公开(公告)号：US5118567A

公开(公告)日：1992-06-02

申请号：US380548

申请日：1989-07-14

申请人： Mikio Komiyama ,  Yasunao Miyazawa ,  Kazuyoshi Ebe ,  Takanori Saito

发明人： Mikio Komiyama ,  Yasunao Miyazawa ,  Kazuyoshi Ebe ,  Takanori Saito

IPC分类号： C08F2/50 ,  C09J4/00 ,  C09J4/06 ,  C09J5/00 ,  C09J5/06 ,  C09J7/00 ,  C09J7/02 ,  H01L21/302 ,  H01L21/52 ,  H01L21/58 ,  H01L21/68

CPC分类号： H01L21/6835 ,  C09J4/06 ,  C09J7/00 ,  C09J7/0239 ,  H01L21/302 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10T156/1062 ,  Y10T428/2809 ,  Y10T428/287 ,  Y10T428/2891

摘要： An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

公开(公告)号：US5356949A

公开(公告)日：1994-10-18

申请号：US837117

申请日：1992-02-21

申请人： Mikio Komiyama ,  Yasunao Miyazawa ,  Kazuyoshi Ebe ,  Takanori Saito

发明人： Mikio Komiyama ,  Yasunao Miyazawa ,  Kazuyoshi Ebe ,  Takanori Saito

IPC分类号： C08F2/50 ,  C09J4/00 ,  C09J4/06 ,  C09J5/00 ,  C09J5/06 ,  C09J7/00 ,  C09J7/02 ,  H01L21/302 ,  H01L21/52 ,  H01L21/58 ,  H01L21/68 ,  C09J163/02 ,  C09J133/06

CPC分类号： H01L21/6835 ,  C09J4/06 ,  C09J7/00 ,  C09J7/0239 ,  H01L21/302 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10T156/1062 ,  Y10T428/2809 ,  Y10T428/287 ,  Y10T428/2891

摘要： An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable latent curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

摘要翻译： 一种胶带，包括表面张力不大于40达因/厘米的能量束透射性基片和形成在基片的一个表面上的粘合剂层，所述粘合层包含（甲基）丙烯酸酯聚合物，环氧树脂， 可光聚合的低分子量化合物，用于环氧树脂的可热活化的潜在性固化剂和用于可光聚合的低分子量化合物的光聚合引发剂。 粘合剂层中的粘合剂可用能量束固化，并且如此固化的粘合剂在加热时再次发生粘性。 当胶带用于处理半导体晶片时，其用作在切割步骤期间将晶片保持在适当位置的切割胶带。 通过加热而附着在每个芯片上并且能够被加热的每块切割和固化的粘合剂层提供了在芯片接合步骤中将芯片牢固地安装在引线框架上所需的粘合剂。

公开(公告)号：US5110388A

公开(公告)日：1992-05-05

申请号：US653232

申请日：1991-02-08

申请人： Mikio Komiyama ,  Yasunao Miyazawa ,  Kazuyoshi Ebe ,  Takanori Saito

发明人： Mikio Komiyama ,  Yasunao Miyazawa ,  Kazuyoshi Ebe ,  Takanori Saito

IPC分类号： C08F2/50 ,  C09J4/00 ,  C09J4/06 ,  C09J5/00 ,  C09J5/06 ,  C09J7/00 ,  C09J7/02 ,  H01L21/302 ,  H01L21/52 ,  H01L21/58 ,  H01L21/68

CPC分类号： H01L21/6835 ,  C09J4/06 ,  C09J7/00 ,  C09J7/0239 ,  H01L21/302 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10T156/1062 ,  Y10T428/2809 ,  Y10T428/287 ,  Y10T428/2891

摘要： An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

公开(公告)号：US6139953A

公开(公告)日：2000-10-31

申请号：US815950

申请日：1997-03-13

申请人： Kouichi Nagamoto ,  Mikio Komiyama ,  Kazuyoshi Ebe

发明人： Kouichi Nagamoto ,  Mikio Komiyama ,  Kazuyoshi Ebe

IPC分类号： B23Q3/08 ,  B24B37/04 ,  B24B37/30 ,  B28D7/04 ,  C08F299/06 ,  C08J5/18 ,  C09J4/00 ,  C09J7/02 ,  C09J175/14 ,  H01L21/301 ,  H01L21/304 ,  H01L21/67

CPC分类号： H01L21/6836 ,  C09J7/0282 ,  C09J2203/326 ,  C09J2475/006 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2861 ,  Y10T428/31551 ,  Y10T428/31576

摘要： A base material has a radiation-cured material prepared by curing a mixture of urethane acrylate oligomer and reactive dilute monomer, and also it shows a breaking elongation of more than 10%, preferably of more than 100%. The base material is used as a base sheet of an adhesive tape where an adhesive layer is formed on the base sheet. Accordingly, the novel base material and its manufacturing method in addition to an adhesive tape having such base material are provided. Furthermore, the adhesive tape has a flat surface without any fish-eye that causes the troubles of cracking, chip-scattering, and so on in the steps of back-grinding and dicing of the semiconductor wafer, and also the adhesive tape can be processed so as to have a predetermined thickness with high accuracy, compared with that of the conventional one.

摘要翻译： 基材具有通过固化聚氨酯丙烯酸酯低聚物和活性稀释单体的混合物制备的辐射固化材料，并且其显示出超过10％，优选大于100％的断裂伸长率。 基材用作在基片上形成粘合剂层的胶带的基片。 因此，除了具有这种基材的胶带之外，还提供了新颖的基材及其制造方法。 此外，粘合带在半导体晶片的背面研磨和切割的步骤中具有没有任何鱼眼的平坦表面，导致破裂，碎片散射等问题，并且还可以处理胶带 与现有技术相比具有高精度的预定厚度。

公开(公告)号：US20100311226A1

公开(公告)日：2010-12-09

申请号：US12446117

申请日：2007-10-12

申请人： Akie Hamasaki ,  Shino Moritani ,  Mikio Komiyama

发明人： Akie Hamasaki ,  Shino Moritani ,  Mikio Komiyama

IPC分类号： H01L21/78 ,  B32B3/02 ,  C09J7/02

CPC分类号： H01L21/67132

摘要： A die-sorting sheet includes a pressure-sensitive adhesive layer exposed on an outer periphery of the carrier sheet, and a base film exposed on a central area that is inside the outer periphery. A method for transporting a chip having an adhesive layer according to the present invention includes the steps of: providing the above die-sorting sheet that is fixed with a frame through the pressure-sensitive adhesive layer on the outer periphery; temporarily attaching a picked up chip through an adhesive layer thereof onto the base film exposed on the die-sorting sheet; and transporting the die-sorting sheet to a subsequent step while the chip is temporarily attached on the sheet through the adhesive layer.

摘要翻译： 分模片包括暴露在载体片的外周上的压敏粘合剂层和暴露在外周的中心区域上的基膜。 根据本发明的用于输送具有粘合剂层的芯片的方法包括以下步骤：通过外周上的压敏粘合剂层提供固定有框架的上述模片分类片; 将拾取的芯片通过其粘合剂层临时附接到暴露在模片分类片材上的基底膜上; 并且在芯片通过粘合剂层临时固定在片材上的同时将模片分类片材输送到随后的步骤。

公开(公告)号：US08587130B2

公开(公告)日：2013-11-19

申请号：US12446117

申请日：2007-10-12

申请人： Akie Hamasaki ,  Shino Moritani ,  Mikio Komiyama

发明人： Akie Hamasaki ,  Shino Moritani ,  Mikio Komiyama

IPC分类号： H01L21/78 ,  B32B3/02 ,  C09J7/02

CPC分类号： H01L21/67132

摘要： A die-sorting sheet includes a pressure-sensitive adhesive layer exposed on an outer periphery of the carrier sheet, and a base film exposed on a central area that is inside the outer periphery. A method for transporting a chip having an adhesive layer includes the steps of: providing the above die-sorting sheet that is fixed with a frame through the pressure-sensitive adhesive layer on the outer periphery; temporarily attaching a picked up chip through an adhesive layer thereof onto the base film exposed on the die-sorting sheet; and transporting the die-sorting sheet to a subsequent step while the chip is temporarily attached on the sheet through the adhesive layer.

摘要翻译： 分模片包括暴露在载体片的外周上的压敏粘合剂层和暴露在外周的中心区域上的基膜。 用于输送具有粘合剂层的芯片的方法包括以下步骤：通过外周上的压敏粘合剂层提供固定有框架的上述模片分类片; 将拾取的芯片通过其粘合剂层临时附接到暴露在模片分类片材上的基底膜上; 并且在芯片通过粘合剂层临时固定在片材上的同时将模片分类片材输送到随后的步骤。

公开(公告)号：US5691038A

公开(公告)日：1997-11-25

申请号：US361362

申请日：1994-12-21

申请人： Akira Hirata ,  Mikio Komiyama ,  Katsuhisa Taguchi ,  Takanori Saitoh

发明人： Akira Hirata ,  Mikio Komiyama ,  Katsuhisa Taguchi ,  Takanori Saitoh

IPC分类号： C09J7/02 ,  H05K13/00 ,  B32B7/12

CPC分类号： C09J7/02 ,  H05K13/0084 ,  C09J2201/28 ,  Y10T428/24793 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2891

摘要： The present invention provides a cover tape comprising a tapelike base material 1, adhesive parts 2 formed on one side of the base material 1 at both edges along the longitudinal direction thereof, and a nonadhesive resin part 3 formed between the adhesive parts 2 and having substantially the same thickness as that of the adhesive parts 2. This cover tape is used to collectively pack chips and other small items while keeping them separate from each other to thereby permit the storage, transportation and automatic takeout thereof, which cover tape can be rendered very long. Further, the present invention provides a coating applicator suitable for use in the production of the above cover tape.

摘要翻译： 本发明提供一种覆盖带，其包括带状基材1，在基材1的沿着其纵向的两个边缘的一侧上形成的粘合剂部分2和形成在粘合剂部分2之间并具有基本上 与粘合部件2的厚度相同。该盖带用于在保持彼此分离的同时将芯片和其他小物品集中包装，从而允许其保存，运输和自动取出，从而可以使覆盖带非常 长。 此外，本发明提供一种适用于生产上述盖带的涂布器。