Method for selectively removing coatings from metal substrates
    9.
    发明授权
    Method for selectively removing coatings from metal substrates 有权
    从金属基材上选择性去除涂层的方法

    公开(公告)号:US08021491B2

    公开(公告)日:2011-09-20

    申请号:US12484704

    申请日:2009-06-15

    IPC分类号: C23G1/02

    摘要: A method for selectively removing an aluminum-poor overlay coating from a substrate of a component, which as a result of its low aluminum content is highly resistant to a selective stripping solution. The method entails diffusing aluminum into the overlay coating to form an aluminum-infused overlay coating having an increased aluminum level in at least an outer surface thereof. The diffusion step is carried out so that the increased aluminum level is sufficient to render the aluminum-infused overlay coating removable by selective stripping. The outer surface of the aluminum-infused overlay coating is then contacted with an aqueous composition to remove the aluminum-infused overlay coating from the substrate. The aqueous composition includes at least one acid having the formula HxAF6, and/or precursors thereof, wherein A is Si, Ge, Ti, Zr, Al, and/or Ga, and x is from 1 to 6.

    摘要翻译: 由于其低铝含量的结果,从组分的底物中选择性地除去不含铝的覆盖涂层的方法对选择性剥离溶液具有高度的抗性。 该方法需要将铝扩散到覆盖涂层中以形成在至少其外表面中具有增加的铝水平的铝浸渍覆盖涂层。 进行扩散步骤,使得增加的铝水平足以使铝浸渍的覆盖涂层通过选择性剥离而除去。 然后将铝浸渍的覆盖涂层的外表面与含水组合物接触以从基底去除铝浸渍的覆盖涂层。 含水组合物包括至少一种具有式H xAF 6的酸和/或其前体,其中A是Si,Ge,Ti,Zr,Al和/或Ga,x是1至6。

    SEALING OF PINHOLES IN ELECTROLESS METAL COATINGS
    10.
    发明申请
    SEALING OF PINHOLES IN ELECTROLESS METAL COATINGS 审中-公开
    在电镀金属涂层中密封胶体

    公开(公告)号:US20110027576A1

    公开(公告)日:2011-02-03

    申请号:US12510677

    申请日:2009-07-28

    IPC分类号: B32B3/26 B05D3/12

    摘要: The present invention provides a method for sealing pinholes in an electroless metal coating, said method comprising: (a) coating a substrate with an electroless metal coating layer to provide a coated article comprising an electroless metal coating in contact with the surface of the substrate, said electroless metal coating being characterized by the presence of pinhole imperfections which allow fluid communication between the substrate and the environment; (b) applying a layer of a curable epoxy sealant over the electroless metal coating layer and filling the pinhole imperfections; (c) curing the curable epoxy sealant to provide a cured epoxy overcoating layer; and (d) removing a substantial portion of the cured epoxy overcoating layer to provide an article comprising an electroless metal coating which is substantially free of pinhole imperfections allowing fluid communication between the substrate and the environment.

    摘要翻译: 本发明提供了一种密封无电金属涂层中的针孔的方法,所述方法包括:(a)用无电金属涂层涂覆基底,以提供包括与基底表面接触的无电金属涂层的涂覆制品, 所述无电金属涂层的特征在于存在允许衬底和环境之间的流体连通的针孔缺陷; (b)在无电金属涂层上涂一层可固化环氧密封胶并填充针孔缺陷; (c)固化可固化环氧密封剂以提供固化的环氧树脂涂层; 和(d)去除大部分固化的环氧树脂外涂层以提供包含无电金属涂层的制品,其基本上没有针孔缺陷,从而允许衬底和环境之间的流体连通。