Method of providing a low-stress sensor configuration for a lithographically-defined read sensor
    1.
    发明申请
    Method of providing a low-stress sensor configuration for a lithographically-defined read sensor 失效
    为光刻定义的读取传感器提供低应力传感器配置的方法

    公开(公告)号:US20060000079A1

    公开(公告)日:2006-01-05

    申请号:US10881581

    申请日:2004-06-30

    IPC分类号: G11B5/127 H04R31/00

    摘要: One illustrative method of fabricating a read sensor of a magnetic head includes the steps of forming a plurality of read sensor layers on a wafer; etching the read sensor layers to form a read sensor structure with a trench in front of the read sensor structure; forming a highly porous material within the trench; and slicing the wafer and lapping the sliced wafer through the highly porous material until an air bearing surface (ABS) of the magnetic head is reached. Advantageously, the highly porous material in front of the read sensor structure reduces mechanical stress on the read sensor during the lapping process. This reduces the likelihood that the amplitude of the read sensor will be degraded or set in a “flipped” or reversed orientation, as well as reduces the likelihood that electrostatic discharge (ESD) damage to the read sensor will occur.

    摘要翻译: 一种制造磁头的读取传感器的说明性方法包括以下步骤:在晶片上形成多个读取传感器层; 蚀刻读取的传感器层以形成读取的传感器结构,其中在传感器结构的前面具有沟槽; 在沟槽内形成高度多孔的材料; 并切片晶片并通过高度多孔材料研磨切片的晶片,直到达到磁头的空气轴承表面(ABS)。 有利地,在读取传感器结构前面的高度多孔材料在研磨过程中减小了读取传感器上的机械应力。 这降低了读取传感器的幅度将被降级或设置为“翻转”或反向取向的可能性,并且降低了对读取传感器的静电放电(ESD)损坏将发生的可能性。

    Method of forming an embedded read element
    2.
    发明申请
    Method of forming an embedded read element 失效
    形成嵌入式读取元素的方法

    公开(公告)号:US20050063103A1

    公开(公告)日:2005-03-24

    申请号:US10666679

    申请日:2003-09-19

    摘要: A method of forming an embedded read element is used in the fabrication process of a magnetic head assembly including write and read heads. In this method, three photolithographic patterning steps are applied for defining the designed height of the embedded read element, defining its designed width, and connecting it with conducting layers, respectively. An in-line lapping guide is also formed with a spacing in front of the embedded read element. In this method, two mechanical lapping steps are applied, one monitored by measuring the resistance of a parallel circuit of the embedded read element and the in-line lapping guide, and the other monitored by measuring the GMR response of the embedded read element.

    摘要翻译: 在包括写入和读取头的磁头组件的制造过程中使用形成嵌入式读取元件的方法。 在该方法中,应用三个光刻图案步骤来定义嵌入式读取元件的设计高度,限定其设计宽度,并将其与导电层连接。 在嵌入式读取元件的前面还形成有间距的在线研磨引导件。 在这种方法中,应用了两个机械研磨步骤,一个通过测量嵌入式读取元件的并联电路的电阻和在线研磨导轨进行监测,另一个通过测量嵌入式读取元件的GMR响应进行监测。

    Method of making a read sensor while protecting it from electrostatic discharge (ESD) damage
    3.
    发明授权
    Method of making a read sensor while protecting it from electrostatic discharge (ESD) damage 失效
    制造读取传感器同时防止静电放电(ESD)损坏的方法

    公开(公告)号:US07291279B2

    公开(公告)日:2007-11-06

    申请号:US10835807

    申请日:2004-04-30

    摘要: A method of making a read sensor while protecting it from electrostatic discharge (ESD) damage involves forming a severable shunt during the formation of the read sensor. The method may include forming a resist layer over a plurality of read sensor layers; performing lithography with use of a mask to form the resist layer into a patterned resist which exposes left and right side regions over the read sensor layers as well as a shunt region; etching, with the patterned resist in place, to remove materials in the left and right side regions and in the shunt region; and depositing, with the patterned resist in place, left and right hard bias and lead layers in the left and right side regions, respectively, and in the shunt region for forming a severable shunt which electrically couples the left and right hard bias and lead layers together for ESD protection.

    摘要翻译: 制造读取传感器同时防止静电放电(ESD)损坏的方法包括在形成读取的传感器期间形成可分离的分流。 该方法可以包括在多个读取传感器层上形成抗蚀剂层; 使用掩模执行光刻以将抗蚀剂层形成图案化的抗蚀剂,其在读取的传感器层以及分流区域上暴露左侧区域和右侧区域; 蚀刻,图案化抗蚀剂就位,以去除左右侧区域和分流区域中的材料; 并且分别在左侧区域和右侧区域以及分流区域中分别将图案化的抗蚀剂沉积在左侧和右侧的硬偏压和引线层,以形成可分离的分流器,其将左右硬偏压和引线层电耦合 一起为ESD保护。

    Method of forming an embedded read element
    4.
    发明授权
    Method of forming an embedded read element 失效
    形成嵌入式读取元素的方法

    公开(公告)号:US07062838B2

    公开(公告)日:2006-06-20

    申请号:US10666679

    申请日:2003-09-19

    IPC分类号: G11B5/187 H01F7/06

    摘要: A method of forming an embedded read element is used in the fabrication process of a magnetic head assembly including write and read heads. In this method, three photolithographic patterning steps are applied for defining the designed height of the embedded read element, defining its designed width, and connecting it with conducting layers, respectively. An in-line lapping guide is also formed with a spacing in front of the embedded read element. In this method, two mechanical lapping steps are applied, one monitored by measuring the resistance of a parallel circuit of the embedded read element and the in-line lapping guide, and the other monitored by measuring the GMR response of the embedded read element.

    摘要翻译: 在包括写入和读取头的磁头组件的制造过程中使用形成嵌入式读取元件的方法。 在该方法中,应用三个光刻图案步骤来定义嵌入式读取元件的设计高度,限定其设计宽度,并将其与导电层连接。 在嵌入式读取元件的前面还形成有间距的在线研磨引导件。 在这种方法中,应用了两个机械研磨步骤,一个通过测量嵌入式读取元件的并联电路的电阻和在线研磨导轨进行监测,另一个通过测量嵌入式读取元件的GMR响应进行监测。

    Method of making a read sensor while protecting it from electrostatic discharge (ESD) damage
    6.
    发明申请
    Method of making a read sensor while protecting it from electrostatic discharge (ESD) damage 失效
    制造读取传感器同时防止静电放电(ESD)损坏的方法

    公开(公告)号:US20050241138A1

    公开(公告)日:2005-11-03

    申请号:US10835807

    申请日:2004-04-30

    摘要: A method of making a read sensor while protecting it from electrostatic discharge (ESD) damage involves forming a severable shunt during the formation of the read sensor. The method may include forming a resist layer over a plurality of read sensor layers; performing lithography with use of a mask to form the resist layer into a patterned resist which exposes left and right side regions over the read sensor layers as well as a shunt region; etching, with the patterned resist in place, to remove materials in the left and right side regions and in the shunt region; and depositing, with the patterned resist in place, left and right hard bias and lead layers in the left and right side regions, respectively, and in the shunt region for forming a severable shunt which electrically couples the left and right hard bias and lead layers together for ESD protection.

    摘要翻译: 制造读取传感器同时防止静电放电(ESD)损坏的方法包括在形成读取的传感器期间形成可分离的分流。 该方法可以包括在多个读取传感器层上形成抗蚀剂层; 使用掩模执行光刻以将抗蚀剂层形成图案化的抗蚀剂,其在读取的传感器层以及分流区域上暴露左侧区域和右侧区域; 蚀刻,图案化抗蚀剂就位,以去除左右侧区域和分流区域中的材料; 并且分别在左侧区域和右侧区域以及分流区域中分别将图案化的抗蚀剂沉积在左侧和右侧的硬偏压和引线层,以形成可分离的分流器,其将左右硬偏压和引线层电耦合 一起为ESD保护。

    Method of providing a low-stress sensor configuration for a lithography-defined read sensor
    7.
    发明授权
    Method of providing a low-stress sensor configuration for a lithography-defined read sensor 失效
    为光刻定义的读取传感器提供低应力传感器配置的方法

    公开(公告)号:US07469465B2

    公开(公告)日:2008-12-30

    申请号:US10881581

    申请日:2004-06-30

    IPC分类号: G11B5/187

    摘要: One illustrative method of fabricating a read sensor of a magnetic head includes the steps of forming a plurality of read sensor layers on a wafer; etching the read sensor layers to form a read sensor structure with a trench in front of the read sensor structure; forming a highly porous material within the trench; and slicing the wafer and lapping the sliced wafer through the highly porous material until an air bearing surface (ABS) of the magnetic head is reached. Advantageously, the highly porous material in front of the read sensor structure reduces mechanical stress on the read sensor during the lapping process. This reduces the likelihood that the amplitude of the read sensor will be degraded or set in a “flipped” or reversed orientation, as well as reduces the likelihood that electrostatic discharge (ESD) damage to the read sensor will occur.

    摘要翻译: 一种制造磁头的读取传感器的说明性方法包括以下步骤:在晶片上形成多个读取传感器层; 蚀刻读取的传感器层以形成读取的传感器结构,其中在传感器结构的前面具有沟槽; 在沟槽内形成高度多孔的材料; 并切片晶片并通过高度多孔材料研磨切片的晶片,直到达到磁头的空气轴承表面(ABS)。 有利地,在读取传感器结构前面的高度多孔材料在研磨过程中减小了读取传感器上的机械应力。 这降低了读取传感器的幅度将被降级或设置为“翻转”或反向取向的可能性,并且降低了对读取传感器的静电放电(ESD)损坏将发生的可能性。

    SYSTEM, METHOD AND APPARATUS FOR PATTERN CLEAN-UP DURING FABRICATION OF PATTERNED MEDIA USING FORCED ASSEMBLY OF MOLECULES
    9.
    发明申请
    SYSTEM, METHOD AND APPARATUS FOR PATTERN CLEAN-UP DURING FABRICATION OF PATTERNED MEDIA USING FORCED ASSEMBLY OF MOLECULES 失效
    系统,方法和设备在使用强制组装分子的图形化介质中进行图案清洁

    公开(公告)号:US20120091096A1

    公开(公告)日:2012-04-19

    申请号:US13333109

    申请日:2011-12-21

    IPC分类号: B05D3/14

    摘要: A pattern clean-up for fabrication of patterned media using a forced assembly of molecules is disclosed. E-beam lithography is initially used to write the initial patterned bit media structures, which have size and positioning errors. Nano-sized protein molecules are then forced to assemble of on top of the bits. The protein molecules have a very uniform size distribution and assemble into a lattice structure above the e-beam patterned areas. The protein molecules reduce the size and position errors in e-beam patterned structures. This process cleans the signal from the e-beam lithography and lowers the noise in the magnetic reading and writing. This process may be used to fabricate patterned bit media directly on hard disk, or to create a nano-imprint master for mass production of patterned bit media disks.

    摘要翻译: 公开了使用分子的强制组装制造图案化介质的图案清理。 电子束光刻最初用于写入具有尺寸和定位误差的初始图案化的位介质结构。 然后将纳米级蛋白质分子强制装配在顶部的位上。 蛋白质分子具有非常均匀的尺寸分布并且组装成电子束图案区域上方的晶格结构。 蛋白质分子减小电子束图案结构中的尺寸和位置误差。 该过程清除电子束光刻中的信号,并降低磁读取和写入中的噪声。 该过程可用于直接在硬盘上制造图案化的位介质,或者用于创建用于批量生产图案化位媒体盘的纳米压印母版。

    Method of predicting plate lapping properties to improve slider fabrication yield
    10.
    发明授权
    Method of predicting plate lapping properties to improve slider fabrication yield 失效
    预测板研磨性能以提高滑块制造产量的方法

    公开(公告)号:US06939200B2

    公开(公告)日:2005-09-06

    申请号:US10663606

    申请日:2003-09-16

    IPC分类号: B24B49/00 B24B51/00 B49D1/00

    CPC分类号: B24B51/00 B24B49/00

    摘要: A method of predicting the lapping property of a charged lapping plate uses samples with a known lap surface. The samples are lapped on the plate and a non-invasive sensor is used to determine the lapping rate under a fixed load and rotation speed. The total frictional force of the samples is measured during the lapping to calculate the friction and Preston coefficients of the plate. The samples are held in place while the plate rotates and the sensor measures the distance to the plate. The plate rotates for a specific time so that adequate removal of the pad material has occurred. The lapping rate is determined from a change in the gap distance over a time interval. The lapping rate and friction are then assessed to determine if the plate is lapping worthy.

    摘要翻译: 预测充电研磨板的研磨性能的方法使用具有已知搭接表面的样品。 将样品在板上重叠,并使用非侵入式传感器来确定在固定载荷和转速下的研磨速率。 在研磨期间测量样品的总摩擦力,以计算板的摩擦系数和Preston系数。 样品在板旋转时保持就位,传感器测量到板的距离。 板旋转特定时间,以便发生垫材料的充分移除。 研磨速度由间隔时间间隔的变化确定。 然后评估研磨速率和摩擦力以确定板材是否正在研磨。