公开(公告)号：US07582909B2

公开(公告)日：2009-09-01

申请号：US11450902

申请日：2006-06-09

申请人： Melanie Ring ,  Benjamin Prodinger ,  Werner Kuhlmann

发明人： Melanie Ring ,  Benjamin Prodinger ,  Werner Kuhlmann

IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC分类号： H01L23/485 ,  H01L23/147 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8389 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the formation of an electrically-conducting connection between the silicon support and the functional element. The assembly and adhesive layer are arranged on the support. The assembly and adhesive layer are made from a Ti/TiN layer (6), applied to an aluminum contact surface (5) of the silicon support (1), by means of a deposition method. The aluminum contact surface (5) is located on a landing pad (2) on the silicon support (1).

摘要翻译： 用于半导体部件的组装和粘合剂层被布置在硅支撑件（基座）和用于在硅支撑件和功能元件之间形成导电连接的电子功能元件之间。 组件和粘合剂层布置在支撑件上。 组装和粘合层由通过沉积方法施加到硅载体（1）的铝接触表面（5）上的Ti / TiN层（6）制成。 铝接触表面（5）位于硅支撑件（1）上的定位垫（2）上。

公开(公告)号：US20060166387A1

公开(公告)日：2006-07-27

申请号：US10642543

申请日：2003-08-15

申请人： Daniel Reznik ,  Oliver Stier ,  Melanie Ring ,  Werner Kuhlmann ,  Benjamin Prodinger ,  Nicola Iwanowski

发明人： Daniel Reznik ,  Oliver Stier ,  Melanie Ring ,  Werner Kuhlmann ,  Benjamin Prodinger ,  Nicola Iwanowski

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H01S5/02248 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01S5/02276 ,  H01S5/06832 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to an optical transmitting and/or receiving device, having: a semiconductor component with a first contact for connection with a reference voltage and a second contact for applying or leading away a high-frequency electrical signal; an electrically conducting carrier substrate with a first surface and a second surface, the semiconductor component being arranged on the first surface of the carrier substrate, the second surface of the carrier substrate having a metallization which can be connected to the reference voltage, and the reference voltage being applied by an electrical path through the carrier substrate to a first contacting region of the first surface of the carrier substrate, and the first contact of the semiconductor component being electrically connected to the first contacting region.

摘要翻译： 本发明涉及一种光发射和/或接收装置，其具有：具有用于与参考电压连接的第一触点的半导体部件和用于施加或引出高频电信号的第二触点; 具有第一表面和第二表面的导电载体衬底，所述半导体部件布置在所述载体衬底的所述第一表面上，所述载体衬底的第二表面具有可以连接到所述参考电压的金属化，并且所述参考 电压通过穿过载体衬底的电气路径施加到载体衬底的第一表面的第一接触区域，并且半导体部件的第一接触电连接到第一接触区域。

公开(公告)号：US07361936B2

公开(公告)日：2008-04-22

申请号：US10642543

申请日：2003-08-15

申请人： Daniel Reznik ,  Oliver Stier ,  Melanie Ring ,  Werner Kuhlmann ,  Benjamin Prodinger ,  Nicola Iwanowski

发明人： Daniel Reznik ,  Oliver Stier ,  Melanie Ring ,  Werner Kuhlmann ,  Benjamin Prodinger ,  Nicola Iwanowski

IPC分类号： H01L27/15 ,  H01S3/14

CPC分类号： H01S5/02248 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01S5/02276 ,  H01S5/06832 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical transmitting and/or receiving device has a semiconductor component with a first contact for connecting to a reference voltage and a second contact for obtaining or supplying a high-frequency electrical signal. There is also an electrically conducting carrier substrate with a first surface and a second surface. The semiconductor component is configured on the first surface of the carrier substrate. The second surface of the carrier substrate has a metallization that can be connected to a reference voltage applied by an electrical path through the carrier substrate to a first contacting region of the first surface of the carrier substrate. The first contact of the semiconductor component is electrically connected to the first contacting region.

摘要翻译： 光发射和/或接收装置具有半导体部件，其具有用于连接到参考电压的第一触点和用于获得或提供高频电信号的第二触点。 还有一种具有第一表面和第二表面的导电载体衬底。 半导体元件配置在载体基板的第一表面上。 载体衬底的第二表面具有金属化，其可以连接到通过载体衬底的电路径施加的参考电压到载体衬底的第一表面的第一接触区域。 半导体部件的第一接触电连接到第一接触区域。

公开(公告)号：US20060292717A1

公开(公告)日：2006-12-28

申请号：US11450902

申请日：2006-06-09

申请人： Melanie Ring ,  Benjamin Prodinger ,  Werner Kuhlmann

发明人： Melanie Ring ,  Benjamin Prodinger ,  Werner Kuhlmann

IPC分类号： H01L21/00

CPC分类号： H01L23/485 ,  H01L23/147 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8389 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the formation of an electrically-conducting connection between the silicon support and the functional element. The assembly and adhesive layer are arranged on the support. The assembly and adhesive layer are made from a Ti/TiN layer (6), applied to an aluminum contact surface (5) of the silicon support (1), by means of a deposition method. The aluminum contact surface (5) is located on a landing pad (2) on the silicon support (1).

摘要翻译： 用于半导体部件的组装和粘合剂层被布置在硅支撑件（基座）和用于在硅支撑件和功能元件之间形成导电连接的电子功能元件之间。 组件和粘合剂层布置在支撑件上。 组装和粘合层由通过沉积方法施加到硅载体（1）的铝接触表面（5）上的Ti / TiN层（6）制成。 铝接触表面（5）位于硅支撑件（1）上的定位垫（2）上。

公开(公告)号：US07501585B2

公开(公告)日：2009-03-10

申请号：US11044743

申请日：2005-01-26

申请人： Thomas Killer ,  Hans-Ludwig Althaus ,  Melanie Ring

发明人： Thomas Killer ,  Hans-Ludwig Althaus ,  Melanie Ring

IPC分类号： H05K1/16

CPC分类号： H01L24/32 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15192 ,  H01S5/0226 ,  H01S5/02268 ,  H01L2924/00

摘要： A support element and a semiconductor component including the support element, where the support element having at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary, which is arranged on the surface and at least partly surrounds the subregion of the surface. A method is also disclosed for arranging a semiconductor device on the surface of a support element, with the steps of: providing a support element which has at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary which is arranged on the surface and at least partly surrounds the subregion of the surface, introducing an adhesive fluid within the fluid-tight boundary, and introducing a semiconductor device into the adhesive fluid.

摘要翻译： 支撑元件和包括支撑元件的半导体元件，其中支撑元件具有至少一个表面，其具有用于接收半导体器件的子区域和至少一个流体密封边界，其布置在表面上并且至少部分地围绕 表面的次区域。 还公开了一种用于在支撑元件的表面上布置半导体器件的方法，其步骤包括：提供支撑元件，该支撑元件具有至少一个具有用于接收半导体器件的子区域的表面和至少一个流体密封边界， 布置在表面上并且至少部分地围绕表面的次级区域，将粘合剂流体引入流体密封边界内，并将半导体器件引入粘合剂流体中。

公开(公告)号：US07476906B2

公开(公告)日：2009-01-13

申请号：US10501209

申请日：2002-01-09

申请人： Robert Fürst ,  Mathias Kämpf ,  Melanie Ring ,  Frank Singer

发明人： Robert Fürst ,  Mathias Kämpf ,  Melanie Ring ,  Frank Singer

IPC分类号： H01L31/12

CPC分类号： H01L31/101 ,  H01L27/14643 ,  H01L31/02005 ,  H01L31/02019 ,  H01L31/18 ,  H01L2224/48091 ,  H01S5/02248 ,  H01S5/0683 ,  H01S5/423 ,  H01L2924/00014

摘要： The invention relates to a photodiode array comprising a photodiode and a submount, via which the photodiode is contacted, said photodiode and said submount being interlinked by eutectic bonding. The invention further relates to a method for establishing a link between a first semiconductor element and a second semiconductor element which have different outer contours, the two elements being interlinked by eutectic bonding when already being present as a wafer composite. The two interlinked wafers are subdivided one by one and independently of each other in accordance with the desired outer contour.

摘要翻译： 本发明涉及一种包括光电二极管和基座的光电二极管阵列，光电二极管与之接触，所述光电二极管和所述基座通过共晶接合而互相连接。 本发明还涉及一种用于在第一半导体元件和具有不同外部轮廓的第二半导体元件之间建立连接的方法，所述两个元件当已经作为晶片复合材料存在时通过共晶接合而互相连接。 两个相互连接的晶片根据期望的外轮廓逐个细分并且彼此独立。

公开(公告)号：US20050110025A1

公开(公告)日：2005-05-26

申请号：US10501209

申请日：2002-01-09

申请人： Robert Furst ,  Mathias Kampf ,  Melanie Ring ,  Frank Singer

发明人： Robert Furst ,  Mathias Kampf ,  Melanie Ring ,  Frank Singer

IPC分类号： H01L27/146 ,  H01L31/02 ,  H01L31/101 ,  H01L31/18 ,  H01S5/022 ,  H01L27/15 ,  H01L29/26

CPC分类号： H01L31/101 ,  H01L27/14643 ,  H01L31/02005 ,  H01L31/02019 ,  H01L31/18 ,  H01L2224/48091 ,  H01S5/02248 ,  H01S5/0683 ,  H01S5/423 ,  H01L2924/00014

摘要： The invention relates to a photodiode array comprising a photodiode and a submount, via which the photodiode is contacted, said photodiode and said submount being interlinked by eutectic bonding. The invention further relates to a method for establishing a link between a first semiconductor element and a second semiconductor element which have different outer contours, the two elements being interlinked by eutectic bonding when already being present as a wafer composite. The two interlinked wafers are subdivided one by one and independently of each other in accordance with the desired outer contour.

摘要翻译： 本发明涉及一种包括光电二极管和基座的光电二极管阵列，光电二极管与之接触，所述光电二极管和所述基座通过共晶接合而互相连接。 本发明还涉及一种用于在第一半导体元件和具有不同外部轮廓的第二半导体元件之间建立连接的方法，所述两个元件当已经作为晶片复合材料存在时通过共晶接合而互相连接。 两个相互连接的晶片根据期望的外轮廓逐个细分并且彼此独立。

公开(公告)号：US20050242447A1

公开(公告)日：2005-11-03

申请号：US11044743

申请日：2005-01-26

申请人： Thomas Killer ,  Hans-Ludwig Althaus ,  Melanie Ring

发明人： Thomas Killer ,  Hans-Ludwig Althaus ,  Melanie Ring

IPC分类号： H01L23/48 ,  H01S5/02

CPC分类号： H01L24/32 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15192 ,  H01S5/0226 ,  H01S5/02268 ,  H01L2924/00

摘要： A support element and a semiconductor component including the support element, where the support element having at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary, which is arranged on the surface and at least partly surrounds the subregion of the surface. A method is also disclosed for arranging a semiconductor device on the surface of a support element, with the steps of: providing a support element which has at least one surface with a subregion for receiving a semiconductor device and at least one fluid-tight boundary which is arranged on the surface and at least partly surrounds the subregion of the surface, introducing an adhesive fluid within the fluid-tight boundary, and introducing a semiconductor device into the adhesive fluid.

摘要翻译： 支撑元件和包括支撑元件的半导体元件，其中支撑元件具有至少一个表面，其具有用于接收半导体器件的子区域和至少一个流体密封边界，其布置在表面上并且至少部分地围绕 表面的次区域。 还公开了一种用于在支撑元件的表面上布置半导体器件的方法，其步骤包括：提供支撑元件，该支撑元件具有至少一个具有用于接收半导体器件的子区域的表面和至少一个流体密封边界， 布置在表面上并且至少部分地围绕表面的次级区域，将粘合剂流体引入流体密封边界内，并将半导体器件引入粘合剂流体中。