Process for removing a layer
    2.
    发明申请
    Process for removing a layer 审中-公开
    去除层的过程

    公开(公告)号:US20070170150A1

    公开(公告)日:2007-07-26

    申请号:US10587702

    申请日:2005-01-17

    IPC分类号: C23G1/00 B44C1/22 C23F1/00

    CPC分类号: B08B7/00 C23G1/00 C23G5/00

    摘要: Components comprising corrosion products are often reused, in which case the corrosion product has to be removed. According to the prior art, this takes a very long time since the reaction times with the corrosion product are often very long. According to the invention, the corrosion product is pretreated in order to produce a larger attackable surface area, so that the corrosion product can be removed more quickly.

    摘要翻译: 包含腐蚀产物的组分通常被重复使用,在这种情况下必须除去腐蚀产物。 根据现有技术,由于与腐蚀产物的反应时间通常非常长,所以需要很长时间。 根据本发明,预处理腐蚀产物以产生更大的可发现的表面积,从而可以更快地除去腐蚀产物。

    Process for the plasma cleaning of a component
    5.
    发明授权
    Process for the plasma cleaning of a component 有权
    用于等离子体清洗组件的方法

    公开(公告)号:US07513955B2

    公开(公告)日:2009-04-07

    申请号:US10591512

    申请日:2005-02-09

    CPC分类号: B08B7/00 C23G5/00

    摘要: Cracks are conventionally difficult to clean which often leads to damage to other regions of the component for cleaning. According to the invention, a plasma cleaning method is used, whereby a pressure and/or a separation of an electrode to the component are varied, in order to achieve a plasma cleaning in the crack.

    摘要翻译: 通常难以清理裂纹,这通常会导致对组件其他区域的损坏进行清洁。 根据本发明,使用等离子体清洗方法,从而改变电极对部件的压力和/或分离,以便在裂纹中实现等离子体清洁。