EROSION RATE MONITORING FOR WAFER FABRICATION EQUIPMENT

    公开(公告)号:US20240030006A1

    公开(公告)日:2024-01-25

    申请号:US17872835

    申请日:2022-07-25

    CPC classification number: H01J37/32642 H01J37/347 H01J37/32715

    Abstract: Methods, systems, and apparatuses for erosion rate monitoring for wafer fabrication equipment are described to support determining a real-time edge ring erosion rate for an edge ring used in manufacturing memory devices or other semiconductor devices. A manufacturing system may support a real-time edge ring erosion rate determination using force sensors, which may measure the weight of the edge ring. The controller may correlate the measured weight to a height of the edge ring. The controller may use the height to adjust a vertical placement of the edge ring, or one or more other manufacturing variables, during manufacturing operations, which may compensate for edge ring erosion and reduce or eliminate yield loss when manufacturing a memory device or other semiconductor device.

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