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公开(公告)号：US20060166387A1
公开(公告)日：2006-07-27
申请号：US10642543
申请日：2003-08-15
Applicant: Daniel Reznik , Oliver Stier , Melanie Ring , Werner Kuhlmann , Benjamin Prodinger , Nicola Iwanowski
Inventor： Daniel Reznik , Oliver Stier , Melanie Ring , Werner Kuhlmann , Benjamin Prodinger , Nicola Iwanowski
CPC classification number: H01S5/02248 , H01L2224/48091 , H01L2924/30107 , H01L2924/3011 , H01S5/02276 , H01S5/06832 , H01L2924/00014 , H01L2924/00
Abstract: The invention relates to an optical transmitting and/or receiving device, having: a semiconductor component with a first contact for connection with a reference voltage and a second contact for applying or leading away a high-frequency electrical signal; an electrically conducting carrier substrate with a first surface and a second surface, the semiconductor component being arranged on the first surface of the carrier substrate, the second surface of the carrier substrate having a metallization which can be connected to the reference voltage, and the reference voltage being applied by an electrical path through the carrier substrate to a first contacting region of the first surface of the carrier substrate, and the first contact of the semiconductor component being electrically connected to the first contacting region.
Abstract translation: 本发明涉及一种光发射和/或接收装置，其具有：具有用于与参考电压连接的第一触点的半导体部件和用于施加或引出高频电信号的第二触点; 具有第一表面和第二表面的导电载体衬底，所述半导体部件布置在所述载体衬底的所述第一表面上，所述载体衬底的第二表面具有可以连接到所述参考电压的金属化，并且所述参考 电压通过穿过载体衬底的电气路径施加到载体衬底的第一表面的第一接触区域，并且半导体部件的第一接触电连接到第一接触区域。
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公开(公告)号：US07582909B2
公开(公告)日：2009-09-01
申请号：US11450902
申请日：2006-06-09
Applicant: Melanie Ring , Benjamin Prodinger , Werner Kuhlmann
Inventor： Melanie Ring , Benjamin Prodinger , Werner Kuhlmann
CPC classification number: H01L23/485 , H01L23/147 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/83 , H01L33/62 , H01L2224/2919 , H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2224/83801 , H01L2224/8389 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01032 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/0665 , H01L2924/07811 , H01L2924/12041 , H01L2924/12043 , H01L2924/3025 , H01L2924/00 , H01L2224/45015 , H01L2924/207
Abstract: An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the formation of an electrically-conducting connection between the silicon support and the functional element. The assembly and adhesive layer are arranged on the support. The assembly and adhesive layer are made from a Ti/TiN layer (6), applied to an aluminum contact surface (5) of the silicon support (1), by means of a deposition method. The aluminum contact surface (5) is located on a landing pad (2) on the silicon support (1).
Abstract translation: 用于半导体部件的组装和粘合剂层被布置在硅支撑件（基座）和用于在硅支撑件和功能元件之间形成导电连接的电子功能元件之间。 组件和粘合剂层布置在支撑件上。 组装和粘合层由通过沉积方法施加到硅载体（1）的铝接触表面（5）上的Ti / TiN层（6）制成。 铝接触表面（5）位于硅支撑件（1）上的定位垫（2）上。
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公开(公告)号：US07361936B2
公开(公告)日：2008-04-22
申请号：US10642543
申请日：2003-08-15
Applicant: Daniel Reznik , Oliver Stier , Melanie Ring , Werner Kuhlmann , Benjamin Prodinger , Nicola Iwanowski
Inventor： Daniel Reznik , Oliver Stier , Melanie Ring , Werner Kuhlmann , Benjamin Prodinger , Nicola Iwanowski
CPC classification number: H01S5/02248 , H01L2224/48091 , H01L2924/30107 , H01L2924/3011 , H01S5/02276 , H01S5/06832 , H01L2924/00014 , H01L2924/00
Abstract: An optical transmitting and/or receiving device has a semiconductor component with a first contact for connecting to a reference voltage and a second contact for obtaining or supplying a high-frequency electrical signal. There is also an electrically conducting carrier substrate with a first surface and a second surface. The semiconductor component is configured on the first surface of the carrier substrate. The second surface of the carrier substrate has a metallization that can be connected to a reference voltage applied by an electrical path through the carrier substrate to a first contacting region of the first surface of the carrier substrate. The first contact of the semiconductor component is electrically connected to the first contacting region.
Abstract translation: 光发射和/或接收装置具有半导体部件，其具有用于连接到参考电压的第一触点和用于获得或提供高频电信号的第二触点。 还有一种具有第一表面和第二表面的导电载体衬底。 半导体元件配置在载体基板的第一表面上。 载体衬底的第二表面具有金属化，其可以连接到通过载体衬底的电路径施加的参考电压到载体衬底的第一表面的第一接触区域。 半导体部件的第一接触电连接到第一接触区域。
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公开(公告)号：US20060292717A1
公开(公告)日：2006-12-28
申请号：US11450902
申请日：2006-06-09
Applicant: Melanie Ring , Benjamin Prodinger , Werner Kuhlmann
Inventor： Melanie Ring , Benjamin Prodinger , Werner Kuhlmann
IPC: H01L21/00
CPC classification number: H01L23/485 , H01L23/147 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/83 , H01L33/62 , H01L2224/2919 , H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2224/83801 , H01L2224/8389 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01032 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/0665 , H01L2924/07811 , H01L2924/12041 , H01L2924/12043 , H01L2924/3025 , H01L2924/00 , H01L2224/45015 , H01L2924/207
Abstract: An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the formation of an electrically-conducting connection between the silicon support and the functional element. The assembly and adhesive layer are arranged on the support. The assembly and adhesive layer are made from a Ti/TiN layer (6), applied to an aluminum contact surface (5) of the silicon support (1), by means of a deposition method. The aluminum contact surface (5) is located on a landing pad (2) on the silicon support (1).
Abstract translation: 用于半导体部件的组装和粘合剂层被布置在硅支撑件（基座）和用于在硅支撑件和功能元件之间形成导电连接的电子功能元件之间。 组件和粘合剂层布置在支撑件上。 组装和粘合层由通过沉积方法施加到硅载体（1）的铝接触表面（5）上的Ti / TiN层（6）制成。 铝接触表面（5）位于硅支撑件（1）上的定位垫（2）上。
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