Method of providing a low-stress sensor configuration for a lithographically-defined read sensor
    1.
    发明申请
    Method of providing a low-stress sensor configuration for a lithographically-defined read sensor 失效
    为光刻定义的读取传感器提供低应力传感器配置的方法

    公开(公告)号:US20060000079A1

    公开(公告)日:2006-01-05

    申请号:US10881581

    申请日:2004-06-30

    IPC分类号: G11B5/127 H04R31/00

    摘要: One illustrative method of fabricating a read sensor of a magnetic head includes the steps of forming a plurality of read sensor layers on a wafer; etching the read sensor layers to form a read sensor structure with a trench in front of the read sensor structure; forming a highly porous material within the trench; and slicing the wafer and lapping the sliced wafer through the highly porous material until an air bearing surface (ABS) of the magnetic head is reached. Advantageously, the highly porous material in front of the read sensor structure reduces mechanical stress on the read sensor during the lapping process. This reduces the likelihood that the amplitude of the read sensor will be degraded or set in a “flipped” or reversed orientation, as well as reduces the likelihood that electrostatic discharge (ESD) damage to the read sensor will occur.

    摘要翻译: 一种制造磁头的读取传感器的说明性方法包括以下步骤:在晶片上形成多个读取传感器层; 蚀刻读取的传感器层以形成读取的传感器结构,其中在传感器结构的前面具有沟槽; 在沟槽内形成高度多孔的材料; 并切片晶片并通过高度多孔材料研磨切片的晶片,直到达到磁头的空气轴承表面(ABS)。 有利地,在读取传感器结构前面的高度多孔材料在研磨过程中减小了读取传感器上的机械应力。 这降低了读取传感器的幅度将被降级或设置为“翻转”或反向取向的可能性,并且降低了对读取传感器的静电放电(ESD)损坏将发生的可能性。

    Method of forming an embedded read element
    2.
    发明申请
    Method of forming an embedded read element 失效
    形成嵌入式读取元素的方法

    公开(公告)号:US20050063103A1

    公开(公告)日:2005-03-24

    申请号:US10666679

    申请日:2003-09-19

    摘要: A method of forming an embedded read element is used in the fabrication process of a magnetic head assembly including write and read heads. In this method, three photolithographic patterning steps are applied for defining the designed height of the embedded read element, defining its designed width, and connecting it with conducting layers, respectively. An in-line lapping guide is also formed with a spacing in front of the embedded read element. In this method, two mechanical lapping steps are applied, one monitored by measuring the resistance of a parallel circuit of the embedded read element and the in-line lapping guide, and the other monitored by measuring the GMR response of the embedded read element.

    摘要翻译: 在包括写入和读取头的磁头组件的制造过程中使用形成嵌入式读取元件的方法。 在该方法中,应用三个光刻图案步骤来定义嵌入式读取元件的设计高度,限定其设计宽度,并将其与导电层连接。 在嵌入式读取元件的前面还形成有间距的在线研磨引导件。 在这种方法中,应用了两个机械研磨步骤,一个通过测量嵌入式读取元件的并联电路的电阻和在线研磨导轨进行监测,另一个通过测量嵌入式读取元件的GMR响应进行监测。

    Method of making a read sensor while protecting it from electrostatic discharge (ESD) damage
    3.
    发明申请
    Method of making a read sensor while protecting it from electrostatic discharge (ESD) damage 失效
    制造读取传感器同时防止静电放电(ESD)损坏的方法

    公开(公告)号:US20050241138A1

    公开(公告)日:2005-11-03

    申请号:US10835807

    申请日:2004-04-30

    摘要: A method of making a read sensor while protecting it from electrostatic discharge (ESD) damage involves forming a severable shunt during the formation of the read sensor. The method may include forming a resist layer over a plurality of read sensor layers; performing lithography with use of a mask to form the resist layer into a patterned resist which exposes left and right side regions over the read sensor layers as well as a shunt region; etching, with the patterned resist in place, to remove materials in the left and right side regions and in the shunt region; and depositing, with the patterned resist in place, left and right hard bias and lead layers in the left and right side regions, respectively, and in the shunt region for forming a severable shunt which electrically couples the left and right hard bias and lead layers together for ESD protection.

    摘要翻译: 制造读取传感器同时防止静电放电(ESD)损坏的方法包括在形成读取的传感器期间形成可分离的分流。 该方法可以包括在多个读取传感器层上形成抗蚀剂层; 使用掩模执行光刻以将抗蚀剂层形成图案化的抗蚀剂,其在读取的传感器层以及分流区域上暴露左侧区域和右侧区域; 蚀刻,图案化抗蚀剂就位,以去除左右侧区域和分流区域中的材料; 并且分别在左侧区域和右侧区域以及分流区域中分别将图案化的抗蚀剂沉积在左侧和右侧的硬偏压和引线层,以形成可分离的分流器,其将左右硬偏压和引线层电耦合 一起为ESD保护。

    Method of forming an embedded read element
    4.
    发明授权
    Method of forming an embedded read element 失效
    形成嵌入式读取元素的方法

    公开(公告)号:US07062838B2

    公开(公告)日:2006-06-20

    申请号:US10666679

    申请日:2003-09-19

    IPC分类号: G11B5/187 H01F7/06

    摘要: A method of forming an embedded read element is used in the fabrication process of a magnetic head assembly including write and read heads. In this method, three photolithographic patterning steps are applied for defining the designed height of the embedded read element, defining its designed width, and connecting it with conducting layers, respectively. An in-line lapping guide is also formed with a spacing in front of the embedded read element. In this method, two mechanical lapping steps are applied, one monitored by measuring the resistance of a parallel circuit of the embedded read element and the in-line lapping guide, and the other monitored by measuring the GMR response of the embedded read element.

    摘要翻译: 在包括写入和读取头的磁头组件的制造过程中使用形成嵌入式读取元件的方法。 在该方法中,应用三个光刻图案步骤来定义嵌入式读取元件的设计高度,限定其设计宽度,并将其与导电层连接。 在嵌入式读取元件的前面还形成有间距的在线研磨引导件。 在这种方法中,应用了两个机械研磨步骤,一个通过测量嵌入式读取元件的并联电路的电阻和在线研磨导轨进行监测,另一个通过测量嵌入式读取元件的GMR响应进行监测。

    Method of providing a low-stress sensor configuration for a lithography-defined read sensor
    5.
    发明授权
    Method of providing a low-stress sensor configuration for a lithography-defined read sensor 失效
    为光刻定义的读取传感器提供低应力传感器配置的方法

    公开(公告)号:US07469465B2

    公开(公告)日:2008-12-30

    申请号:US10881581

    申请日:2004-06-30

    IPC分类号: G11B5/187

    摘要: One illustrative method of fabricating a read sensor of a magnetic head includes the steps of forming a plurality of read sensor layers on a wafer; etching the read sensor layers to form a read sensor structure with a trench in front of the read sensor structure; forming a highly porous material within the trench; and slicing the wafer and lapping the sliced wafer through the highly porous material until an air bearing surface (ABS) of the magnetic head is reached. Advantageously, the highly porous material in front of the read sensor structure reduces mechanical stress on the read sensor during the lapping process. This reduces the likelihood that the amplitude of the read sensor will be degraded or set in a “flipped” or reversed orientation, as well as reduces the likelihood that electrostatic discharge (ESD) damage to the read sensor will occur.

    摘要翻译: 一种制造磁头的读取传感器的说明性方法包括以下步骤:在晶片上形成多个读取传感器层; 蚀刻读取的传感器层以形成读取的传感器结构,其中在传感器结构的前面具有沟槽; 在沟槽内形成高度多孔的材料; 并切片晶片并通过高度多孔材料研磨切片的晶片,直到达到磁头的空气轴承表面(ABS)。 有利地,在读取传感器结构前面的高度多孔材料在研磨过程中减小了读取传感器上的机械应力。 这降低了读取传感器的幅度将被降级或设置为“翻转”或反向取向的可能性,并且降低了对读取传感器的静电放电(ESD)损坏将发生的可能性。

    Method of making a read sensor while protecting it from electrostatic discharge (ESD) damage
    6.
    发明授权
    Method of making a read sensor while protecting it from electrostatic discharge (ESD) damage 失效
    制造读取传感器同时防止静电放电(ESD)损坏的方法

    公开(公告)号:US07291279B2

    公开(公告)日:2007-11-06

    申请号:US10835807

    申请日:2004-04-30

    摘要: A method of making a read sensor while protecting it from electrostatic discharge (ESD) damage involves forming a severable shunt during the formation of the read sensor. The method may include forming a resist layer over a plurality of read sensor layers; performing lithography with use of a mask to form the resist layer into a patterned resist which exposes left and right side regions over the read sensor layers as well as a shunt region; etching, with the patterned resist in place, to remove materials in the left and right side regions and in the shunt region; and depositing, with the patterned resist in place, left and right hard bias and lead layers in the left and right side regions, respectively, and in the shunt region for forming a severable shunt which electrically couples the left and right hard bias and lead layers together for ESD protection.

    摘要翻译: 制造读取传感器同时防止静电放电(ESD)损坏的方法包括在形成读取的传感器期间形成可分离的分流。 该方法可以包括在多个读取传感器层上形成抗蚀剂层; 使用掩模执行光刻以将抗蚀剂层形成图案化的抗蚀剂,其在读取的传感器层以及分流区域上暴露左侧区域和右侧区域; 蚀刻,图案化抗蚀剂就位,以去除左右侧区域和分流区域中的材料; 并且分别在左侧区域和右侧区域以及分流区域中分别将图案化的抗蚀剂沉积在左侧和右侧的硬偏压和引线层,以形成可分离的分流器,其将左右硬偏压和引线层电耦合 一起为ESD保护。