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公开(公告)号：US08717774B2
公开(公告)日：2014-05-06
申请号：US13292267
申请日：2011-11-09
IPC分类号： H05K7/00
CPC分类号： H01L23/50 , H01L23/642 , H01L2924/0002 , H01L2924/19103 , H01L2924/3011 , H01L2924/00
摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
摘要翻译： 描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。 插入器具有第一平面和第二平面。 上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。 提供至少一个馈电电容器。 电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。 至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。
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公开(公告)号：US20120081870A1
公开(公告)日：2012-04-05
申请号：US13292267
申请日：2011-11-09
IPC分类号： H01R12/70
CPC分类号： H01L23/50 , H01L23/642 , H01L2924/0002 , H01L2924/19103 , H01L2924/3011 , H01L2924/00
摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
摘要翻译： 描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。 插入器具有第一平面和第二平面。 上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。 提供至少一个馈电电容器。 电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。 至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。
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公开(公告)号：US20080192452A1
公开(公告)日：2008-08-14
申请号：US11705260
申请日：2007-02-12
CPC分类号： H05K1/0231 , H01L23/49827 , H01L23/50 , H01L2224/16225 , H01L2924/3011 , H05K1/141 , H05K2201/10378 , H05K2201/10704 , H05K2201/10734
摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
摘要翻译： 描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。 插入器具有第一平面和第二平面。 上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。 提供至少一个电容器。 电容器具有多个平行板，其间具有电介质。 至少一个第一外部端接件与第一组交替的平行板电接触，并且至少一个第二外部端接件与第二组交替的平行板电接触。 电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。 至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。
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公开(公告)号：US08111524B2
公开(公告)日：2012-02-07
申请号：US12526426
申请日：2008-02-12
IPC分类号： H05K3/00
CPC分类号： H05K1/0231 , H01L23/49827 , H01L23/50 , H01L2224/16225 , H01L2924/3011 , H05K1/141 , H05K2201/10378 , H05K2201/10704 , H05K2201/10734
摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
摘要翻译： 描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。 插入器具有第一平面和第二平面。 上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。 提供至少一个馈电电容器。 电容器具有多个平行板，其间具有电介质。 至少一个第一外部端接件与第一组交替的平行板电接触，并且至少一个第二外部端接件与第二组交替的平行板电接触。 电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。 至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。
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5.发明申请公开(公告)号：US20080236717A1
公开(公告)日：2008-10-02
申请号：US12116526
申请日：2008-05-07
申请人： Abhijit Gurav , Azizuddin Tajuddin , Daniel Skamser , Garry Renner , March Maguire , Michael S. Randall , Randal Vaughan
发明人： Abhijit Gurav , Azizuddin Tajuddin , Daniel Skamser , Garry Renner , March Maguire , Michael S. Randall , Randal Vaughan
IPC分类号： B29C65/00
CPC分类号： H01G4/0085 , H01G4/12 , H01G4/30 , Y10T156/10
摘要： A process for forming a multilayer ceramic capacitor. The process includes depositing a ceramic precursor on a substrate and an electrode ink in a predetermined pattern on the ceramic precursor to form a green sheet. The electrode ink has an adhesion promoter incorporated therein. The green sheet is overlayed with at least one second green sheet to form a layered green sheet which is then fused under pressure.
摘要翻译： 一种形成多层陶瓷电容器的工艺。 该方法包括将陶瓷前体沉积在基底上，并在陶瓷前体上以预定图案沉积电极墨以形成生片。 电极油墨具有并入其中的粘合促进剂。 生片与至少一个第二生片重叠以形成分层的生片，然后在压力下熔融。
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公开(公告)号：US07280342B1
公开(公告)日：2007-10-09
申请号：US11639796
申请日：2006-12-15
申请人： Michael S. Randall , Allen Hill , Peter Blais , Garry Renner , Randal Vaughan , Azizuddin Tajuddin
发明人： Michael S. Randall , Allen Hill , Peter Blais , Garry Renner , Randal Vaughan , Azizuddin Tajuddin
摘要： A low inductance multi-layer capacitor. The capacitor comprises interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate comprises two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.
摘要翻译： 低电感多层电容器。 电容器包括交错并联的内部电极板，其间具有电介质。 每个内部电极板包括两个引出片，并且通常为T形。 第一外部电极端子电连接到偶数内部电极板的引出接线片，第二外部电极端子电连接到奇数内部电极板的引出接线片。 外部电极端子位于电容器的公共第一外表面和公共相对的第二外表面上。
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公开(公告)号：US20070165361A1
公开(公告)日：2007-07-19
申请号：US11639796
申请日：2006-12-15
申请人： Michael S. Randall , Allen Hill , Peter Blais , Garry Renner , Randal Vaughan , Azizuddin Tajuddin
发明人： Michael S. Randall , Allen Hill , Peter Blais , Garry Renner , Randal Vaughan , Azizuddin Tajuddin
IPC分类号： H01G4/228
摘要： A low inductance multi-layer capacitor. The capacitor comprises interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate comprises two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.
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公开(公告)号：US20090046411A1
公开(公告)日：2009-02-19
申请号：US12257532
申请日：2008-10-24
申请人： Michael S. Randall , Corey Antoniades , Daniel E. Barber , Xilin Xu , James Beeson , Pascal Pinceloup , Abhijit Gurav , Thomas Poole , Azizuddin Tajuddin , Ian Burn
发明人： Michael S. Randall , Corey Antoniades , Daniel E. Barber , Xilin Xu , James Beeson , Pascal Pinceloup , Abhijit Gurav , Thomas Poole , Azizuddin Tajuddin , Ian Burn
IPC分类号： H01G4/258
CPC分类号： C04B35/49 , C04B35/64 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3217 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/3239 , C04B2235/3241 , C04B2235/3244 , C04B2235/3251 , C04B2235/3256 , C04B2235/3258 , C04B2235/3262 , C04B2235/3267 , C04B2235/3275 , C04B2235/3281 , C04B2235/3286 , C04B2235/3287 , C04B2235/3409 , C04B2235/3418 , C04B2235/5445 , C04B2235/6025 , C04B2235/656 , C04B2235/6584 , C04B2235/663 , H01G4/1209 , H01G4/1227 , H01G4/30
摘要： A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula: {[(CaO)t(SrO)1-t]m[(ZrO2)v(TiO2)1-v]}1-s-xAsEx wherein: A is a transition metal oxide; E is an oxide of an element selected from the group consisting of Ge, Si, Ga and combinations thereof; m is 0.98 to 1.02; t is 0.50 to 0.90; v is 0.8 to 1.0; s and x are selected from the group consisting of: a) 0≦x≦0.08, 0.0001≦s≦0.043 and x≧1.86s; and b) 0≦x≦0.0533, 0.0001≦s≦0.08 and x≦0.667s.
摘要翻译： 一种具有下列组成的多层陶瓷电容器中的介电陶瓷组合物：<？in-line-formula description =“In-line Formulas”end =“lead”？> {[（CaO）t（SrO）1-t] m [（ZrO 2）v（TiO 2）1-v]} 1-s-x AsEx <？in-line-formula description =“In-line Formulas”end =“tail”？>其中：A是过渡金属氧化物; E是选自Ge，Si，Ga及其组合的元素的氧化物; m为0.98〜1.02; t为0.50〜0.90; v为0.8〜1.0; s和x选自：a）0 <= x <= 0.08,0 0.0001 <= s <= 0.043和x> = 1.86s; 和b）0 <= x <= 0.0533，0.0001 <= s <= 0.08和x <= 0.667s。
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公开(公告)号：US08414962B2
公开(公告)日：2013-04-09
申请号：US11262524
申请日：2005-10-28
申请人： Susan Trolier McKinstry , Clive A. Randall , Hajime Nagata , Pascal I. Pinceloup , James J. Beeson , Daniel J. Skamser , Michael S. Randall , Azizuddin Tajuddin
发明人： Susan Trolier McKinstry , Clive A. Randall , Hajime Nagata , Pascal I. Pinceloup , James J. Beeson , Daniel J. Skamser , Michael S. Randall , Azizuddin Tajuddin
IPC分类号： B05D5/12
CPC分类号： H01G4/33 , H01G4/1227 , H01G4/306
摘要： The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 μm or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.
摘要翻译： 本发明涉及薄膜单层，电子部件如利用薄膜层的多层电容器及其制造方法。 公开了介电层和电极层的化学溶液沉积和微接触印刷。 高介电常数BaTiO3多层薄膜电容器通过微接触印刷和化学溶液沉积在Ni箔基板上制备。 制备具有BaTiO3电介质层和LaNiO3内部电极的多层电容器，使电介质层的厚度为1μm以下。 使用介电层和电极层的前体溶液的微接触印刷。
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公开(公告)号：US20080239621A1
公开(公告)日：2008-10-02
申请号：US11729688
申请日：2007-03-29
CPC分类号： H01G4/232 , H01G2/06 , H01G4/248 , H01G4/30 , H05K3/3426 , H05K2201/10946 , Y02P70/613 , Y10T29/53174
摘要： A capacitor with a multiplicity of first plates and second plates in parallel relationship wherein the first plates terminate at a first face and the second plates terminate at a second face. A dielectric is between the first plates and the second plates. A first external termination is in electrical contact with the first plates and a second external termination is in electrical contact with the second plates. A first lead terminal is in electrical contact with the first external termination and the first lead terminal has a first foot below the first external termination and a first solder stop coated on the first foot between the first foot and the first external termination. A second lead terminal is in electrical contact with the second external termination wherein the second lead terminal comprises a second foot below the second external termination and a second solder stop is coated on the second foot between the second foot and the second external termination.
摘要翻译： 一种具有多个第一板和第二板的并联关系的电容器，其中第一板终止于第一面，而第二板在第二面终止。 电介质位于第一板和第二板之间。 第一外部端接件与第一板电接触，第二外部端接件与第二板电接触。 第一引线端子与第一外部端子电接触，并且第一引线端子具有位于第一外部端子下方的第一脚和在第一脚和第一外部端子之间涂覆在第一脚上的第一焊料停止。 第二引线端子与第二外部端子电接触，其中第二引线端子包括在第二外部端子下方的第二脚，并且在第二脚和第二外部端子之间的第二脚上涂覆第二焊料停止。
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