ,  Masataka Miyata ,  Keiji Takasugi ,  Masahiro Seko

发明人： Masaaki Katoh ,  Masatoshi Omoto ,  Masataka Miyata ,  Keiji Takasugi ,  Masahiro Seko

IPC分类号： F21V5/00

CPC分类号： H01L33/54 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED lamp has a convex lens 3 which has an upper portion 5 and a lower portion 6. An upper curved surface 5A of the upper portion is different in shape from a lower curved surface 6A of the lower portion 6 so as to refract rays of light from an LED chip 2 more strongly than the lower curved surface 6A does. This avoids reflection of incident outside light toward a front and hence prevents misrecognition. An interface plane S1 between the upper and lower portions 5 and 6 of the convex lens 3 is located on an upper end face 2A to thereby prevent collection of outgoing light upon the interface plane S1 and generation of an irregular emission peak at the front.

摘要翻译： LED灯具有具有上部5和下部6的凸透镜3。 上部的上曲面5A的形状与下部6的下弯曲面6A的形状不同，从而比下弯曲面6A强烈地折射来自LED芯片2的光。 这避免了事件外侧的光线向前方反射，从而防止误识别。 凸透镜3的上下部分5和6之间的界面S 1位于上端面2A上，从而防止出射光在界面S 1上的收集，并产生不规则的发射峰 面前。

公开(公告)号：US06982522B2

公开(公告)日：2006-01-03

申请号：US10667669

申请日：2003-09-23

申请人： Masatoshi Omoto

发明人： Masatoshi Omoto

IPC分类号： H01L33/00

CPC分类号： H05B33/145 ,  H01L33/486 ,  H01L33/502 ,  H01L33/504 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention provides an LED device 1 as a light source having an excellent color reproducibility and high luminance. The LED device 1 comprises: a base 2 having a recess 4 with the upper surface opened, the inner wall surface of the recess 4 constituting a reflection surface 4a; a LED chip 5 disposed on the inner bottom of the recess 4; a resin 10 filled in the recess 4, the resin 10 including phosphors 7a, 7b, 7c which absorb a part of light emitted from the LED chip to convert the wavelength thereof and emit light; and a phosphor layer 6a, 6b, 6c formed on the reflection surface 4a, the phosphor layer 6a, 6b, 6c including the phosphors 7a, 7b, 7c.

摘要翻译： 本发明提供一种作为光源的LED装置1，具有优异的色彩再现性和高亮度。 LED装置1包括：具有上表面开口的凹部4的基座2，凹部4的内壁面构成反射面4a; 设置在凹部4的内底部的LED芯片5; 填充在凹部4中的树脂10，树脂10包括吸收从LED芯片发射的一部分光以转换其波长并发光的荧光体7a，7b，7c; 以及形成在反射面4a上的荧光体层6a，6b，6C，包含荧光体7a，7b，7b的荧光体层6a，6b，6b。

公开(公告)号：US5645707A

公开(公告)日：1997-07-08

申请号：US516560

申请日：1995-08-18

申请人： Masatoshi Omoto

发明人： Masatoshi Omoto

IPC分类号： C25D2/00 ,  C25D7/12 ,  H01L21/58 ,  H01L21/60 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32

CPC分类号： H01L24/83 ,  C25D7/12 ,  H01L24/29 ,  H01L24/81 ,  H05K3/32 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L33/62 ,  H05K3/303

摘要： In a bonding method for a chip-type electronic part, the electronic part is prefixed onto an element-mounting section of a wiring substrate by using a non-conductive adhesive agent while an external metal electrode of the electronic part is brought close to, or in contact with the metal wiring pattern formed on the wiring substrate. Then, the wiring substrate, on which the electronic part has been prefixed, is subjected to an electroplating process while it is immersed into plating liquid containing a metal component, so that the metal component, which is deposited on the metal wiring pattern, grows to form a metal layer, and the external metal electrode and the metal wiring pattern are thus electrically connected to each other through the metal layer. With this arrangement, since no short circuit occurs between the external metal electrodes or between the portions of the metal wiring pattern, it is possible to miniaturize the electronic part and also to narrow its packaging pitch, thereby achieving a high-density packaging. Further, no stress, such as caused by heat and pressure during the bonding process, is applied onto the wiring substrate and the chip-type electronic part. This makes it possible to remarkably improve the reliability of the apparatus.

摘要翻译： 在芯片型电子部件的接合方法中，电子部件通过使用非导电性粘合剂将电子部件的外部金属电极接近或接近，而将其前置于布线基板的元件安装部 与形成在布线基板上的金属布线图案接触。 然后，将电子部件预定的布线基板浸入包含金属成分的镀液中进行电镀处理，使沉积在金属布线图案上的金属成分生长成 形成金属层，并且外部金属电极和金属布线图案因此通过金属层彼此电连接。 通过这种布置，由于外部金属电极之间或金属布线图案的部分之间不发生短路，因此可以使电子部件小型化并且缩小其封装间距，从而实现高密度封装。 此外，在接合工序中，不会在配线基板和芯片型电子部件上施加由热和压力引起的应力。 这使得可以显着提高装置的可靠性。