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    Method for airfoil electroplating
    1.
    发明授权
    Method for airfoil electroplating 有权
    翼型电镀方法

    公开(公告)号：US07560014B2

    公开(公告)日：2009-07-14

    申请号：US12194732

    申请日：2008-08-20

    申请人： Michael Rucker ,  Bhupendra K. Gupta

    发明人： Michael Rucker ,  Bhupendra K. Gupta

    IPC分类号： C25D5/00 ,  C25D5/50

    CPC分类号： C25D17/008 ,  Y10S204/07 ,  Y10T428/12736

    摘要： A method is provided for electroplating a high temperature coating onto an airfoil. The method includes providing a shield having a recess defining one or more walls conforming to the shape of at least a portion of a pressure side and a suction side of the airfoil to be electroplated, introducing the portions of the pressure side and the suction side of the airfoil to be electroplated into the recess of the shield, attaching an anode and cathode to the airfoil, submerging at least the shield and the portions of the pressure side and the suction side of the airfoil to be electroplated into an electroplating tank containing an electrolyte, and electroplating a coating of a high temperature resistant metal onto the portions of the pressure side and the suction side of the airfoil to be electroplated to a predetermined minimum thickness.

    摘要翻译： 提供了一种将高温涂层电镀到翼型上的方法。 该方法包括提供一种屏蔽件，其具有限定一个或多个壁的凹部，所述壁符合要电镀的翼型件的压力侧和吸力侧的至少一部分的形状，将压力侧和吸力侧的部分 要电镀到屏蔽件的凹槽中的翼型件，将阳极和阴极附接到翼型件上，至少将屏蔽件淹没，将翼型的压力侧和吸力侧的部分浸入电镀槽中，该电镀槽包含电解液 并将耐高温金属的涂层电镀到要被电镀的翼型的压力侧和吸力侧的部分至预定的最小厚度。

    METHOD AND APPARATUS FOR AIRFOIL ELECTROPLATING, AND AIRFOIL
    2.
    发明申请
    METHOD AND APPARATUS FOR AIRFOIL ELECTROPLATING, AND AIRFOIL 有权
    用于气膜电镀的方法和装置，以及气翼

    公开(公告)号：US20080302667A1

    公开(公告)日：2008-12-11

    申请号：US12194732

    申请日：2008-08-20

    申请人： Michael Rucker ,  Bhupendra K. Gupta

    发明人： Michael Rucker ,  Bhupendra K. Gupta

    IPC分类号： C25D3/66

    CPC分类号： C25D17/008 ,  Y10S204/07 ,  Y10T428/12736

    摘要： A chemically-nonreactive, electrically-nonconductive shield having a recess generally corresponding to the shape of an airfoil portion to be positioned therein. The shield is submerged in an electroplating solution in a plating tank. The recess in the shield is sized to provide a predetermined, closely-spaced apart clearance gap between walls of the recess and the adjacent airfoil portion sufficient to reduce the flow rate of an electrolyte present in the electroplating solution between walls of the recess and the adjacent airfoil portion. The clearance gap permits control of the amount of electroplating that is deposited on the airfoil portion that is positioned within the recess in relation to portions of the airfoil not positioned within the recess.

    摘要翻译： 一种化学非反应性的非导电屏蔽，其具有通常对应于待定位在其中的翼型部分的形状的凹部。 屏蔽层浸没在电镀槽中的电镀溶液中。 屏蔽件中的凹部的尺寸被设计成在凹部的壁和邻近的翼型部分之间提供预定的，间隔较短的间隙，其足以减少存在于电镀溶液中的电解质在凹槽和相邻的壁之间的流速 机翼部分。 所述间隙允许控制相对于未位于凹槽内的翼型件的部分，沉积在位于凹部内的翼型部分上的电镀量。

    Chemical vapor deposition apparatus and methods of using the apparatus
    3.
    发明申请
    Chemical vapor deposition apparatus and methods of using the apparatus 审中-公开
    化学气相沉积装置及其使用方法

    公开(公告)号：US20070148367A1

    公开(公告)日：2007-06-28

    申请号：US11315710

    申请日：2005-12-22

    申请人： Daniel Lewis ,  Victor Lou ,  George Dalakos ,  Matthew Saylor ,  Scott Weaver ,  Michael Rucker

    发明人： Daniel Lewis ,  Victor Lou ,  George Dalakos ,  Matthew Saylor ,  Scott Weaver ,  Michael Rucker

    IPC分类号： H05H1/24 ,  C23C16/00

    CPC分类号： C23C16/482 ,  C23C16/4404

    摘要： A chemical vapor deposition apparatus comprises a heating element capable of emitting electromagnetic radiation; a retort positioned relative to the heating element to receive the electromagnetic radiation; an encasing member at least partially disposed around the retort, the encasing member comprising a material that is at least partially transparent to the electromagnetic radiation; a plenum defined at least in part by an inner surface of the encasing member and an outer surface of the retort; and a furnace box at least partially disposed around the encasing member and the retort, and housing the heating element.

    摘要翻译： 化学气相沉积装置包括能够发射电磁辐射的加热元件; 相对于加热元件定位的蒸馏器以接收电磁辐射; 至少部分地设置在所述蒸馏器周围的所述包装部件，所述包装部件包括对所述电磁辐射至少部分透明的材料; 至少部分地由所述包装部件的内表面和所述蒸馏器的外表面限定的增压室; 以及至少部分地围绕所述包装构件和所述蒸馏器设置的炉箱，并且容纳所述加热元件。

    NICKEL-BASE BRAZE MATERIAL AND METHOD OF FILLING HOLES THEREWITH
    6.
    发明申请
    NICKEL-BASE BRAZE MATERIAL AND METHOD OF FILLING HOLES THEREWITH 有权
    镍基烧结材料及其填充孔的方法

    公开(公告)号：US20060216540A1

    公开(公告)日：2006-09-28

    申请号：US10907218

    申请日：2005-03-24

    申请人： David Budinger ,  Richard Schmidt ,  Mark Veliz ,  Michael Rucker

    发明人： David Budinger ,  Richard Schmidt ,  Mark Veliz ,  Michael Rucker

    IPC分类号： C22C1/05 ,  B32B15/01

    CPC分类号： C22C19/058 ,  B23K35/3033 ,  C22C1/0433 ,  C22C19/057 ,  Y10T428/12063 ,  Y10T428/1209 ,  Y10T428/12181 ,  Y10T428/12944

    摘要： A nickel-base braze material suitable for closing holes in a high temperature component, such as a tip cap hole in a turbine blade. The braze material comprises first and second filler materials and a binder. The first filler material comprises particles of a first alloy, and the second filler material comprises particles of at least a second alloy having a lower melting temperature than the first alloy. The second alloy consists essentially of, by weight, about 8 to about 23 percent chromium, about 4 to about 18 percent cobalt, about 1.5 to about 6.0 percent tantalum, about 1.0 to about 6.0 percent aluminum, about 0.3 to about 1.5 percent boron, about 2.0 to about 6.0 percent silicon, up to 0.2 percent carbon, the balance being nickel and incidental impurities.

    摘要翻译： 一种镍基钎焊材料，适用于封闭高温部件中的孔，例如涡轮叶片中的尖端帽孔。 钎焊材料包括第一和第二填料和粘合剂。 第一填充材料包括第一合金的颗粒，并且第二填料材料包含具有比第一合金低的熔融温度的至少第二合金的颗粒。 第二合金基本上由重量计约8至约23％的铬，约4至约18％的钴，约1.5至约6.0％的钽，约1.0至约6.0％的铝，约0.3至约1.5％的硼， 约2.0至约6.0％的硅，至多0.2％的碳，余量为镍和附带的杂质。

    Method and apparatus for airfoil electroplating, and airfoil
    8.
    发明申请
    Method and apparatus for airfoil electroplating, and airfoil 审中-公开
    翼型电镀和翼型的方法和装置

    公开(公告)号：US20060275624A1

    公开(公告)日：2006-12-07

    申请号：US11146964

    申请日：2005-06-07

    申请人： Michael Rucker ,  Bhupendra Gupta

    发明人： Michael Rucker ,  Bhupendra Gupta

    IPC分类号： B32B19/00 ,  B32B9/00 ,  B32B15/01

    CPC分类号： C25D17/008 ,  Y10S204/07 ,  Y10T428/12736

    摘要： A chemically-nonreactive, electrically-nonconductive shield having a recess generally corresponding to the shape of an airfoil portion to be positioned therein. The shield is submerged in an electroplating solution in a plating tank. The recess in the shield is sized to provide a predetermined, closely-spaced apart clearance between walls of the recess and the adjacent airfoil portion sufficient to reduce the flow rate of an electrolyte present in the electroplating solution between walls of the recess and the adjacent airfoil portion. The clearance permits control of the amount of electroplating that is deposited on the portion of the airfoil that is positioned in the recess in relation to portions of the airfoil not positioned in the recess.

    摘要翻译： 一种化学非反应性的非导电屏蔽，其具有通常对应于待定位在其中的翼型部分的形状的凹部。 屏蔽层浸没在电镀槽中的电镀溶液中。 屏蔽件中的凹槽的尺寸被设计成在凹部的壁和相邻的翼型部分之间提供预定的，间隔较短的间隙，其足以减少存在于凹槽壁和相邻翼型之间的电镀溶液中的电解质的流速 一部分。 该间隙允许控制相对于未位于凹部中的翼型件的部分而沉积在位于凹部中的翼型部分上的电镀量。

    Apparatus and method for electroplating a workpiece
    9.
    发明申请
    Apparatus and method for electroplating a workpiece 审中-公开
    用于电镀工件的设备和方法

    公开(公告)号：US20060042932A1

    公开(公告)日：2006-03-02

    申请号：US10925649

    申请日：2004-08-25

    申请人： Mark Rosenzweig ,  Michael Rucker ,  John Evans

    发明人： Mark Rosenzweig ,  Michael Rucker ,  John Evans

    IPC分类号： B23H3/02 ,  C25D21/12

    CPC分类号： C25D7/00 ,  C25D3/50 ,  C25D5/16 ,  C25D17/12

    摘要： Apparatus for electroplating a workpiece includes a primary electroplating anode, an auxiliary electroplating anode, and a resistor. The resistor is electrically connected in series to one of the primary and auxiliary electroplating anodes. The primary and auxiliary electroplating anodes are electrically connectable in parallel to an electrolyte. A method for electroplating a workpiece includes obtaining an electrolyte, a primary electroplating anode, and an auxiliary electroplating anode. The workpiece and the primary and auxiliary electroplating anodes are positioned in contact with the electrolyte. Electric current is applied through the primary electroplating anode at a first amperage and through the auxiliary electroplating anode at a different second amperage.

    摘要翻译： 用于对工件进行电镀的设备包括初级电镀阳极，辅助电镀阳极和电阻器。 电阻器与主电镀阳极和辅助电镀阳极串联电连接。 主电镀和辅助电镀阳极可与电解液并联电连接。 电镀工件的方法包括获得电解质，初级电镀阳极和辅助电镀阳极。 工件和初级和辅助电镀阳极定位成与电解质接触。 以第一电流通过主电镀阳极施加电流，并以不同的第二电流通过辅助电镀阳极。