摘要:
In a semiconductor memory device selectively implementing one of a 4K refresh cycle and a 8K refresh cycle, the positions of externally applied address signal bits are switched internally by address switching circuits such that memory cells at the same positions are selected regardless of whether the 4K refresh cycle or the 8K refresh cycle is specified according to a refresh cycle mode specify signal. As a result, by testing the device in one refresh cycle mode, the device can be checked in both refresh cycle operations, reducing the test time and making the test easier.
摘要:
In a semiconductor memory device selectively implementing one of a 4K refresh cycle and a 8K refresh cycle, the positions of externally applied address signal bits are switched internally by address switching circuits such that memory cells at the same positions are selected regardless of whether the 4K refresh cycle or the 8K refresh cycle is specified according to a refresh cycle mode specify signal. As a result, by testing the device in one refresh cycle mode, the device can be checked in both refresh cycle operations, reducing the test time and making the test easier.
摘要:
A semiconductor memory device includes a first test row decoder (9a) for selecting memory cells in normal rows in a test mode, a second test row decoder (9b) for selecting spare memory cell rows, a first test column decoder (10a) for selecting memory cells in normal columns, and a second test column decoder (10b) for selecting spare memory cell columns. A control circuit (11) may perform switching between four combinations of the row and column decoders by using a control signal (SRT) and a control signal (SCT). All spare memory cells are tested prior to reparation of a defective memory cell for yield enhancement.
摘要:
A semiconductor memory device includes a first test row decoder (9a) for selecting memory cells in normal rows in a test mode, a second test row decoder (9b) for selecting spare memory cell rows, a first test column decoder (10a) for selecting memory cells in normal columns, and a second test column decoder (10b) for selecting spare memory cell columns. A control circuit (11) may perform switching between four combinations of the row and column decoders by using a control signal (SRT) and a control signal (SCT). All spare memory cells are tested prior to reparation of a defective memory cell for yield enhancement.
摘要:
A semiconductor memory device includes a first test row decoder (9a) for selecting memory cells in normal rows in a test mode, a second test row decoder (9b) for selecting spare memory cell rows, a first test column decoder (10a) for selecting memory cells in normal columns, and a second test column decoder (10b) for selecting spare memory cell columns. A control circuit (11) may perform switching between four combinations of the row and column decoders by using a control signal (SRT) and a control signal (SCT). All spare memory cells are tested prior to reparation of a defective memory cell for yield enhancement.
摘要:
In a semiconductor memory device, a self refresh cycle program circuit is provided and a refresh operation is conducted in accordance with one of the refresh cycles programmed in the refresh-cycle program circuit. The refresh cycle of the self-refresh mode is selected from a plurality of refresh-cycle types. A plurality of refresh modes allows a refresh cycle to be selected from a plurality of refresh-cycle types in accordance with a selected refresh mode.
摘要:
Read drivers which are provided in correspondence to simultaneously selected plural bits of memory cells are wired-OR connected to internal read data buses which in turn are provided in correspondence to a plurality of memory cell arrays respectively. A test mode circuit is provided for the internal read data buses for detecting coincidence/incoincidence of logics of signal potentials on these internal read data bus lines. In a test operation, all read drivers are activated to read selected memory cell data on the corresponding internal read data bus lines.
摘要:
A semiconductor memory device includes a first test row decoder (9a) for selecting memory cells in normal rows in a test mode, a second test row decoder (9b) for selecting spare memory cell rows, a first test column decoder (10a) for selecting memory cells in normal columns, and a second test column decoder (10b) for selecting spare memory cell columns. A control circuit (11) may perform switching between four combinations of the row and column decoders by using a control signal (SRT) and a control signal (SCT). All spare memory cells are tested prior to reparation of a defective memory cell for yield enhancement.
摘要:
In the semiconductor memory device in accordance with the present invention, when test mode is entered at WCbR+super V.sub.IH +address key timing, the test mode is terminated only at the WCbR+super V.sub.IH +address key timing. Therefore, when refresh is to be started in the test mode, erroneous entrance to another test mode can be prevented, ensuring highly reliable testing. Further, since it is not necessary to take into account the special condition to enter the refreshing operation in the test mode, formation of a test pattern is facilitated.
摘要:
Read drivers which are provided in correspondence to simultaneously selected plural bits of memory cells are wired-OR connected to internal read data buses which in turn are provided in correspondence to a plurality of memory cell arrays respectively. A test mode circuit is provided for the internal read data buses for detecting coincidence/incoincidence of logics of signal potentials on these internal read data bus lines. In a test operation, all read drivers are activated to read selected memory cell data on the corresponding internal read data bus lines.