专利检索 ap:("Michael F. Mattes" OR "Paul F. Gerrish" OR "Anna J. Malin" OR "Tyler J. Mueller" OR "Geoffrey DeWitt Batchelder" OR "Clark B. Norgaard" OR "Michael A. Schugt" OR "Ralph Danzl" OR "Richard J. O'Brien") AND inv:"Paul F. Gerrish" 第 1 页

1.

发明授权
Medical device encapsulated within bonded dies 有权
标题翻译：封装在粘合模具内的医疗器械

公开(公告)号：US08172760B2

公开(公告)日：2012-05-08

申请号：US12487369

申请日：2009-06-18

申请人： Michael F. Mattes , Paul F. Gerrish , Anna J. Malin , Tyler J. Mueller , Geoffrey DeWitt Batchelder , Clark B. Norgaard , Michael A. Schugt , Ralph Danzl , Richard J. O'Brien

发明人： Michael F. Mattes , Paul F. Gerrish , Anna J. Malin , Tyler J. Mueller , Geoffrey DeWitt Batchelder , Clark B. Norgaard , Michael A. Schugt , Ralph Danzl , Richard J. O'Brien

IPC分类号： A61N1/00

CPC分类号： A61N1/375 , A61N1/3758

摘要： An implantable medical system includes a first die substrate with a first outer surface. The system also includes a second die substrate with a second outer surface. Furthermore, the system includes a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate. The first and second die substrates are fixed to each other and substantially hermetically sealed to each other. Also, the medical device is substantially encapsulated between the first and second die substrates. The first portion is electrically connected to the second portion. Moreover, the first and second outer surfaces of the first and second die substrates are directly exposed to a biological material.

摘要翻译： 可植入医疗系统包括具有第一外表面的第一模具衬底。该系统还包括具有第二外表面的第二管芯衬底。此外，该系统包括具有安装到第一管芯衬底的第一部分和安装到第二管芯衬底的第二部分的医疗器件。第一和第二管芯基板彼此固定并基本上彼此密封。此外，医疗装置基本上封装在第一和第二管芯基板之间。第一部分电连接到第二部分。此外，第一和第二管芯基板的第一和第二外表面直接暴露于生物材料。

2.

发明申请
MEDICAL DEVICE ENCAPSULATED WITHIN BONDED DIES 有权
标题翻译：医疗器械在粘合剂中包封

公开(公告)号：US20100324614A1

公开(公告)日：2010-12-23

申请号：US12487369

申请日：2009-06-18

申请人： Michael F. Mattes , Paul F. Gerrish , Anna J. Malin , Tyler J. Mueller , Geoffrey DeWitt Batchelder , Clark B. Norgaard , Michael A. Schugt , Ralph Danzl , Richard J. O'Brien

发明人： Michael F. Mattes , Paul F. Gerrish , Anna J. Malin , Tyler J. Mueller , Geoffrey DeWitt Batchelder , Clark B. Norgaard , Michael A. Schugt , Ralph Danzl , Richard J. O'Brien

IPC分类号： A61N1/365 , A61B5/03 , A61B5/0215 , A61N1/39

CPC分类号： A61N1/375 , A61N1/3758

摘要： An implantable medical system includes a first die substrate with a first outer surface. The system also includes a second die substrate with a second outer surface. Furthermore, the system includes a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate. The first and second die substrates are fixed to each other and substantially hermetically sealed to each other. Also, the medical device is substantially encapsulated between the first and second die substrates. The first portion is electrically connected to the second portion. Moreover, the first and second outer surfaces of the first and second die substrates are directly exposed to a biological material.

摘要翻译： 可植入医疗系统包括具有第一外表面的第一模具衬底。该系统还包括具有第二外表面的第二管芯衬底。此外，该系统包括具有安装到第一管芯衬底的第一部分和安装到第二管芯衬底的第二部分的医疗器件。第一和第二管芯基板彼此固定并基本上彼此密封。此外，医疗装置基本上封装在第一和第二管芯基板之间。第一部分电连接到第二部分。此外，第一和第二管芯基板的第一和第二外表面直接暴露于生物材料。

3.

发明授权
Apparatus for restricting moisture ingress 有权
标题翻译：用于限制水分进入的装置

公开(公告)号：US08263436B2

公开(公告)日：2012-09-11

申请号：US13302725

申请日：2011-11-22

申请人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes

发明人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes

IPC分类号： H01L21/00

CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00

摘要： Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.

摘要翻译： 保护电路免受水分侵入的装置和方法，例如使用金属结构作为湿气入口屏障的一部分。

4.

发明申请
HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS 审中-公开
标题翻译：密封电气电路设备

公开(公告)号：US20100314149A1

公开(公告)日：2010-12-16

申请号：US12569431

申请日：2009-09-29

申请人： Paul F. Gerrish , Geoffrey Batchelder , Andreas Armin Fenner , Lary R. Larson , Anna J. Malin , Michael F. Mattes , Tyler Mueller , David A. Ruben , Larry E. Tyler

发明人： Paul F. Gerrish , Geoffrey Batchelder , Andreas Armin Fenner , Lary R. Larson , Anna J. Malin , Michael F. Mattes , Tyler Mueller , David A. Ruben , Larry E. Tyler

IPC分类号： H05K5/06

CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/80895 , H01L2224/80896 , H01L2224/80986 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00

摘要： Hermetically-sealed electrical circuit apparatus and methods for constructing such apparatus using one or more seal portions.

摘要翻译： 气密密封电路装置和使用一个或多个密封部分构造这种装置的方法。

5.

发明申请
APPARATUS FOR RESTRICTING MOISTURE INGRESS 有权
标题翻译：限制水分摄入的设备

公开(公告)号：US20120064670A1

公开(公告)日：2012-03-15

申请号：US13302725

申请日：2011-11-22

申请人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes

发明人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes

IPC分类号： H01L21/52

CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00

摘要： Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.

摘要翻译： 保护电路免受水分侵入的装置和方法，例如使用金属结构作为湿气入口屏障的一部分。

6.

发明授权
Faraday cage for circuitry using substrates 有权
标题翻译：法拉第笼用于使用基板的电路

公开(公告)号：US08125058B2

公开(公告)日：2012-02-28

申请号：US12569525

申请日：2009-09-29

申请人： Tyler Mueller , Larry E. Tyler , Geoffrey Batchelder , Paul F. Gerrish , Michael F. Mattes , Anna J. Malin

发明人： Tyler Mueller , Larry E. Tyler , Geoffrey Batchelder , Paul F. Gerrish , Michael F. Mattes , Anna J. Malin

IPC分类号： H01L23/552

CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00

摘要： An apparatus and method uses a first Faraday cage portion and a second Faraday cage portion to provide a Faraday cage enclosure surrounding at least one circuit device. For example, the first Faraday cage portion may include a first conductive portion of a Faraday cage enclosure surrounding the at least one circuit device, and a second Faraday cage portion may include a second conductive portion of the Faraday cage enclosure surrounding the at least one circuit device. Further, for example, the first Faraday cage portion may include a connection surface having one or more conductive contact portions terminating the first conductive portion of the Faraday cage enclosure the second Faraday cage portion may include a connection surface having one or more conductive contact portions terminating the second conductive portion of the Faraday cage enclosure. An electrical connection may be provided between the conductive contact portions of the first and second Faraday cage portions.

摘要翻译： 一种装置和方法使用第一法拉第笼部分和第二法拉第笼部分来提供围绕至少一个电路装置的法拉第笼壳。例如，第一法拉第笼部分可以包括围绕至少一个电路装置的法拉第笼壳体的第一导电部分，并且第二法拉第笼部分可以包括围绕至少一个电路的法拉第笼壳体的第二导电部分设备。此外，例如，第一法拉第笼部分可以包括具有端接法拉第笼壳体的第一导电部分的一个或多个导电接触部分的连接表面，第二法拉第笼部分可以包括具有一个或多个导电接触部分终止的连接表面法拉第笼壳的第二个导电部分。可以在第一和第二法拉第笼部分的导电接触部分之间提供电连接。