公开(公告)号：US20190148314A1

公开(公告)日：2019-05-16

申请号：US16138003

申请日：2018-09-21

Applicant: Micron Technology, Inc.

Inventor： James E. Davis ,  Kevin G. Duesman ,  Jeffrey P. Wright ,  Warren L. Boyer

IPC: H01L23/60 ,  H01L23/538 ,  H01L23/00 ,  H01L25/04

CPC classification number: H01L23/60 ,  G11C5/02 ,  G11C5/025 ,  H01L23/538 ,  H01L24/02 ,  H01L24/10 ,  H01L24/95 ,  H01L25/043 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements, and a plated pad electrically coupling at least a part of the first contact pad to at least a part of the second contact pad. The substrate includes a substrate contact electrically coupled to the plated pad on the die.

公开(公告)号：US20190273052A1

公开(公告)日：2019-09-05

申请号：US16416210

申请日：2019-05-18

Applicant: Micron Technology, Inc.

Inventor： James E. Davis ,  Kevin G. Duesman ,  Jeffrey P. Wright ,  Warren L. Boyer

IPC: H01L23/60 ,  H01L23/00 ,  H01L23/538 ,  H01L25/04

Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements, and a plated pad electrically coupling at least a part of the first contact pad to at least a part of the second contact pad. The substrate includes a substrate contact electrically coupled to the plated pad on the die.

公开(公告)号：US10283462B1

公开(公告)日：2019-05-07

申请号：US15811579

申请日：2017-11-13

Applicant: Micron Technology, Inc.

Inventor： James E. Davis ,  Kevin G. Duesman ,  Jeffrey P. Wright ,  Warren L. Boyer

IPC: H01L23/60 ,  H01L23/00 ,  H01L25/04 ,  H01L23/538

Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements, and a plated pad electrically coupling at least a part of the first contact pad to at least a part of the second contact pad. The substrate includes a substrate contact electrically coupled to the plated pad on the die.

公开(公告)号：US20200035650A1

公开(公告)日：2020-01-30

申请号：US16590595

申请日：2019-10-02

Applicant: Micron Technology, Inc.

Inventor： Kevin G. Duesman ,  James E. Davis ,  Warren L. Boyer

IPC: H01L25/065 ,  H01L27/02 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate, the die including a first contact pad electrically coupled to a first circuit on the die including an active circuit element, a first TSV electrically coupling the first contact pad to a first backside contact pad, and a second contact pad electrically coupled to a second circuit including only passive circuit elements. The substrate includes a substrate contact electrically coupled to the first and second contact pads. The assembly can further include a second die including a third contact pad electrically coupled to a third circuit including a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad, but electrically disconnected from the fourth contact pad.

公开(公告)号：US10483241B1

公开(公告)日：2019-11-19

申请号：US16020792

申请日：2018-06-27

Applicant: Micron Technology, Inc.

Inventor： Kevin G. Duesman ,  James E. Davis ,  Warren L. Boyer

IPC: H01L25/065 ,  H01L23/00 ,  H01L27/02 ,  H01L25/00 ,  H01L23/498 ,  H01L23/60 ,  H01L23/48 ,  H01L23/538 ,  H01L23/482

Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate, the die including a first contact pad electrically coupled to a first circuit on the die including an active circuit element, a first TSV electrically coupling the first contact pad to a first backside contact pad, and a second contact pad electrically coupled to a second circuit including only passive circuit elements. The substrate includes a substrate contact electrically coupled to the first and second contact pads. The assembly can further include a second die including a third contact pad electrically coupled to a third circuit including a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad, but electrically disconnected from the fourth contact pad.

公开(公告)号：US11056467B2

公开(公告)日：2021-07-06

申请号：US16590595

申请日：2019-10-02

Applicant: Micron Technology, Inc.

Inventor： Kevin G. Duesman ,  James E. Davis ,  Warren L. Boyer

IPC: H01L25/065 ,  H01L23/00 ,  H01L27/02 ,  H01L25/00 ,  H01L23/498 ,  H01L23/60 ,  H01L23/48 ,  H01L23/538 ,  H01L23/482

Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate, the die including a first contact pad electrically coupled to a first circuit on the die including an active circuit element, a first TSV electrically coupling the first contact pad to a first backside contact pad, and a second contact pad electrically coupled to a second circuit including only passive circuit elements. The substrate includes a substrate contact electrically coupled to the first and second contact pads. The assembly can further include a second die including a third contact pad electrically coupled to a third circuit including a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad, but electrically disconnected from the fourth contact pad.

公开(公告)号：US10811372B2

公开(公告)日：2020-10-20

申请号：US16416210

申请日：2019-05-18

Applicant: Micron Technology, Inc.

Inventor： James E. Davis ,  Kevin G. Duesman ,  Jeffrey P. Wright ,  Warren L. Boyer

IPC: H01L23/60 ,  H01L23/00 ,  H01L23/538 ,  H01L25/04 ,  G11C5/02 ,  H01L25/065

Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements, and a plated pad electrically coupling at least a part of the first contact pad to at least a part of the second contact pad. The substrate includes a substrate contact electrically coupled to the plated pad on the die.

公开(公告)号：US20200212032A1

公开(公告)日：2020-07-02

申请号：US16234208

申请日：2018-12-27

Applicant: Micron Technology, Inc.

Inventor： Kevin G. Duesman ,  James E. Davis ,  Warren L. Boyer ,  Jeffrey P. Wright

IPC: H01L27/02 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to the first contact pad, and the substrate is electrically isolated from the second contact pad.

公开(公告)号：US10403585B2

公开(公告)日：2019-09-03

申请号：US16138003

申请日：2018-09-21

Applicant: Micron Technology, Inc.

Inventor： James E. Davis ,  Kevin G. Duesman ,  Jeffrey P. Wright ,  Warren L. Boyer

IPC: H01L23/60 ,  H01L23/538 ,  H01L25/04 ,  H01L23/00 ,  G11C5/02 ,  H01L25/065

Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements, and a plated pad electrically coupling at least a part of the first contact pad to at least a part of the second contact pad. The substrate includes a substrate contact electrically coupled to the plated pad on the die.