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公开(公告)号：US5489900A
公开(公告)日：1996-02-06
申请号：US253655
申请日：1994-06-03
IPC分类号： G01L5/22 , G05G9/047 , G06F3/033 , H03K17/965
CPC分类号： G01L5/223 , G05G9/047 , G06F3/0338
摘要： A strain sensitive columnar transducer for a data entry keyboard contains a column upstanding from the keyboard. Strain sensitive orthogonally oriented patterns are formed on a single flexible planar sheet which is sliced to place each of the patterns on a separate tab. The planar sheet is forced over the column so that the patterns lie up against the sides of the column to measure force exerted on the column.
摘要翻译： 用于数据输入键盘的应变敏感柱状传感器包含从键盘竖立的列。 应变敏感的正交取向图案形成在单个柔性平面片上，其被切片以将每个图案放置在单独的片上。 平板被迫超过柱，使得图案靠在柱的侧面以测量施加在柱上的力。
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2.发明授权Temperature sensing device for dynamically measuring temperature fluctuation in a tip of a bonding device 失效用于动态测量接合装置的尖端中的温度波动的温度感测装置
公开(公告)号：US5281025A
公开(公告)日：1994-01-25
申请号：US4365
申请日：1993-01-14
申请人： Matthew F. Cali , Pedro A. Chalco
发明人： Matthew F. Cali , Pedro A. Chalco
CPC分类号： B23K3/0478 , G01K7/021 , G01K7/023
摘要： A temperature sensing device for accurately measuring the temperature of a microbonding device tip. The temperature sensing device consists of an array of thin-film thermocouples produced by thin-film patterning techniques on a substrate card. Each thermocouple is composed of two circuit lines of dissimilar metals A & B. The dissimilar metals are superimposed at a junction point. A third metal C is deposited between the metals A and B to prevent premature degradation of the thermocouple junction. A common line is used for one of the two metals connecting to the junctions. This allows almost twice as many thermocouples than conventional layout techniques.
摘要翻译： 一种温度感测装置，用于精确测量微型结合装置尖端的温度。 温度感测装置由在衬底卡上通过薄膜图案化技术制成的薄膜热电偶阵列组成。 每个热电偶由不同金属A和B的两条电路线组成。不同金属在接合点处叠加。 第三金属C沉积在金属A和B之间，以防止热电偶结的过早劣化。 连接到接头的两个金属中的一个使用公共线。 这比传统的布局技术几乎是热电偶的两倍。
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公开(公告)号：US5321886A
公开(公告)日：1994-06-21
申请号：US68037
申请日：1993-05-28
IPC分类号： H01L23/12 , G02F1/13 , H01L21/768 , H05K3/00 , H05K3/02 , H05K3/20 , H05K3/22 , H05K3/28 , H05K3/46
CPC分类号： H05K3/225 , H01L21/76886 , G02F1/1309 , H05K2201/0394 , H05K2201/1028 , H05K2203/0769 , H05K2203/107 , H05K2203/173 , H05K3/0017 , H05K3/027 , H05K3/20 , H05K3/28 , Y10T29/49124 , Y10T29/49155 , Y10T29/49742
摘要： A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
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4.发明授权Dynamic policy manager method, system, and computer program product for optimizing fractional resource allocation 失效动态策略管理器方法，系统和计算机程序产品，用于优化分配资源分配公开(公告)号：US08327370B2
公开(公告)日：2012-12-04
申请号：US11260625
申请日：2005-10-27
CPC分类号： G06F9/5077
摘要： A computer-implemented method, apparatus, and computer program product are disclosed for optimizing the fractional allocation of a computing resource among multiple partitions in a data processing system. Multiple processing attributes are defined. A policy is generated for a first partition. The policy includes the definition of the processing attributes. Current values are determined for the first partition for the processing attributes. The policy and the current values are then used to determine a fractional portion of the resource to be allocated to the first partition.
摘要翻译： 公开了一种计算机实现的方法，装置和计算机程序产品，用于在数据处理系统中的多个分区之间优化计算资源的分数分配。 定义多个处理属性。 为第一个分区生成策略。 该策略包括处理属性的定义。 确定处理属性的第一个分区的当前值。 然后，策略和当前值用于确定要分配给第一个分区的资源的小数部分。
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公开(公告)号：US5310967A
公开(公告)日：1994-05-10
申请号：US68036
申请日：1993-05-28
IPC分类号： H01L23/12 , G02F1/13 , H01L21/768 , H05K3/00 , H05K3/02 , H05K3/20 , H05K3/22 , H05K3/28 , H05K3/46 , H05K1/00
CPC分类号： H05K3/225 , H01L21/76886 , G02F1/1309 , H05K2201/0394 , H05K2201/1028 , H05K2203/0769 , H05K2203/107 , H05K2203/173 , H05K3/0017 , H05K3/027 , H05K3/20 , H05K3/28 , Y10T29/49124 , Y10T29/49155 , Y10T29/49742
摘要： A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
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公开(公告)号：US5289632A
公开(公告)日：1994-03-01
申请号：US981458
申请日：1992-11-25
IPC分类号： H01L23/12 , G02F1/13 , H01L21/768 , H05K3/00 , H05K3/02 , H05K3/20 , H05K3/22 , H05K3/28 , H05K3/46
CPC分类号： H05K3/225 , H01L21/76886 , G02F1/1309 , H05K2201/0394 , H05K2201/1028 , H05K2203/0769 , H05K2203/107 , H05K2203/173 , H05K3/0017 , H05K3/027 , H05K3/20 , H05K3/28 , Y10T29/49124 , Y10T29/49155 , Y10T29/49742
摘要： A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
摘要翻译： 通过将导线与衬底的选定区域并置定位来将导线施加到衬底; 将导线接合到基板上; 以及将导线从其中悬挂有导线的载体分离。 载体具有由侧壁限定的载体开口，并且导电材料被载体开口的侧壁悬挂以嵌入载体开口中，并形成导电线。
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