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    ACTIVE BACKPLANE FOR THIN SILICON SOLAR CELLS
    3.
    发明申请
    ACTIVE BACKPLANE FOR THIN SILICON SOLAR CELLS 审中-公开
    薄硅太阳能电池的主动背板

    公开(公告)号：US20130000715A1

    公开(公告)日：2013-01-03

    申请号：US13433280

    申请日：2012-03-28

    申请人： Mehrdad M. Moslehi ,  David Xuan-Qi Wang ,  Karl-Josef Kramer ,  Sean M. Seutter ,  Sam Tone Tor ,  Anthony Calcaterra

    发明人： Mehrdad M. Moslehi ,  David Xuan-Qi Wang ,  Karl-Josef Kramer ,  Sean M. Seutter ,  Sam Tone Tor ,  Anthony Calcaterra

    IPC分类号： H01L31/0224 ,  H01L31/18

    CPC分类号： H01L31/022441 ,  H01L31/0516 ,  H01L31/1804 ,  Y02E10/50

    摘要： Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, attaching a prepeg backplane to the interdigitated pattern of base electrodes and emitter electrodes, forming holes in the prepeg backplane which provide access to the first layer of electrically conductive metal, and depositing a second layer of electrically conductive metal on the backside surface of the prepeg backplane forming an electrical interconnect with the first layer of electrically conductive metal through the holes in the prepeg backplane.

    摘要翻译： 描述了提供太阳能电池基板加强和电互连的背接触太阳能电池的背板的制造方法和结构。 该方法包括在半导体衬底的背面上沉积基底电极和发射电极的交错图形，将预制电路背板连接到基极和发射电极的交错图案，在预制电路背板上形成提供对第一层 的导电金属，以及在所述预制底板的背面上沉积第二导电金属层，通过所述预制底板中的所述孔与所述第一导电金属层形成电互连。

    Releasing apparatus for separating a semiconductor substrate from a semiconductor template
    5.
    发明授权
    Releasing apparatus for separating a semiconductor substrate from a semiconductor template 有权
    用于从半导体模板分离半导体衬底的释放装置

    公开(公告)号：US09397250B2

    公开(公告)日：2016-07-19

    申请号：US13463757

    申请日：2012-05-03

    申请人： Mehrdad M. Moslehi ,  David Xuan-Qi Wang ,  Sam Tone Tor ,  Karl-Josef Kramer

    发明人： Mehrdad M. Moslehi ,  David Xuan-Qi Wang ,  Sam Tone Tor ,  Karl-Josef Kramer

    IPC分类号： H01L21/20 ,  H01L31/18 ,  H01L21/67 ,  H01L21/683 ,  H01L21/762

    CPC分类号： H01L31/18 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6838 ,  H01L21/76259 ,  H01L2924/19042 ,  Y10T29/53683 ,  Y10T279/11

    摘要： According to one embodiment, a releasing apparatus for separating a semiconductor substrate from a semiconductor template, the releasing apparatus having an enclosed pressure chamber having at least one gas inlet and at least one gas outlet. A top vacuum chuck for securing a released semiconductor substrate or semiconductor template in the enclosed pressure chamber. A bottom vacuum chuck for securing an attached semiconductor substrate and semiconductor template in the enclosed pressure chamber. A gap between the attached semiconductor substrate and semiconductor template and the top vacuum chuck allowing gas flowing through the gap to generate lifting forces on the attached semiconductor substrate and semiconductor template.

    摘要翻译： 根据一个实施例，一种用于从半导体模板分离半导体衬底的释放装置，所述释放装置具有封闭的压力室，其具有至少一个气体入口和至少一个气体出口。 用于将释放的半导体衬底或半导体模板固定在封闭的压力室中的顶部真空吸盘。 用于将附接的半导体衬底和半导体模板固定在封闭的压力室中的底部真空吸盘。 附着的半导体衬底和半导体模板和顶部真空吸盘之间的间隙允许气体流过间隙以在附着的半导体衬底和半导体模板上产生提升力。

    Method for releasing a thin semiconductor substrate from a reusable template
    6.
    发明授权
    Method for releasing a thin semiconductor substrate from a reusable template 有权
    从可重复利用的模板中释放薄的半导体衬底的方法

    公开(公告)号：US08193076B2

    公开(公告)日：2012-06-05

    申请号：US12826641

    申请日：2010-06-29

    申请人： Mehrdad M. Moslehi ,  David Xuan-Qi Wang ,  Sam Tone Tor ,  Karl-Josef Kramer

    发明人： Mehrdad M. Moslehi ,  David Xuan-Qi Wang ,  Sam Tone Tor ,  Karl-Josef Kramer

    IPC分类号： H01L21/20

    CPC分类号： H01L31/18 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6838 ,  H01L21/76259 ,  H01L2924/19042 ,  Y10T29/53683 ,  Y10T279/11

    摘要： The present disclosure relates to methods and apparatuses template. The method involves forming a mechanically weak layer conformally on a semiconductor template. Then forming a thin for releasing a thin semiconductor substrate from a reusable semiconductor substrate conformally on the mechanically weak layer. The thin semiconductor substrate, the mechanically weak layer and the template forming a wafer. Then defining the border of the thin-film semiconductor substrate to be released by exposing the peripheral of the mechanically weak layer. Then releasing the thin-film semiconductor substrate by applying a controlled air flow parallel to said mechanically weak layer wherein the controlled air flow separates the thin semiconductor substrate and template according to lifting forces.

    摘要翻译： 本公开涉及方法和装置模板。 该方法包括在半导体模板上共形形成机械弱层。 然后在机械弱层上共形成用于从可重复使用的半导体衬底释放薄半导体衬底的薄层。 薄半导体衬底，机械弱层和模板形成晶片。 然后通过暴露机械薄弱层的周边来限定待释放的薄膜半导体衬底的边界。 然后通过施加平行于所述机械弱层的受控空气流来释放薄膜半导体衬底，其中受控空气流根据提升力分离薄半导体衬底和模板。

    METHOD FOR RELEASING A THIN SEMICONDUCTOR SUBSTRATE FROM A REUSABLE TEMPLATE
    8.
    发明申请
    METHOD FOR RELEASING A THIN SEMICONDUCTOR SUBSTRATE FROM A REUSABLE TEMPLATE 有权
    从可重复使用的模板中释放薄的半导体衬底的方法

    公开(公告)号：US20110021006A1

    公开(公告)日：2011-01-27

    申请号：US12826641

    申请日：2010-06-29

    申请人： Mehrdad M. Moslehi ,  David Xuan-Qi Wang ,  Sam Tone Tor ,  Karl-Josef Kramer

    发明人： Mehrdad M. Moslehi ,  David Xuan-Qi Wang ,  Sam Tone Tor ,  Karl-Josef Kramer

    IPC分类号： H01L21/76 ,  B25J15/06 ,  H01L21/677

    CPC分类号： H01L31/18 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6838 ,  H01L21/76259 ,  H01L2924/19042 ,  Y10T29/53683 ,  Y10T279/11

    摘要： The present disclosure relates to methods and apparatuses for releasing a thin semiconductor substrate from a reusable template. The method involves forming a mechanically weak layer conformally on a semiconductor template. Then forming a thin semiconductor substrate conformally on the mechanically weak layer. The thin semiconductor substrate, the mechanically weak layer and the template forming a wafer. Then defining the border of the thin-film semiconductor substrate to be released by exposing the peripheral of the mechanically weak layer. Then releasing the thin-film semiconductor substrate by applying a controlled air flow parallel to said mechanically weak layer wherein the controlled air flow separates the thin semiconductor substrate and template according to lifting forces.

    摘要翻译： 本公开涉及用于从可重用模板中释放薄半导体衬底的方法和装置。 该方法包括在半导体模板上共形形成机械弱层。 然后在机械弱层上共形成薄的半导体衬底。 薄半导体衬底，机械弱层和模板形成晶片。 然后通过暴露机械薄弱层的周边来限定待释放的薄膜半导体衬底的边界。 然后通过施加平行于所述机械弱层的受控空气流来释放薄膜半导体衬底，其中受控空气流根据提升力分离薄半导体衬底和模板。

    METHOD FOR RELEASING A THIN SEMICONDUCTOR SUBSTRATE FROM A REUSABLE TEMPLATE
    9.
    发明申请
    METHOD FOR RELEASING A THIN SEMICONDUCTOR SUBSTRATE FROM A REUSABLE TEMPLATE 有权
    从可重复使用的模板中释放薄的半导体衬底的方法

    公开(公告)号：US20120272490A1

    公开(公告)日：2012-11-01

    申请号：US13463757

    申请日：2012-05-03

    申请人： Mehrdad M. Moslehi ,  David Xuan-Qi Wang ,  Sam Tone Tor ,  Karl-Josef Kramer

    发明人： Mehrdad M. Moslehi ,  David Xuan-Qi Wang ,  Sam Tone Tor ,  Karl-Josef Kramer

    IPC分类号： H01L21/46

    CPC分类号： H01L31/18 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6838 ,  H01L21/76259 ,  H01L2924/19042 ,  Y10T29/53683 ,  Y10T279/11

    摘要： The present disclosure relates to methods and apparatuses for releasing a thin semiconductor substrate from a reusable template. The method involves forming a mechanically weak layer conformally on a semiconductor template. Then forming a thin semiconductor substrate conformally on the mechanically weak layer. The thin semiconductor substrate, the mechanically weak layer and the template forming a wafer. Then defining the border of the thin-film semiconductor substrate to be released by exposing the peripheral of the mechanically weak layer. Then releasing the thin-film semiconductor substrate by applying a controlled air flow parallel to said mechanically weak layer wherein the controlled air flow separates the thin semiconductor substrate and template according to lifting forces.

    摘要翻译： 本公开涉及用于从可重用模板中释放薄半导体衬底的方法和装置。 该方法包括在半导体模板上共形形成机械弱层。 然后在机械弱层上共形成薄的半导体衬底。 薄半导体衬底，机械弱层和模板形成晶片。 然后通过暴露机械薄弱层的周边来限定待释放的薄膜半导体衬底的边界。 然后通过施加平行于所述机械弱层的受控空气流来释放薄膜半导体衬底，其中受控空气流根据提升力分离薄半导体衬底和模板。