摘要:
A test pattern generator includes a random pattern generator and a shift register. The random pattern generator generates a series of digits which are input to the shift register and stored therein. Each digit output by the random pattern generator has a probability of having a first value, such as representing "1". The output probability of the random pattern generator is adjustable. The shift register has a plurality of outputs for outputting a test pattern comprising the stored digits. The shift register includes a series of latches and at least a first logic circuit connecting the output of the random pattern generator to the input of a first latch, or connecting the output of a latch to the input of a next adjacent latch. In a first state, the logic circuit has an output probability which is independent of the output probability of the random pattern generator. In a second state, the logic circuit has an output probability which is dependent on the output probability of the random pattern generator.
摘要:
A method is disclosed of diagnosing defects in scan chains by statically and dynamically segmenting and reconfiguring the scan chains. A plurality of serially extending scan chains are partitioned into a plurality of serially arranged equal length segments such that each serially extending scan chain comprises a plurality of serially extending segments. A plurality of multiplexors are positioned between the plurality of segments of each scan chain, and are controlled and utilized to connect each segment of the scan chain to the next serial segment in the same scan chain, or to connect each segment of the scan chain to the next serial segment in a lateral adjacent scan chain. Scan in data patterns are introduced into the plurality of serially extending scan chains. Particular defective segments of the plurality of serially extending scan chains are identified by controlling the multiplexors to connect and shift the data pattern out of each segment of a scan chain serially to the next serial segment in the same scan chain, or to connect and shift the data pattern out of each segment of the scan chain to the next serial segment in an adjacent lateral scan chain, with a sequence of serial shifts and serial-lateral shifts being selected to identify particular defective segments of the plurality of serially extending scan chains.
摘要:
A method for defect diagnosis of semiconductor chip. The method comprises the steps of (a) identifying M design structures and N physical characteristics of the circuit design, wherein M and N are positive integers, wherein each design structure of the M design structures is testable as to pass or fail, and wherein each physical characteristic of the N physical characteristics is present in at least one design structure of the M design structures; (b) for each design structure of the M design structures of the circuit design, determining a fail rate and determining whether the fail rate is high or low; and (c) if every design structure of the M design structures in which a physical characteristic of the N physical characteristics is present has a high fail rate, then flagging the physical characteristic as being likely to contain at least a defect.
摘要:
Systems, methods and apparatus are provided for isolating a defect in a scan chain. The invention includes modifying a first test mode of a plurality of latches included in a scan chain, operating the latches in the modified first test mode, and operating the plurality of latches included in the scan chain in a second test mode. A portion of the scan chain adjacent and following a stuck-@-0 or stuck-@-1 fault in the scan chain may store and/or output a value complementary to the value on the output of the previous portion of the scan chain due to the fault. Such values may be unloaded from the scan chain and used for diagnosing (e.g., isolating a defect in) the defective scan chain. Numerous other aspects are provided.
摘要:
In one aspect, an electronic device that has been partitioned into segments by using clock gating or signal gating is tested. One of the segments that is a source of a failure is identified. Diagnostic procedures are applied to the identified segment to determine a cause of the failure.
摘要:
A method for analyzing test data for objects on an IC or a wafer is provided. The test data is linked to available layout information about the object under test. Certain objects are selected based on the test data. A representation of the selected objects is placed on a map of the IC or on a map of the wafer. The representation should correspond to the physical location of the object on the IC or wafer. Preferably, the representation comprises one or more polygons that enclose all devices that make up the object.
摘要:
A method of bounding, from above and below, the probability of uncovering a fault in a logic portion of an integrated circuit having embedded memory. The circuit must be designed according to a specified set of design rules. Then one or more probabilities of fault exposure is calculated for a modified system with the memory portion removed, with its inputs directly connected to its outputs. This probability can be related, by provided relations, to upper and lower bounds of the fault exposure in the unmodified system. The relationships rely upon how the logic portions process given test vectors to control the unremoved memory portion.
摘要:
A system and method for diagnosing a failure in an electronic device. A disclosed system comprises: a defect table that associates previously studied features with known failures; and a fault isolation system that compares an inputted set of suspected faulty device features with the previously studied features listed in the defect table in order to identify causes of the failure.
摘要:
The present invention provides inspection methods and structures for facilitating the visualization and/or detection of specific chip structures. Optical or fluorescent labeling techniques are used to “stain” a specific chip structure for easier detection of the structure. Also, a temporary/sacrificial illuminating (e.g., fluorescent) film is added to the semiconductor process to facilitate the detection of a specific chip structure. Further, a specific chip structure is doped with a fluorescent material during the semiconductor process. A method of the present invention comprises: providing a first and a second material; processing the first material to form a portion of a semiconductor structure; and detecting a condition of the second material to determine whether processing of the first material is complete.
摘要:
A method is disclosed for designing scan chains in an integrated circuit chip with specific parameter sensitivities to identify fabrication process defects causing test fails and chip yield loss. The composition of scan paths in the integrated circuit chip is biased to allow them to also function as on-product process monitors. The method adds grouping constraints that bias scan chains to have common latch cell usage where possible, and also biases cell routing to constrain scan chain routing to given restricted metal layers for interconnects. The method assembles a list of latch design parameters which are sensitive to process variation or integrity, and formulates a plan for scan chain design which determines the number and the length of scan chains. A model is formulated of scan chain design based upon current state of yield and process integrity, wherein certain latch designs having dominant sensitivities are chosen for specific ones of the scan chains on the chip. The model is provided as input parameters to a global placement and wiring program used to lay out the scan chains. Test data on the chip is then analyzed to determine and isolate systematic yield problems denoted by attributes of a statistically significant failing population of a specific type of scan chain.